| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/11/2007 | CN1310321C Distribution-containing structure and forming method thereof |
| 04/11/2007 | CN1310320C Flexible interconnection device, fingerprint transducing device and manufacturing method thereof |
| 04/11/2007 | CN1310319C Heat transmission device and method for production thereof |
| 04/11/2007 | CN1310318C Thermal fin structure |
| 04/11/2007 | CN1310317C Electronic device having cooling mechanism |
| 04/11/2007 | CN1310316C Mixed integrated circuit apparatus |
| 04/11/2007 | CN1310313C Method for design of semconductor device, and semiconductor device |
| 04/11/2007 | CN1310308C Fill pattern generation for spin-on glass and related self-planarization deposition |
| 04/11/2007 | CN1310305C Method of preventing shift of alignment marks during rapid thermal processing |
| 04/11/2007 | CN1310304C Semiconductor device and its manufacturing method |
| 04/11/2007 | CN1310289C Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 04/11/2007 | CN1310241C Voice coding method and decoding method, and voice transmission method |
| 04/11/2007 | CN1310240C Voice coding method and decoding method, and voice transmission method |
| 04/11/2007 | CN1310067C Base board and its producing method, base board for photoelectric device, photoelectric device and electronic device |
| 04/11/2007 | CN1310008C Heat transfer device and electronic equipment |
| 04/11/2007 | CN1309962C Radiating fan structure |
| 04/10/2007 | US7203101 Semiconductor memory device and defect remedying method thereof |
| 04/10/2007 | US7203075 Screen mask |
| 04/10/2007 | US7203072 Heat dissipating structure and semiconductor package with the same |
| 04/10/2007 | US7203071 Component mounting circuit board with resin-molded section covering circuit pattern and inner components |
| 04/10/2007 | US7203066 Heat sink assembly incorporating spring clip |
| 04/10/2007 | US7203064 Heat exchanger with cooling channels having varying geometry |
| 04/10/2007 | US7202770 Voltage variable material for direct application and devices employing same |
| 04/10/2007 | US7202679 Contactor having conductive particles in a hole as a contact electrode |
| 04/10/2007 | US7202677 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
| 04/10/2007 | US7202648 Fully integrated DC-to-DC regulator utilizing on-chip inductors with high frequency magnetic materials |
| 04/10/2007 | US7202571 Electronic module with form in-place pedestal |
| 04/10/2007 | US7202570 dielectric films sued as supports for electronics, bonded using epoxy resins, allowing for high density mounting, high speed transmission and stress relieving; packaging; miniaturization |
| 04/10/2007 | US7202569 Semiconductor device and manufacturing method of the same |
| 04/10/2007 | US7202568 Semiconductor passivation deposition process for interfacial adhesion |
| 04/10/2007 | US7202567 Semiconductor device and manufacturing method for the same |
| 04/10/2007 | US7202566 Crossed power strapped layout for full CMOS circuit design |
| 04/10/2007 | US7202565 Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the same |
| 04/10/2007 | US7202564 Advanced low dielectric constant organosilicon plasma chemical vapor deposition films |
| 04/10/2007 | US7202563 Semiconductor device package having a semiconductor element with resin |
| 04/10/2007 | US7202562 Integrated circuit cooling system and method |
| 04/10/2007 | US7202561 Semiconductor package with heat dissipating structure and method of manufacturing the same |
| 04/10/2007 | US7202560 Wafer bonding of micro-electro mechanical systems to active circuitry |
| 04/10/2007 | US7202559 Method of assembling a ball grid array package with patterned stiffener layer |
| 04/10/2007 | US7202558 Packages base which allows mounting of a semiconductor element and electrode-wiring terminals on a mounting surface |
| 04/10/2007 | US7202557 Co-packaged control circuit, transistor and inverted diode |
| 04/10/2007 | US7202556 Semiconductor package having substrate with multi-layer metal bumps |
| 04/10/2007 | US7202555 Pitch change and chip scale stacking system and method |
| 04/10/2007 | US7202554 Semiconductor package and its manufacturing method |
| 04/10/2007 | US7202553 Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging |
| 04/10/2007 | US7202552 MEMS package using flexible substrates, and method thereof |
| 04/10/2007 | US7202551 Display device having underlying insulating film and insulating films |
| 04/10/2007 | US7202550 Integrated stress relief pattern and registration structure |
| 04/10/2007 | US7202546 Integrated circuit with copper interconnect and top level bonding/interconnect layer |
| 04/10/2007 | US7202545 Memory module and method for operating a memory module |
| 04/10/2007 | US7202542 Semiconductor structure with metal migration semiconductor barrier layers and method of forming the same |
