| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/18/2007 | CN1949527A Wafer level chip scale package of image sensor and manufacturing method thereof |
| 04/18/2007 | CN1949525A Reliable interconnection of solar cells including integral bypass diode |
| 04/18/2007 | CN1949523A Non-volatile memory devices and methods of forming the same |
| 04/18/2007 | CN1949518A Semiconductor memory device and method of fabricating the same |
| 04/18/2007 | CN1949514A Semiconductor chip and packaging and electronic installation comprising same |
| 04/18/2007 | CN1949513A Single grid double tunnel pixel |
| 04/18/2007 | CN1949512A 系统lsi System lsi |
| 04/18/2007 | CN1949511A 显示器件及其制造方法 A display device and manufacturing method thereof |
| 04/18/2007 | CN1949510A 集成电路 IC |
| 04/18/2007 | CN1949509A Electrostatic discharge protection circuit for RF identification chip |
| 04/18/2007 | CN1949505A Stacked integrated circuit chip and packaging |
| 04/18/2007 | CN1949503A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 04/18/2007 | CN1949502A 半导体装置及集成电路装置 The semiconductor integrated circuit device and means |
| 04/18/2007 | CN1949501A 半导体装置 Semiconductor device |
| 04/18/2007 | CN1949500A Wiring board, semiconductor device, and method for manufacturing the same |
| 04/18/2007 | CN1949499A Wiring board, semiconductor device, and method of manufacturing the same |
| 04/18/2007 | CN1949498A Void-free circuit board and semiconductor package having the same |
| 04/18/2007 | CN1949497A Flexible substrate for packaging |
| 04/18/2007 | CN1949496A Flexible substrate for packaging |
| 04/18/2007 | CN1949495A Coiled strip for packaging |
| 04/18/2007 | CN1949494A Lead frame for semiconductor device and manufacturing methode thereof |
| 04/18/2007 | CN1949493A Bonded copper wire and preparing method thereof |
| 04/18/2007 | CN1949492A Bonded copper wire and preparing method thereof |
| 04/18/2007 | CN1949491A 'N' shape electric connectioned wafer stage chip size packaging structure and mfg. method thereof |
| 04/18/2007 | CN1949490A Method of electronic assembly heat conduction |
| 04/18/2007 | CN1949489A LED chip radiator and mfg. method thereof |
| 04/18/2007 | CN1949488A 散热器 Heat sink |
| 04/18/2007 | CN1949487A Packaging structure of flip-chip on film capable of preventing sealing material from overflow |
| 04/18/2007 | CN1949486A Semiconductor device, method for assembling semiconductor device |
| 04/18/2007 | CN1949485A Semiconductor structure and mfg. method thereof |
| 04/18/2007 | CN1949484A Method for mfg. thin film transistor array substrages |
| 04/18/2007 | CN1949478A Method and system for removing impairment of integrated circuit |
| 04/18/2007 | CN1949474A Wiring correction method |
| 04/18/2007 | CN1949467A Coreless substrate and manufacturing method thereof |
| 04/18/2007 | CN1311569C Magnetic sensor and producing method thereof |
| 04/18/2007 | CN1311552C Semiconductor device and RF device |
| 04/18/2007 | CN1311551C Semiconductor device with surge protection circuit |
| 04/18/2007 | CN1311550C ESD protective element structure |
| 04/18/2007 | CN1311549C Wiring and wiring production method and wiring board and wiring board production method |
| 04/18/2007 | CN1311548C Semiconductor device package with improved cooling ability |
| 04/18/2007 | CN1311547C Semiconductor device, method of manufacture thereof, circuit board and electronic device |
| 04/18/2007 | CN1311544C Method for fabricating CMOS image sensor protecting low temperature oxide delamination |
| 04/18/2007 | CN1311543C Semiconductor device |
| 04/18/2007 | CN1311540C Method of manufacturing semiconductor device |
| 04/18/2007 | CN1311524C Semiconductor device with guard ring for preventing water from entering circuit region from outside |
| 04/18/2007 | CN1311523C Semiconductor wafer and method of manufacturing semiconductor device |
| 04/18/2007 | CN1311519C Crystal circular/ chip distribution layer protecting method |
| 04/18/2007 | CN1311056C An etchant for a wiring, a method for manufacturing the wiring using the etchant, a thin film transistor array panel including the wiring, and a method for manufacturing the same |
| 04/17/2007 | US7207023 Semiconductor device layout method, a computer program, and a semiconductor device manufacture method |
| 04/17/2007 | US7206207 Heat dissipation device assembly |
| 04/17/2007 | US7206206 Radiator structure |
| 04/17/2007 | US7206205 Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof |
| 04/17/2007 | US7206204 Electric circuit module |
