| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/26/2007 | US20070090518 Microelectronic cooling apparatus and associated method |
| 04/26/2007 | US20070090517 Stacked die package with thermally conductive block embedded in substrate |
| 04/26/2007 | US20070090516 Heated substrate support and method of fabricating same |
| 04/26/2007 | US20070090515 Semiconductor structure and method of assembly |
| 04/26/2007 | US20070090514 Semiconductor structure and method of manufacture |
| 04/26/2007 | US20070090513 Power module fabrication method and structure thereof |
| 04/26/2007 | US20070090512 Signal transmission line |
| 04/26/2007 | US20070090511 Power core devices and methods of making thereof |
| 04/26/2007 | US20070090510 Package structure for solid-state lighting devices and method of fabricating the same |
| 04/26/2007 | US20070090509 Electromagnetic interference circuit package shield |
| 04/26/2007 | US20070090508 Multi-chip package structure |
| 04/26/2007 | US20070090507 Multi-chip package structure |
| 04/26/2007 | US20070090506 Interposer for compliant interfacial coupling |
| 04/26/2007 | US20070090505 Apparatus and method for manufacturing imaging device package |
| 04/26/2007 | US20070090504 Optical sensor chip package |
| 04/26/2007 | US20070090503 Semiconductor package having an optical device and the method of making the same |
| 04/26/2007 | US20070090502 Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages |
| 04/26/2007 | US20070090501 Lead frame |
| 04/26/2007 | US20070090500 Housed DRAM chip for high-speed applications |
| 04/26/2007 | US20070090499 Production process for manufacturing such semiconductor package |
| 04/26/2007 | US20070090498 Stack type semiconductor package module utilizing solder coated stacking protrusions and method for manufacturing the same |
| 04/26/2007 | US20070090497 Leadframes for improved moisture reliability of semiconductor devices |
| 04/26/2007 | US20070090496 Electronic module and method of assembling the same |
| 04/26/2007 | US20070090495 Thin package system with external terminals |
| 04/26/2007 | US20070090494 Insulation-coated conductor and manufacturing method thereof |
| 04/26/2007 | US20070090493 Fabrication of nitrogen containing regions on silicon containing regions in integrated circuits, and integrated circuits obtained thereby |
| 04/26/2007 | US20070090492 Semiconductor device with capacitively coupled field plate |
| 04/26/2007 | US20070090490 Wafer-to-wafer stack with supporting pedestal |
| 04/26/2007 | US20070090482 High-breakdown voltage semiconductor switching device and switched mode power supply apparatus using the same |
| 04/26/2007 | US20070090477 Photodiode array, method for manufacturing same, and radiation detector |
| 04/26/2007 | US20070090461 Ferroelectric Capacitor with Parallel Resistance for Ferroelectric Memory |
| 04/26/2007 | US20070090460 Electrostatic protection systems and methods |
| 04/26/2007 | US20070090434 Power semiconductor device and method therefor |
| 04/26/2007 | US20070090405 Charge compensated dielectric layer structure and method of making the same |
| 04/26/2007 | US20070090356 Semiconductor device |
| 04/26/2007 | US20070090355 Single separable electrode and self-contained pad viability tester |
| 04/26/2007 | US20070089904 Electronic Component |
| 04/26/2007 | US20070089865 Brazed wick for a heat transfer device and method of making same |
| 04/26/2007 | US20070089291 Electronic part mounting substrate and method for producing same |
| 04/26/2007 | DE202007001910U1 Speichermodul mit Kühlkörper Memory module with heatsink |
| 04/26/2007 | DE202007001194U1 Einspannvorrichtung zum Befestigen eines Kühlkörpers an eine Schaltungsplatte Jig for attaching a heat sink to a circuit board |
| 04/26/2007 | DE112005001322T5 Gegenstrom-Mikro-Wärmetauscher mit optimaler Wirksamkeit Counter-current micro-heat exchanger with an optimum effectiveness |
