| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/17/2007 | US7205600 Capacitor constructions with a barrier layer to threshold voltage shift inducing material |
| 04/17/2007 | US7205588 Metal fuse for semiconductor devices |
| 04/17/2007 | US7205574 Optical semiconductor device |
| 04/17/2007 | US7205567 Semiconductor product having a semiconductor substrate and a test structure and method |
| 04/17/2007 | US7205566 Transistor-level signal cutting method and structure |
| 04/17/2007 | US7205486 Thermally isolated via structure |
| 04/17/2007 | US7205482 Tape carrier for TAB |
| 04/17/2007 | US7205254 Rare earth titanate dielectric component that may also contain Li, Ca and'or Sr, which after being fired, shows the presence of a main phase having a perovskite structure and an acicular phase containing a rare-earth element; may also contain a bismuth glass |
| 04/17/2007 | US7205253 Obtained by firing a mixture of a bismuth glass component and a rare earth titanate dielectric component that may also contain Li, Ca and'or Sr, which can be sintered even at a low temperature of 1,000 degrees C. or below |
| 04/17/2007 | US7205246 Forming low k dielectric layers |
| 04/17/2007 | US7205232 Method of forming a self-aligned contact structure using a sacrificial mask layer |
| 04/17/2007 | US7205229 Interconnect alloys and methods and apparatus using same |
| 04/17/2007 | US7205224 Very low dielectric constant plasma-enhanced CVD films |
| 04/17/2007 | US7205223 Method of forming an interconnect structure for a semiconductor device |
| 04/17/2007 | US7205221 Under bump metallization pad and solder bump connections |
| 04/17/2007 | US7205204 Semiconductor device and fabrication method for the same |
| 04/17/2007 | US7205203 Method of fabricating crystalline silicon and switching device using crystalline silicon |
| 04/17/2007 | US7205192 Semiconductor memory device capable of preventing oxidation of plug and method for fabricating the same |
| 04/17/2007 | US7205190 Semiconductor device fabrication method |
| 04/17/2007 | US7205181 Method of forming hermetic wafer scale integrated circuit structure |
| 04/17/2007 | US7205179 Hydrogen diffusion hybrid port and method of making |
| 04/17/2007 | US7205178 Land grid array packaged device and method of forming same |
| 04/17/2007 | US7205177 Methods of bonding two semiconductor devices |
| 04/17/2007 | US7205085 Composition having permitivity being radiation-sensitively changeable and method for forming permitivity pattern |
| 04/17/2007 | US7204917 Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same |
| 04/17/2007 | US7204750 Airflow guide structure and manufacture thereof |
| 04/17/2007 | US7204708 Socket for semiconductor device |
| 04/17/2007 | US7204615 LED light with active cooling |
| 04/17/2007 | US7204018 Technique for reducing via capacitance |
| 04/17/2007 | US7204017 Manufacturing method of a modularized leadframe |
| 04/17/2007 | CA2410430C Miniature microdevice package and process for making thereof |
| 04/12/2007 | WO2007041504A1 High density, high q capacitor on top of protective layer |
| 04/12/2007 | WO2007041280A2 Methods of and apparatuses for measuring electrical parameters of a plasma process |
| 04/12/2007 | WO2007041205A2 Wafer-level method for metallizing source, gate and drain contact areas of semiconductor die |
| 04/12/2007 | WO2007041155A2 Microelectronic package having multiple conductive paths through an opening in a support substrate |
| 04/12/2007 | WO2007041124A1 Amine-free deposition of metal-nitride films |
| 04/12/2007 | WO2007041123A1 Ic coolant microchannel assembly with integrated attachment hardware |
| 04/12/2007 | WO2007041109A1 Microelectronic package having direct contact heat spreader and method of manufacturing same |
| 04/12/2007 | WO2007040962A1 Wireless pressure sensor and method of forming same |
| 04/12/2007 | WO2007040690A1 Rf power transistor package |
| 04/12/2007 | WO2007040563A2 Nanostructured friction enhancement using fabricated microstructure |
| 04/12/2007 | WO2007040229A1 Semiconductor device |
| 04/12/2007 | WO2007040191A1 Method of surface treatment for the inhibition of wiskers |
| 04/12/2007 | WO2007040107A1 Resin composition for optical semiconductor device encapsulation and optical semiconductor device produced by using same |
| 04/12/2007 | WO2007040051A1 Piezoelectric vibrating device |
| 04/12/2007 | WO2007039385A1 Metal interconnect structure for a microelectronic element |
| 04/12/2007 | WO2007024186A3 Interconnects and heat dissipators based on nanostructures |
| 04/12/2007 | WO2007000695A3 Package, subassembly and methods of manufacturing thereof |
