| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/19/2007 | US20070085202 Semiconductor device and communication system using the semiconductor device |
| 04/19/2007 | US20070085201 Power semiconductor device in lead frame technology with a vertical current path |
| 04/19/2007 | US20070085200 Capacitor interconnection |
| 04/19/2007 | US20070085199 Integrated circuit package system using etched leadframe |
| 04/19/2007 | US20070085198 Integrated micro-channels for 3D through silicon architectures |
| 04/19/2007 | US20070085197 Semiconductor insulation structure |
| 04/19/2007 | US20070085196 Light emitting diode package |
| 04/19/2007 | US20070085195 Wafer level packaging cap and fabrication method thereof |
| 04/19/2007 | US20070085194 Dielectric composite material |
| 04/19/2007 | US20070085193 Printed wiring board and method of suppressing power supply noise thereof |
| 04/19/2007 | US20070085192 Method for producing micromechanical components in integrated circuits and arrangement of a semiconductor on a substrate |
| 04/19/2007 | US20070085191 Lead pin, circuit, semiconductor device, and method of forming lead pin |
| 04/19/2007 | US20070085190 Decoupling capacitor closely coupled with integrated circuit |
| 04/19/2007 | US20070085189 Semiconductor chip and method of manufacturing semiconductor chip |
| 04/19/2007 | US20070085188 Stack Structure of Carrier Board Embedded with Semiconductor Components and Method for Fabricating the same |
| 04/19/2007 | US20070085187 Vertically packaged MOSFET and IC power devices as integrated module using 3D interconnected laminates |
| 04/19/2007 | US20070085186 Stacked-type chip package structure |
| 04/19/2007 | US20070085185 Stacked integrated circuit chip assembly |
| 04/19/2007 | US20070085184 Stacked die packaging system |
| 04/19/2007 | US20070085183 Integrated circuit |
| 04/19/2007 | US20070085181 Power semiconductor module with overcurrent protective device |
| 04/19/2007 | US20070085180 Image sensor mounted by mass reflow |
| 04/19/2007 | US20070085179 Automotive plastic lead frame sensor |
| 04/19/2007 | US20070085178 Conductor substrate, semiconductor device and production method thereof |
| 04/19/2007 | US20070085177 includes a small amount of residual carbon and has a high current density prepared using a composition that includes a nano-sized inorganic material |
| 04/19/2007 | US20070085176 Chip package having asymmetric molding |
| 04/19/2007 | US20070085175 Selective solder deposition by self-assembly of nano-sized solder particles, and methods of assembling soldered packages |
| 04/19/2007 | US20070085174 Apparatus and method for providing bypass capacitance and power routing in QFP package |
| 04/19/2007 | US20070085173 Method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages |
| 04/19/2007 | US20070085172 System-on-chip with shield rings for shielding functional blocks therein from electromagnetic interference |
| 04/19/2007 | US20070085171 Semiconductor assembly for improved device warpage and solder ball coplanarity |
| 04/19/2007 | US20070085160 Process for resurf diffusion for high voltage MOSFET |
| 04/19/2007 | US20070085144 ESD protection system for multiple-domain integrated circuits |
| 04/19/2007 | US20070085143 Semiconductor structure for draining an overvoltage pulse, and method for manufacturing same |
| 04/19/2007 | US20070085142 Tunable protection system for integrated circuits |
| 04/19/2007 | US20070085141 Information playback system using information storage medium |
| 04/19/2007 | US20070085069 Method and apparatus for manufacturing ic chip packaged device |
| 04/19/2007 | US20070085045 Solid State Relay |
| 04/19/2007 | US20070084904 Conductive ball, formation method for electrode of electronic component, electronic component and electronic equipment |
| 04/19/2007 | US20070084633 Electromagnetic relay with noise reducing sealant |
| 04/19/2007 | US20070084597 Control device of an air conditioning device of a motor vehicle and method for activating an air conditioning device |
| 04/19/2007 | US20070084584 Radiation fin, cooling device, electronic equipment, and manufacturing method of cooling device |
| 04/19/2007 | DE4334715B4 Verfahren zur Montage von mit elektrischen Anschlüssen versehenen Bauteilen Method for mounting of components provided with electrical terminals |
| 04/19/2007 | DE112005001273T5 Thermoelektrischer Wandler und Verfahren zu seiner Herstellung A thermoelectric converter and process for its preparation |
| 04/19/2007 | DE112004002862T5 Verfahren zum Herstellen einer Halbleitervorrichtung und Halbleitervorrichtung A method of manufacturing a semiconductor device and semiconductor device |
| 04/19/2007 | DE112004002858T5 Träger für eine Stapel-Halbleitervorrichtung und Verfahren zum Herstellen derselben The support for a stack-type semiconductor device and method of manufacturing the same |
| 04/19/2007 | DE10306620B4 Integrierte Testschaltung in einer integrierten Schaltung Integrated test circuit in an integrated circuit |
