| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/12/2007 | US20070080429 Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement |
| 04/12/2007 | US20070080428 Semiconductor film composition |
| 04/12/2007 | US20070080427 Semiconductor device |
| 04/12/2007 | US20070080422 Semiconductor component with PN junction |
| 04/12/2007 | US20070080418 Wafer-level chip-scale package of image sensor and method of manufacturing the same |
| 04/12/2007 | US20070080404 Semiconductor device |
| 04/12/2007 | US20070080403 Low trigger voltage electrostatic discharge protection device |
| 04/12/2007 | US20070080378 Ultraviolet Blocking Layer |
| 04/12/2007 | US20070080377 Display device and method of manufacturing the same |
| 04/12/2007 | US20070080357 Optical device package structure |
| 04/12/2007 | US20070080347 Test pattern of CMOS image sensor and method of measuring process management using the same |
| 04/12/2007 | US20070080329 Electrically conductive paste and multilayer ceramic substrate |
| 04/12/2007 | DE19611240B4 Leitfähige Paste auf Silberbasis sowie deren Verwendung als Leiter auf Keramischen Leiterplatten The conductive paste of silver-based, as well as their use as conductors on ceramic circuit boards |
| 04/12/2007 | DE112005001067T5 Elektronikteil und Verfahren zu dessen Herstellung Electronics module and method for its production |
| 04/12/2007 | DE10336657B4 Verbundwerkstoff, insbesondere für Wärmetauscher, Wärmeleiter und Wärmespeicher Composite material, in particular for heat exchangers, heat conductor and the heat storage |
| 04/12/2007 | DE102006044369A1 Verfahren zum Herstellen eines Substrates mit einem Hohlraum A method of manufacturing a substrate with a cavity |
| 04/12/2007 | DE102006044368A1 Verfahren zum Herstellen eines Substrates mit einem Hohlraum A method of manufacturing a substrate with a cavity |
| 04/12/2007 | DE102006038374A1 Verfahren zur Bildung einer Justiermarke und einer Elementisolationsstruktur für ein Halbleiterbauelement A method of forming an alignment mark and an element isolation structure for a semiconductor device |
| 04/12/2007 | DE102006035030A1 Verfahren zum Kleben eines Schutzbandes eines Wafers und Klebevorrichtung A method of bonding a protecting tape and a wafer bonding apparatus |
| 04/12/2007 | DE102005055280B3 Connecting elements for semiconductor components have mushroom shape with first metal area filling out indentations on top of insulating layer and with second metal area on containing refractory inter-metallic phases of metals of solder |
| 04/12/2007 | DE102005051414B3 Semiconductor component with wiring substrate and solder balls and production processes has central plastic mass and lower film template for lower solder ball arrangement |
| 04/12/2007 | DE102005048363A1 Method for protection of delicate nano-structures from scratching, e.g. for silicon wafers, involves application of spin-on-glass in several discrete steps |
| 04/12/2007 | DE102005048361A1 Method for passivating the surface of semiconductor silicon circuits and discrete components involves locally exposing surface of silicon and producing primary needle-like silicon structures by reactive ion etching |
| 04/12/2007 | DE102005047566A1 Herstellungsverfahren und Anordnung mit einem Leistungshalbleiterbauelement und mit einem Gehäuse Production method and arrangement with a power semiconductor device and having a housing |
| 04/12/2007 | DE102005047000A1 Halbleiterstruktur zur Ableitung eines Überspannungsimpulses und Verfahren zur Herstellung desselben A semiconductor structure for deriving an overvoltage pulse and method of manufacturing the same |
| 04/12/2007 | DE102005046737A1 Bauteil mit Chip-Durchkontakten Component with chip vias |
| 04/12/2007 | DE102005046134A1 Electronic component group used in hardware architecture comprises electronic components connected in series so that input connections of one component are connected to output connections of another component |
| 04/12/2007 | DE102005044001B3 Laminiertes Substrat für die Montage von elektronischen Bauteilen Laminated substrate for mounting electronic components |
| 04/12/2007 | DE102005004108B4 Halbleiterschaltung sowie Anordnung und Verfahren zur Kontrolle von Schmelzelementen einer Halbleiterschaltung Semiconductor circuit as well as arrangement and method for controlling melting elements of a semiconductor circuit |
| 04/11/2007 | EP1773105A2 Multilayer printed circuit board |
| 04/11/2007 | EP1772962A1 Surface acoustic wave device and fabrication method therefor |
| 04/11/2007 | EP1772904A2 Package for high frequency waves containing high frequency electronic circuit |
| 04/11/2007 | EP1772903A2 Heat sink with multiple coolant inlets |
| 04/11/2007 | EP1772902A1 Power semiconductor modul with intermediate isolating layer und method of manufacturing |
| 04/11/2007 | EP1772900A2 Apparatus with at least one power semiconductor device and fabrication process of a power semiconductor device including a pressure sintering step |
| 04/11/2007 | EP1771881A1 Electronic module arrangement and corresponding production method |
| 04/11/2007 | EP1771880A1 Electronic device comprising an integrated circuit and a capacitance element |