| 04/10/2007 | US7202541 Apparatus and method for transverse characterization of materials |
| 04/10/2007 | US7202537 Versatile system for limiting electric field degradation of semiconductor structures |
| 04/10/2007 | US7202533 Thin film resistors integrated at a single metal interconnect level of die |
| 04/10/2007 | US7202532 Integrated circuit |
| 04/10/2007 | US7202531 Semiconductor device |
| 04/10/2007 | US7202469 Solid-state imaging device with molded resin ribs and method of manufacturing |
| 04/10/2007 | US7202460 Camera module for compact electronic equipments |
| 04/10/2007 | US7202421 Electronic elements, method for manufacturing electronic elements, circuit substrates, method for manufacturing circuit substrates, electronic devices and method for manufacturing electronic devices |
| 04/10/2007 | US7202420 Methods to prevent mechanical flexure related BGA failure |
| 04/10/2007 | US7202359 Azaoxa heterocyclic compound and method of preparing the same |
| 04/10/2007 | US7202304 Anhydride polymers for use as curing agents in epoxy resin-based underfill material |
| 04/10/2007 | US7202184 Method for fabricating semiconductor device |
| 04/10/2007 | US7202172 Microelectronic device having disposable spacer |
| 04/10/2007 | US7202167 Method of forming a diffusion barrier |
| 04/10/2007 | US7202162 Atomic layer deposition tantalum nitride layer to improve adhesion between a copper structure and overlying materials |
| 04/10/2007 | US7202161 Substrate processing method and apparatus |
| 04/10/2007 | US7202159 Diffusion barriers comprising a self-assembled monolayer |
| 04/10/2007 | US7202154 Suspension for filling via holes in silicon and method for making the same |
| 04/10/2007 | US7202151 Method for fabricating a semiconductor device having a metallic silicide layer |
| 04/10/2007 | US7202126 Semiconductor device and method of manufacturing same |
| 04/10/2007 | US7202112 Micro lead frame packages and methods of manufacturing the same |
| 04/10/2007 | US7202111 Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device |
| 04/10/2007 | US7202108 Semiconductor wafer, semiconductor chip and method for manufacturing the same |
| 04/10/2007 | US7202107 Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method |
| 04/10/2007 | US7202106 Multi-chip semiconductor connector and method |
| 04/10/2007 | US7202105 Multi-chip semiconductor connector assembly method |
| 04/10/2007 | US7202101 Multi-metal layer MEMS structure and process for making the same |
| 04/10/2007 | US7202094 Process for locating, displaying, analyzing, and optionally monitoring potential transient defect sites in one or more integrated circuit chips of a semiconductor substrate |
| 04/10/2007 | US7201784 Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectrics |
| 04/10/2007 | US7201304 Electroconductive alloy of tin and lead; first fluxing agent reacting with oxide of metal to promote melting of metal at first temperature; second fluxing agent having higher melting temperature; resolidification; rosin or resin binder |
| 04/10/2007 | US7201214 Remedies to prevent cracking in a liquid system |
| 04/10/2007 | US7201012 Remedies to prevent cracking in a liquid system |
| 04/10/2007 | US7200934 Electronic assemblies with high capacity heat sinks and methods of manufacture |
| 04/10/2007 | US7200930 Probe for semiconductor devices |
| 04/10/2007 | US7200920 Method for the implementation of electronic components in via-holes of a multi-layer multi-chip module |
| 04/05/2007 | WO2007038791A2 Adaptive user profiling on mobile devices |
| 04/05/2007 | WO2007038645A2 Electrostatic protection systems and methods |
| 04/05/2007 | WO2007038396A1 Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby |
| 04/05/2007 | WO2007038098A2 Leadframes for improved moisture reliability of semiconductor devices |
| 04/05/2007 | WO2007037500A1 Epoxy resin composition and semiconductor device |
| 04/05/2007 | WO2007037458A1 Package and electronic device |
| 04/05/2007 | WO2007037365A1 Optical module |
| 04/05/2007 | WO2007037358A1 Organic el display and method for manufacturing same |
| 04/05/2007 | WO2007037306A1 Heat sink module and process for producing the same |
| 04/05/2007 | WO2007037221A1 Functional element package and process for producing the same |
| 04/05/2007 | WO2007037190A1 Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board |
| 04/05/2007 | WO2007037106A1 Method for manufacturing integrated circuit device having three-dimensional multilayer structure |
| 04/05/2007 | WO2007037086A1 Substrate with built-in component and method for manufacturing such substrate |
| 04/05/2007 | WO2007037055A1 Semiconductor package, substrate, electronic device using such semiconductor package or substrate, and method for correcting warping of semiconductor package |