| 04/19/2007 | DE10213296B9 Elektronisches Bauteil mit einem Halbleiterchip, Verfahren zu seiner Herstellung und Verfahren zur Herstellung eines Nutzens Electronic component having a semiconductor chip, a process for its preparation and process for the preparation of a benefit |
| 04/19/2007 | DE10203397B4 Chip-Size-Package mit integriertem passiven Bauelement Chip-size package with integrated passive component |
| 04/19/2007 | DE102006045822A1 Herstellungsverfahren für eine integrierte Halbleiterstruktur und entsprechende integrierte Halbleiterstruktur Manufacturing method of an integrated semiconductor structure and corresponding integrated semiconductor structure |
| 04/19/2007 | DE102005048492A1 Elektrisches oder elektronisches Modul Electrical or electronic module |
| 04/19/2007 | DE102005047856A1 Semiconductor component has component parts comprising a wiring substrate with structured metallization, a ceramic substrate with a structured metal layer, flat conductor framework, a semiconductor chip and bond wires |
| 04/19/2007 | DE102005047106A1 Leistungshalbleitermodul The power semiconductor module |
| 04/19/2007 | DE102004039228B4 Kühlvorrichtung Cooler |
| 04/19/2007 | DE102004003275B4 Halbleiterbauteil mit Verbindungselementen auf Halbleiterchips und Verfahren zur Herstellung derselben A semiconductor device comprising connecting elements to the semiconductor chip and method of manufacturing the same |
| 04/19/2007 | DE10133791B4 Verfahren zur Herstellung eines elektronischen Bauteils A method of manufacturing an electronic component |
| 04/19/2007 | DE10103807B4 Verdrahtungssubstrat und Prozess zu seiner Herstellung Wiring substrate and process for its manufacture |
| 04/18/2007 | EP1776001A2 Printed wiring board and manufacturing method therefor |
| 04/18/2007 | EP1775767A2 Method of fabricating a vertically montable IC package |
| 04/18/2007 | EP1775766A1 Collective substrate, semiconductor element mounting member, semiconductor device, imaging device, light emitting diode constituting member, and light emitting diode |
| 04/18/2007 | EP1775765A1 Multilayer dielectric substrate and semiconductor package |
| 04/18/2007 | EP1775763A2 Method of forming local interconnects and conductive lines, and resulting structure |
| 04/18/2007 | EP1775761A1 Through substrate and interposer, and method for manufacturing through substrate |
| 04/18/2007 | EP1775649A1 Production system |
| 04/18/2007 | EP1774593A2 An active protection device for protecting circuit against mechanical and electromagnetic attack. |
| 04/18/2007 | EP1774592A1 Chip with light protection layer |
| 04/18/2007 | EP1774591A1 An organic ferroelectric or electret device with via connections and a method for its manufacture |
| 04/18/2007 | EP1774590A1 Module integration integrated circuits |
| 04/18/2007 | EP1774587A2 Wafer with improved conductive loops in the dicing lines |
| 04/18/2007 | EP1774582A2 Micro-castellated interposer |
| 04/18/2007 | EP1702192B1 Heat exchanger |
| 04/18/2007 | EP1581968A4 Integrated antifuse structure for finfet and cmos devices |
| 04/18/2007 | EP1565937B1 Power semiconductor module |
| 04/18/2007 | EP1543558A4 Radio frequency identificaton device and method |
| 04/18/2007 | EP1525623B8 Semiconductor structure for imaging detectors |
| 04/18/2007 | EP1483722B1 Memory module assembly using partially defective chips |
| 04/18/2007 | EP1378002B8 Metal-insulator-metal capacitor in copper |
| 04/18/2007 | EP1316108B1 Fabrication process of a semiconductor device comprising an intermediate low-dielectric silicon nitride film |
| 04/18/2007 | CN2891610Y Three-in-one radiator |
| 04/18/2007 | CN2891609Y Improved radiation fin structure |
| 04/18/2007 | CN2891607Y Radiation fin structure with different densities |
| 04/18/2007 | CN2891606Y Heat radiator |
| 04/18/2007 | CN2891292Y LED structure |
| 04/18/2007 | CN2891291Y Barracuda type LED bracket and device |
| 04/18/2007 | CN2891285Y Wafer structure with side solder pad arrangement |
| 04/18/2007 | CN2891284Y IGBT module and radiator mounting structure in switch power supply |
| 04/18/2007 | CN2891283Y Rectifier and radiator mounting structure in switch power supply |
| 04/18/2007 | CN2891282Y High-voltage silicon stack |
| 04/18/2007 | CN2891281Y Heat-conducting plate structure for CPU |
| 04/18/2007 | CN2891280Y Wind scooper of CPU heat radiator for server |
| 04/18/2007 | CN2891279Y Cpu散热器结构 Cpu heatsink structure |
| 04/18/2007 | CN2891278Y Folding heat-conducting medium protection cover |
| 04/18/2007 | CN1950939A 半导体装置 Semiconductor device |
| 04/18/2007 | CN1950934A Integrated ball and via package and formation process |
| 04/18/2007 | CN1950447A Resin composition for sealing and semiconductor device sealed with resin |
| 04/18/2007 | CN1949960A Method and apparatus for optimizing heat transfer with electronic components |
| 04/18/2007 | CN1949958A Radiator |
| 04/18/2007 | CN1949952A Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same |
| 04/18/2007 | CN1949950A Composite dielectric composition having small variation of capacitance with temperature and signal-matching embedded capacitor prepared using the same |
| 04/18/2007 | CN1949547A Wafer stage chip packing structure of LED and packing method |