| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/24/2007 | US7208716 Image-generation device, in particular for installation in the roof area or exterior rearview mirror of a motor vehicle |
| 04/24/2007 | US7208455 post-chemical mechanical polishing rinse comprising 11-trichlorosilyl undecyl thioacetate, alcohols and acids |
| 04/24/2007 | US7208426 Preventing plasma induced damage resulting from high density plasma deposition |
| 04/24/2007 | US7208408 Method for fabricating a dual damascene contact in an insulating film having density gradually varying in the thickness direction |
| 04/24/2007 | US7208405 Insulating film forming method capable of enhancing adhesion of silicon carbide film, etc. and semiconductor device |
| 04/24/2007 | US7208403 Tile-based routing method of a multi-layer circuit board and related structure |
| 04/24/2007 | US7208402 Method and apparatus for improved power routing |
| 04/24/2007 | US7208351 Electronic device and method of manufacture the same |
| 04/24/2007 | US7208349 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 04/24/2007 | US7208348 Methods of fabricating a via-in-pad with off-center geometry |
| 04/24/2007 | US7208347 Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours |
| 04/24/2007 | US7208344 Wafer level mounting frame for ball grid array packaging, and method of making and using the same |
| 04/24/2007 | US7208343 Semiconductor chip, chip stack package and manufacturing method |
| 04/24/2007 | US7208342 Package warpage control |
| 04/24/2007 | US7208340 Semiconductor device manufacturing method |
| 04/24/2007 | US7208335 Castellated chip-scale packages and methods for fabricating the same |
| 04/24/2007 | US7208331 Methods and structures for critical dimension and profile measurement |
| 04/24/2007 | US7208192 Application of a thermally and/or electrically conductive compound to fill a thermal and/or EMI shielding gap between a first and a second surface. A supply of a fluent, form-stable compound is provided as an admixture of a cured polymer gel |
| 04/24/2007 | US7208191 Substrate with fullerenes coating |
| 04/24/2007 | US7208113 Sealing material tablet method of manufacturing the tablet and electronic component device |
| 04/24/2007 | US7208105 Mixture of electroconductive particles and polymer |
| 04/24/2007 | US7208094 Methods of bridging lateral nanowires and device using same |
| 04/24/2007 | US7208065 Structure for measuring the etching speed |
| 04/24/2007 | US7208058 SOI substrate and manufacturing method thereof |
| 04/24/2007 | US7208046 Spray coating apparatus and fixtures |
| 04/24/2007 | US7207105 Method for producing an integral ceramic circuit board |
| 04/24/2007 | US7207096 Method of manufacturing high performance copper inductors with bond pads |
| 04/24/2007 | CA2378884C Mobile station supervision of the forward dedicated control channel when in the discontinuous transmission mode |
| 04/19/2007 | WO2007044904A2 Method of manufacturing lithium battery |
| 04/19/2007 | WO2007044305A2 Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement |
| 04/19/2007 | WO2007043714A1 Multilayer printed wiring board and method for manufacturing same |
| 04/19/2007 | WO2007043683A1 Printed wiring board |
| 04/19/2007 | WO2007043645A1 Process for production of devices |
| 04/19/2007 | WO2007043639A1 Printed wiring board and method for manufacturing printed wiring board |
| 04/19/2007 | WO2007043598A1 Electronic device and heat sink |
| 04/19/2007 | WO2007043340A1 Semiconductor device |
| 04/19/2007 | WO2007043107A1 Board structure and package component |
| 04/19/2007 | WO2007041902A1 A heat conducting and dissipating structure for white light led package |
| 04/19/2007 | WO2007024526A3 Microelectronic devices and microelectronic support devices, and associated assemblies and methods |
| 04/19/2007 | WO2007019081A3 Application of autonomic self healing composites to integrated circuit packaging |
| 04/19/2007 | WO2007010315A3 Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component |
| 04/19/2007 | WO2007005263A3 Semiconductor die package and method for making the same |
| 04/19/2007 | WO2006135556A3 B-stageable film, electronic device, and associated process |
| 04/19/2007 | WO2006132794A3 A light-emitting device module with flip-chip configuration on a heat-dissipating substrate |
| 04/19/2007 | WO2006114267A3 Electronic component and electronic configuration |
| 04/19/2007 | WO2006052955A3 Method of manufacturing rfid devices using fluidic self assembly and a local |
| 04/19/2007 | WO2006044804A3 Multi chip leadframe package |
| 04/19/2007 | WO2006044320A3 Overlay measurement target |