| 04/17/2007 | US7206203 Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins |
| 04/17/2007 | US7206202 Electronic apparatus with heat-dissipating structure |
| 04/17/2007 | US7206190 Electrode for electric double layer capacitor |
| 04/17/2007 | US7205880 Trimmer impedance component, semiconductor device and trimming method |
| 04/17/2007 | US7205876 Inductor for radio frequency integrated circuit |
| 04/17/2007 | US7205705 Electronic component and method of producing the same |
| 04/17/2007 | US7205684 Semiconductor integrated circuit device and method for designing the same |
| 04/17/2007 | US7205675 Micro-fabricated device with thermoelectric device and method of making |
| 04/17/2007 | US7205674 Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package |
| 04/17/2007 | US7205673 Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing |
| 04/17/2007 | US7205672 Flip chip mounted to thermal sensing element through the back side of the chip |
| 04/17/2007 | US7205671 Semiconductor device |
| 04/17/2007 | US7205670 Semiconductor device and manufacturing method therefor |
| 04/17/2007 | US7205669 Semiconductor device |
| 04/17/2007 | US7205668 Multi-layer printed circuit board wiring layout |
| 04/17/2007 | US7205667 Interlayer insulating films formed over a substrate, a via hole formed through the film, a conductive plug filled in the via hole and made of copper or an alloy |
| 04/17/2007 | US7205666 Interconnections having double capping layer and method for forming the same |
| 04/17/2007 | US7205665 Porous silicon undercut etching deterrent masks and related methods |
| 04/17/2007 | US7205664 Semiconductor device and method for manufacturing the same |
| 04/17/2007 | US7205663 Adhesion layer of 11-trichlorosilylundecyl thioacetate coupled to a copper layer formed over a dielectric layer via the thioacetate group and a silicon dioxide layer via the trichlorosilyl group |
| 04/17/2007 | US7205661 Projected contact structures for engaging bumped semiconductor devices and methods of making the same |
| 04/17/2007 | US7205660 Wafer level chip scale package having a gap and method for manufacturing the same |
| 04/17/2007 | US7205659 Assemblies for temporarily connecting microelectronic elements for testing and methods therefor |
| 04/17/2007 | US7205658 Singulation method used in leadless packaging process |
| 04/17/2007 | US7205656 Stacked device package for peripheral and center device pad layout device |
| 04/17/2007 | US7205655 Multilayer circuit including stacked layers of insulating material and conductive sections |
| 04/17/2007 | US7205654 Programmed material consolidation methods for fabricating heat sinks |
| 04/17/2007 | US7205653 Fluid cooled encapsulated microelectronic package |
| 04/17/2007 | US7205652 Electronic assembly including multiple substrates |
| 04/17/2007 | US7205651 Thermally enhanced stacked die package and fabrication method |
| 04/17/2007 | US7205650 Composite devices of laminate type and processes |
| 04/17/2007 | US7205649 Ball grid array copper balancing |
| 04/17/2007 | US7205648 Flip-chip light emitting diode package structure |
| 04/17/2007 | US7205647 Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages |
| 04/17/2007 | US7205645 Wiring board, semiconductor device, and method of manufacturing wiring board |
| 04/17/2007 | US7205644 Substrate with outer contacts one one surface and inner contacts disposed around it, electrically connected, memory chips are electrically connected to the inner contacts; molding compound encapsulating the memory chips and the inner contacts; and an ultra-thin plastic shell covering the second surface |
| 04/17/2007 | US7205642 Semiconductor package and method for fabricating the same |
| 04/17/2007 | US7205640 Semiconductor device and display comprising same |
| 04/17/2007 | US7205638 Silicon building blocks in integrated circuit packaging |
| 04/17/2007 | US7205637 Semiconductor device with a multilevel interconnection connected to a guard ring and alignment mark |
| 04/17/2007 | US7205636 Semiconductor device with a multilevel interconnection connected to a guard ring |
| 04/17/2007 | US7205635 Hermetic wafer scale integrated circuit structure |
| 04/17/2007 | US7205631 Poly-silicon stringer fuse |
| 04/17/2007 | US7205629 Lateral super junction field effect transistor |
| 04/17/2007 | US7205613 Insulating substrate for IC packages having integral ESD protection |
| 04/17/2007 | US7205612 Fully silicided NMOS device for electrostatic discharge protection |
| 04/17/2007 | US7205611 Semiconductor device including a protection circuit |