| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/25/2007 | CN1954425A Programming semiconductor dies for pin map compatibility |
| 04/25/2007 | CN1954424A Selectivity control in a plasma processing system |
| 04/25/2007 | CN1954412A Fabrication of interconnect structures |
| 04/25/2007 | CN1954275A 生产系统 Production System |
| 04/25/2007 | CN1953642A Circuit board with through hole type heat radiation |
| 04/25/2007 | CN1953223A Nitride semiconductor light emitting device for flip-chip |
| 04/25/2007 | CN1953222A Light-emitting element with at least one light-emitting crystal |
| 04/25/2007 | CN1953219A Light source generator of medical device |
| 04/25/2007 | CN1953218A Manufacture method for diode light-emitting device and its structure |
| 04/25/2007 | CN1953196A Solid-state imaging device and method for manufacturing the same |
| 04/25/2007 | CN1953192A Image sensor module package structure |
| 04/25/2007 | CN1953190A Array substrate, method of manufacturing and liquid crystal display device comprising the same |
| 04/25/2007 | CN1953188A Liquid-crystal display device with thin-film transistors and method of fabricating the same |
| 04/25/2007 | CN1953180A Semiconductor integrated circuit and method of designing the same |
| 04/25/2007 | CN1953179A 半导体器件 Semiconductor devices |
| 04/25/2007 | CN1953177A Light-emitting diode device |
| 04/25/2007 | CN1953175A Complex RF device and method for manufacturing the same |
| 04/25/2007 | CN1953174A Module with embedded electronic components |
| 04/25/2007 | CN1953173A Wiring test structures for determining open and short circuits in semiconductor devices and forming method of the same |
| 04/25/2007 | CN1953172A Testing structure for verifying technology reliability of gate dielectric layer of a digital transistor |
| 04/25/2007 | CN1953171A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 04/25/2007 | CN1953170A 半导体器件 Semiconductor devices |
| 04/25/2007 | CN1953169A Power core devices and methods of making thereof |
| 04/25/2007 | CN1953168A 引线框架 Leadframe |
| 04/25/2007 | CN1953167A Semiconductor element |
| 04/25/2007 | CN1953166A Solder bump structure for flip chip semiconductor devices and method of manufacture therefore |
| 04/25/2007 | CN1953165A Lead pin, circuit, semiconductor device, and method of forming lead pin |
| 04/25/2007 | CN1953164A Encapsulation method and structure of light emitting diode |
| 04/25/2007 | CN1953163A Heat abstractor |
| 04/25/2007 | CN1953162A Light-emitting device, electronic equipment, and method of manufacturing thereof |
| 04/25/2007 | CN1953157A Interconnect making method of electron |
| 04/25/2007 | CN1953152A Method for manufacturing semiconductor module using interconnection structure |
| 04/25/2007 | CN1953151A Underlay embedded passive device |
| 04/25/2007 | CN1952032A Integrated circuit package molding die cleaning materials |
| 04/25/2007 | CN1312965C Wiring layer of silver or silver alloy, mfg. method thereof and display screen substrate therewith |
| 04/25/2007 | CN1312771C Electrostatic discharging protection element |
| 04/25/2007 | CN1312770C Protective transistors |
| 04/25/2007 | CN1312769C Directly connected chip packaging structure |
| 04/25/2007 | CN1312768C Wire lead frame, resin steal model and semiconductor using same |
| 04/25/2007 | CN1312767C Power source circuit device |
| 04/25/2007 | CN1312766C Method for pressing heat conduit end with levelling surface used as active element and its structure |
| 04/25/2007 | CN1312765C Integreted circuit bearing base with overvoltage protective function |
| 04/25/2007 | CN1312764C Electronic component device and producing method thereof |
| 04/25/2007 | CN1312763C Structure for constructing and installing chip embedded typed semiconductor components |
| 04/25/2007 | CN1312761C Method for the production of an NROM memory cell arrangement |
| 04/25/2007 | CN1312754C Manufacturing method of electronic, photoelectronic or electromechanical device, and electronic device |
| 04/25/2007 | CN1312750C Structure and method for determining edges of regions in a semiconductor wafer |
| 04/25/2007 | CN1312748C Method for mfg. semiconductor integrated circuit device |
| 04/25/2007 | CN1312732C Film removing apparatus, film removing method and substrate processing system |
| 04/25/2007 | CN1312626C Method for producing an electrical circuit |