| 04/19/2007 | WO2005119766A3 Preparation of front contact for surface mounting |
| 04/19/2007 | WO2005112113A3 Mounting with auxiliary bumps |
| 04/19/2007 | WO2005104323A3 Improved microchannel heat sink |
| 04/19/2007 | US20070089113 Circuit substrate production method and system, substrate used therein, and circuit substrate using the same |
| 04/19/2007 | US20070087747 Method and System for Providing Information to a Home System Regarding a Wireless Unit Roaming in a Visited System |
| 04/19/2007 | US20070087746 Method and System for Providing Information to a Home System Regarding a Wireless Unit Roaming in a Visited System |
| 04/19/2007 | US20070087588 Interposer with electrical contact button and method |
| 04/19/2007 | US20070087559 Semiconductor device manufacturing method |
| 04/19/2007 | US20070087554 Interconnection structure with low dielectric constant |
| 04/19/2007 | US20070087553 Semiconductor Component And Method For Contracting Said Semiconductor Component |
| 04/19/2007 | US20070087551 Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner |
| 04/19/2007 | US20070087547 Wafer structure with electroless plating metal connecting layer and method for fabricating the same |
| 04/19/2007 | US20070087543 Fuse structure having reduced heat dissipation towards the substrate |
| 04/19/2007 | US20070087528 Method and structure for vertically-stacked device contact |
| 04/19/2007 | US20070087496 Non-volatile memory devices including fuse covered field regions |
| 04/19/2007 | US20070087483 Heat sink and method for its production |
| 04/19/2007 | US20070087480 Chip package method |
| 04/19/2007 | US20070087478 Semiconductor chip package and method for manufacturing the same |
| 04/19/2007 | US20070087477 Semiconductor device having a low-resistance bus interconnect, method of manufacturing same, and display apparatus employing same |
| 04/19/2007 | US20070087474 Assembly process for out-of-plane MEMS and three-axis sensors |
| 04/19/2007 | US20070087467 CMOS image sensor |
| 04/19/2007 | US20070087274 Wiring correction method |
| 04/19/2007 | US20070087230 Method and apparatus for integrated-circuit battery devices |
| 04/19/2007 | US20070087128 Shielded System with a Housing Having a High Atomic Number Metal Coating Applied By Thermal Spray Technique |
| 04/19/2007 | US20070087124 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device |
| 04/19/2007 | US20070087122 Semiconductor device, mounting substrate and method of manufacturing mounting substrate, circuit board, and electronic instrument |
| 04/19/2007 | US20070086644 Non-lot based method for assembling integrated circuit devices |
| 04/19/2007 | US20070085636 Waveguide coupler |
| 04/19/2007 | US20070085635 Waveguide coupler |
| 04/19/2007 | US20070085625 Flexible capacitive coupler assembly and method of manufacture |
| 04/19/2007 | US20070085225 Vapor deposition; screen printing |
| 04/19/2007 | US20070085224 Semiconductor device having strong adhesion between wiring and protective film, and manufacturing method therefor |
| 04/19/2007 | US20070085223 Mechanism and process for compressing chips |
| 04/19/2007 | US20070085222 Molded integrated circuit package with exposed active area |
| 04/19/2007 | US20070085221 Semiconductor device and manufacturing method thereof |
| 04/19/2007 | US20070085220 Re-enforced ball-grid array packages for semiconductor products |
| 04/19/2007 | US20070085219 Method for manufacture of wafer level package with air pads |
| 04/19/2007 | US20070085218 Flip chip package |
| 04/19/2007 | US20070085217 Mounting board and semiconductor device |
| 04/19/2007 | US20070085216 Semiconductor device having a semiconductor chip, and method for the production thereof |
| 04/19/2007 | US20070085215 Silicon based optical vias |
| 04/19/2007 | US20070085214 Semiconductor device |
| 04/19/2007 | US20070085213 Selective electroless-plated copper metallization |
| 04/19/2007 | US20070085212 Dielectric composite material |
| 04/19/2007 | US20070085211 Semiconductor device and method for manufacturing the same |
| 04/19/2007 | US20070085210 Interconnect structure and fabricating method thereof |
| 04/19/2007 | US20070085209 Anchored damascene structures |
| 04/19/2007 | US20070085208 Interconnect structure |
| 04/19/2007 | US20070085207 Pad structure, method of forming a pad structure, semiconductor device having a pad structure and method of manufacturing a semiconductor device |
| 04/19/2007 | US20070085206 Chip packaging process |
| 04/19/2007 | US20070085204 Chip scale power LDMOS device |
| 04/19/2007 | US20070085203 Multilayer printed wiring board |