| 04/12/2007 | WO2006124607A3 Materials and method to seal vias in silicon substrates |
| 04/12/2007 | WO2006116283A3 System and method for enhancing wafer chip scale packages |
| 04/12/2007 | WO2006116280A3 Chip-scale package |
| 04/12/2007 | WO2006052958A3 Copper interconnect wiring and method of forming thereof |
| 04/12/2007 | WO2005122662A3 Semi-compliant joining mechanism for semiconductor cooling applications |
| 04/12/2007 | WO2005119775A3 Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure |
| 04/12/2007 | US20070082504 Pre-metal dielectric semiconductor structure and a method for depositing a pre-metal dielectric on a semiconductor structure |
| 04/12/2007 | US20070082454 Microelectronic device and method of manufacturing a microelectronic device |
| 04/12/2007 | US20070082429 Semiconductor substrate for build-up packages |
| 04/12/2007 | US20070081314 Electronic component packaging structure and method for producing the same |
| 04/12/2007 | US20070081170 Overlay metrology method and apparatus using more than one grating per measurement direction |
| 04/12/2007 | US20070080471 Semiconductor device, method for assembling semiconductor device |
| 04/12/2007 | US20070080470 Leaded package integrated circuit stacking |
| 04/12/2007 | US20070080469 Package board, semiconductor package, and fabricating method thereof |
| 04/12/2007 | US20070080468 Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure |
| 04/12/2007 | US20070080467 Semiconductor device |
| 04/12/2007 | US20070080466 Universal chip package structure |
| 04/12/2007 | US20070080465 Printed board, electronic board and electronic device |
| 04/12/2007 | US20070080464 Support structures for semiconductor devices |
| 04/12/2007 | US20070080463 Semiconductor device and method of fabricating the same |
| 04/12/2007 | US20070080462 Electrode and method for forming the same |
| 04/12/2007 | US20070080461 Ultra low-k dielectric in damascene structures |
| 04/12/2007 | US20070080460 Bond pads and methods for fabricating the same |
| 04/12/2007 | US20070080459 Semiconductor device including metal interconnection and method for forming metal interconnection |
| 04/12/2007 | US20070080458 Hybrid module and method of manufacturing the same |
| 04/12/2007 | US20070080457 Manufacturing method for semiconductor device, semiconductor device and semiconductor chip |
| 04/12/2007 | US20070080456 Arrangement of conductive pads on grid array package and on circuit board |
| 04/12/2007 | US20070080455 Semiconductors and methods of making |
| 04/12/2007 | US20070080454 Flip-chip type assembly |
| 04/12/2007 | US20070080453 Semiconductor chip having a bump with conductive particles and method of manufacturing the same |
| 04/12/2007 | US20070080452 Bump structure and its forming method |
| 04/12/2007 | US20070080451 Intermetallic solder with low melting point |
| 04/12/2007 | US20070080450 Wafer level laser marking system for ultra-thin wafers using support tape |
| 04/12/2007 | US20070080449 Interconnect substrate and electronic circuit device |
| 04/12/2007 | US20070080448 Method and structure for optimizing yield of 3-d chip manufacture |
| 04/12/2007 | US20070080447 Electronic apparatus |
| 04/12/2007 | US20070080446 Protective enclosure for handheld electronic device |
| 04/12/2007 | US20070080445 Semiconductor device having improved metal wiring |
| 04/12/2007 | US20070080444 Electronic circuit chip, and electronic circuit device and method for manufacturing the same |
| 04/12/2007 | US20070080443 Packaging configurations for vertical electronic devices using conductive traces disposed on laminated board layers |
| 04/12/2007 | US20070080442 Semiconductor module having a coupling substrate, and methods for its production |
| 04/12/2007 | US20070080441 Thermal expansion compensation graded IC package |
| 04/12/2007 | US20070080440 Soi device with different crystallographic orientations |
| 04/12/2007 | US20070080439 Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same |
| 04/12/2007 | US20070080438 Semiconductor device, semiconductor module, and method of manufacturing the semiconductor module |
| 04/12/2007 | US20070080437 Integrated circuit package system |
| 04/12/2007 | US20070080436 System and Method for Noise Reduction in Multi-Layer Ceramic Packages |
| 04/12/2007 | US20070080435 Semiconductor packaging process and carrier for semiconductor package |
| 04/12/2007 | US20070080434 Semiconductor package having an interfacial adhesive layer |
| 04/12/2007 | US20070080433 Display panels |
| 04/12/2007 | US20070080432 Flexible substrate for package |
| 04/12/2007 | US20070080431 Lead frame package structure with high density of lead pins arrangement |