| 04/25/2007 | CN1312533C Etching method and method for mfg circuit device thereby |
| 04/25/2007 | CN1312219C Thermosetting resin composition, epoxy resin moulding material and semiconductor device |
| 04/24/2007 | US7210108 Structure of power supply path utilized in design of integrated circuit |
| 04/24/2007 | US7209845 Configurable voltage regulator |
| 04/24/2007 | US7209368 Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making |
| 04/24/2007 | US7209366 Delivery regions for power, ground and I/O signal paths in an IC package |
| 04/24/2007 | US7209362 Multilayer ceramic substrate with a cavity |
| 04/24/2007 | US7209360 Leak-tight system for boxes containing electrical and electronic components |
| 04/24/2007 | US7209355 Cooling device and an electronic apparatus including the same |
| 04/24/2007 | US7209354 Ball grid array package with heat sink device |
| 04/24/2007 | US7209027 Fuse structure |
| 04/24/2007 | US7209025 Multilayer inductor with shielding plane |
| 04/24/2007 | US7209011 Method and apparatus for synthesizing high-frequency signals for wireless communications |
| 04/24/2007 | US7208844 Semiconductor device |
| 04/24/2007 | US7208843 Routing design to minimize electromigration damage to solder bumps |
| 04/24/2007 | US7208842 Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof |
| 04/24/2007 | US7208841 Semiconductor device with strain relieving bump design |
| 04/24/2007 | US7208840 Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module |
| 04/24/2007 | US7208839 Semiconductor component assemblies having interconnects |
| 04/24/2007 | US7208838 Semiconductor device, circuit board, and electronic instrument suitable for stacking and having a through hole |
| 04/24/2007 | US7208837 Semiconductor chip capable of implementing wire bonding over active circuits |
| 04/24/2007 | US7208836 Integrated circuitry and a semiconductor processing method of forming a series of conductive lines |
| 04/24/2007 | US7208835 Integrated circuit package and assembly thereof |
| 04/24/2007 | US7208834 Bonding structure with pillar and cap |
| 04/24/2007 | US7208833 Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate |
| 04/24/2007 | US7208832 Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device |
| 04/24/2007 | US7208831 Faulty electrical continuity between the wiring layer and the via section avoided by integrally forming the connecting portion with the first wiring layer and having a curved boundary between a connecting side and wiring layer surface |
| 04/24/2007 | US7208830 Interconnect shunt used for current distribution and reliability redundancy |
| 04/24/2007 | US7208829 Semiconductor component |
| 04/24/2007 | US7208828 Semiconductor package with wire bonded stacked dice and multi-layer metal bumps |
| 04/24/2007 | US7208827 Encasing arrangement for a semiconductor component |
| 04/24/2007 | US7208826 Semiconductor device and method of manufacturing the same |
| 04/24/2007 | US7208825 Stacked semiconductor packages |
| 04/24/2007 | US7208824 Land grid array module |
| 04/24/2007 | US7208823 Semiconductor arrangement comprising transistors based on organic semiconductors and non-volatile read-write memory cells |
| 04/24/2007 | US7208822 Integrated circuit device, electronic module for chip cards using said device and method for making same |
| 04/24/2007 | US7208821 Multichip leadframe package |
| 04/24/2007 | US7208820 Substrate having a plurality of I/O routing arrangements for a microelectronic device |
| 04/24/2007 | US7208819 Power module package having improved heat dissipating capability |
| 04/24/2007 | US7208818 Power semiconductor package |
| 04/24/2007 | US7208817 Semiconductor device |
| 04/24/2007 | US7208816 Electronic circuit device and manufacturing method thereof |
| 04/24/2007 | US7208791 Integrated circuit devices including a capacitor |
| 04/24/2007 | US7208781 Semiconductor device having fuses |
| 04/24/2007 | US7208778 Power amplifier having high heat dissipation |
| 04/24/2007 | US7208776 Fuse corner pad for an integrated circuit |
| 04/24/2007 | US7208773 Cap for semiconductor device |
| 04/24/2007 | US7208772 High power light emitting diode package |
| 04/24/2007 | US7208759 Semiconductor integrated circuit device and method of testing the same |
| 04/24/2007 | US7208758 Dynamic integrated circuit clusters, modules including same and methods of fabricating |