| 04/11/2007 | EP1771879A1 Semiconductor element with a passivation layer and method for production thereof |
| 04/11/2007 | EP1620879A4 Dc-dc converter implemented in a land grid array package |
| 04/11/2007 | EP1543588A4 Interconnection system |
| 04/11/2007 | EP1436815A4 Semiconductor memory cell and memory array using a breakdown phenomena in an ultra-thin dielectric |
| 04/11/2007 | EP1212927B1 A printed circuit board assembly |
| 04/11/2007 | EP1168439B1 Gold bond wire for a semiconductor device |
| 04/11/2007 | EP0720232B1 Multi-chip module |
| 04/11/2007 | CN2888809Y Improvement of radiating device |
| 04/11/2007 | CN2888808Y Shared radiating device |
| 04/11/2007 | CN2888806Y Radiating device |
| 04/11/2007 | CN2888650Y Porcelain rectifying bridge |
| 04/11/2007 | CN2888649Y Device composed of multi surface-mounted wafers |
| 04/11/2007 | CN2888648Y Radiating structure of memory wafer |
| 04/11/2007 | CN2888647Y Fin structure of radiator |
| 04/11/2007 | CN2888646Y Protection cover |
| 04/11/2007 | CN1947480A Packaging method of electronic component |
| 04/11/2007 | CN1947267A Semiconductor chip for driving light emitting element, light emitting device and lighting equipment |
| 04/11/2007 | CN1947262A LDMOS transistor and manufacture method thereof |
| 04/11/2007 | CN1947248A Treatment of service layer of a multi-layer structure and its device |
| 04/11/2007 | CN1947247A Universal interconnect die |
| 04/11/2007 | CN1947246A Semiconductor device with a protected active die region and method therefor |
| 04/11/2007 | CN1947245A 半导体结构 The semiconductor structure |
| 04/11/2007 | CN1947234A Method for forming suspended transmission line structures in back end of line processing |
| 04/11/2007 | CN1947231A 半导体器件 Semiconductor devices |
| 04/11/2007 | CN1947230A Method for forming a gate electrode having a metal |
| 04/11/2007 | CN1946795A Dual-stage wafer applied underfills |
| 04/11/2007 | CN1946277A High efficiency heat radiator without fan |
| 04/11/2007 | CN1946276A Pulse heat pipe radiator for electronic cooling |
| 04/11/2007 | CN1946273A Heat radiator lock and heat radiator combination using said lock |
| 04/11/2007 | CN1945947A Rectifier layout ctructure of locomotive large element heat tube radiation |
| 04/11/2007 | CN1945848A 显示面板 Display panel |
| 04/11/2007 | CN1945842A TFT LCD array substrate structure and its producing method |
| 04/11/2007 | CN1945840A TFT LCD array substrate structure and its producing method |
| 04/11/2007 | CN1945839A TFT LCD array substrate peripheral wiring structure and its producing method |
| 04/11/2007 | CN1945838A TET LCD array substrate structure and its producing method |
| 04/11/2007 | CN1945830A Standard cell, semiconductor integrated circuit and its designing method, device and standard cell base |
| 04/11/2007 | CN1945828A Method for producing stacked wafer |
| 04/11/2007 | CN1945827A Semiconductor apparatus |
| 04/11/2007 | CN1945826A Interconnection having dual-level or multi-level capping layer and method of forming the same |
| 04/11/2007 | CN1945825A Semiconductor device and method of fabricating the same |
| 04/11/2007 | CN1945824A Semiconductor device having improved metal wiring |
| 04/11/2007 | CN1945823A Conductor track arrangement and associated production method |
| 04/11/2007 | CN1945822A Semiconductor device, semiconductor module and semiconductor module method for producing |
| 04/11/2007 | CN1945821A Semiconductor device and semiconductor device production method |
| 04/11/2007 | CN1945820A Semiconductor device packaging substrate and semiconductor device packaging structure |
| 04/11/2007 | CN1945819A Package board, semiconductor package, and fabricating method thereof |
| 04/11/2007 | CN1945818A Double layer lead wire package structure and its producing method |
| 04/11/2007 | CN1945817A A semiconductor device and a method of manufacturing the same |
| 04/11/2007 | CN1945816A Semiconductor apparatus and method thereof |
| 04/11/2007 | CN1945815A Power electronic power device module |
| 04/11/2007 | CN1945814A Heat radiator fin and circular heat tube radiator |
| 04/11/2007 | CN1945806A Method of manufacturing electronic circuit device |
| 04/11/2007 | CN1945805A Semiconductor packaging process and carrier for semiconductor package |
| 04/11/2007 | CN1945804A Method of forming a molded array package device having an exposed tab and structure |
| 04/11/2007 | CN1945802A Method, circuit board and tool for improving welding spot reliability of ball grating array package device |
| 04/11/2007 | CN1944499A Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producin |
| 04/11/2007 | CN1944236A Semiconductor device, method for manufacturing the same and method for inspecting the same |
| 04/11/2007 | CN1310432C Voice coding, decoding and transmission method |
| 04/11/2007 | CN1310376C 模块和电子装置 Module and electronic apparatus |
| 04/11/2007 | CN1310325C MOS device and electrostatic discharge protection circuit |
| 04/11/2007 | CN1310324C Channel limited silicon-germanium static discharge diode network |
| 04/11/2007 | CN1310323C Semiconductor device |
| 04/11/2007 | CN1310322C Layer insulated film and its forming method and polymer composition |