| 04/26/2007 | DE112005001302T5 Vorrichtung und Verfahren zur wirksamen Zufuhr von Flüssigkeit zum Kühlen eines Wärme erzeugenden Geräts Apparatus and method for effective supply of liquid for cooling a heat generating unit |
| 04/26/2007 | DE112005001296T5 Halbleitervorrichtung mit reduziertem Kontaktwiderstand A semiconductor device with reduced contact resistance |
| 04/26/2007 | DE112005001179T5 Verbesserte dielektrische Passivierung für Halbleiterbauelemente Improved dielectric passivation for semiconductor devices |
| 04/26/2007 | DE112005001094T5 Thermoelektrische Nano-Draht-Einrichtung Thermoelectric nano-wire device |
| 04/26/2007 | DE10303449B4 Verfahren zum Umhüllen eines elektronischen Bauelementes Process for coating an electronic component |
| 04/26/2007 | DE10201645B4 Verfahren zur Codierung und Authentifizierung von Halbleiterschaltungen A method of coding and authentication of semiconductor circuits |
| 04/26/2007 | DE102006044808A1 Halbleitervorrichtung Semiconductor device |
| 04/26/2007 | DE102006007611A1 Semiconductor component with displacement-based buried conductor path system, has offset /displaced network in boundary zone between semiconductor layers |
| 04/26/2007 | DE102005051571A1 Photodioden-Chip hoher Grenzfrequenz Photodiode chip high cut-off frequency |
| 04/26/2007 | DE102005051332A1 Semiconductor substrate for producing semiconductor component, includes monocrystalline material having crystal structure compressed in areas with extrinsic, permanent curvature |
| 04/26/2007 | DE102005051065A1 Integrated semiconductor circuit for e.g. mobile phone, has signal distribution unit to output switch control signal to first switch delayed by first time interval and to second and third switches delayed by second time interval |
| 04/26/2007 | DE102005051036A1 Method for fabricating an integrated module, requires housing material for functioning together holding structure in substrate |
| 04/26/2007 | DE102005050534A1 Leistungshalbleitermodul The power semiconductor module |
| 04/26/2007 | DE102005050515A1 Flächensubstrat mit elektrisch leitender Struktur Surface substrate with conductive structure |
| 04/26/2007 | DE102005049872A1 IC-Bauelement mit Kühlanordnung IC device with cooling arrangement |
| 04/26/2007 | DE102005049687A1 Leistungshalbleiterbauteil in Flachleitertechnik mit vertikalem Strompfad Power semiconductor component in flat-wire technology with vertical current path |
| 04/26/2007 | DE102005049279B3 Halbleiterspeicherbauelement und Herstellungsverfahren The semiconductor memory device and manufacturing method |
| 04/26/2007 | DE102005049248A1 Housed dynamic random access memory chip for high-speed applications comprises chip housing, chip having memory cell arrays, chip pads on surface of chip, and bonding wires for wiring chip pads to external housing connections |
| 04/26/2007 | DE102005049232A1 Integrierter Schaltkreis und Verfahren zum Betreiben eines integrierten Schaltkreises Integrated circuit and method of operating an integrated circuit |
| 04/26/2007 | DE10007434B4 Trägermodul für eine Mikro-BGA-Vorrichtung Support module for a micro-BGA device |
| 04/26/2007 | CA2563480A1 Power circuit package and fabrication method |
| 04/25/2007 | EP1777822A2 Semiconductor device |
| 04/25/2007 | EP1777775A1 Transmission line substrate and semiconductor package |
| 04/25/2007 | EP1777746A2 A package having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuit and methods of forming thereof |
| 04/25/2007 | EP1777745A2 Power core device including a capacitor and method of making thereof |
| 04/25/2007 | EP1777744A2 IC-package having an array of embedded capacitors for low noise power delivery and for decoupling in the mid-frequency range of 1MHz to 3GHz. Methods of forming the IC-package. |
| 04/25/2007 | EP1777743A2 Lead frame |
| 04/25/2007 | EP1777742A2 Semiconductor chip with through via and method of manufacturing the semiconductor chip |
| 04/25/2007 | EP1777741A2 Electronics assembly and electronics package carrier therefor |
| 04/25/2007 | EP1777740A2 Semiconductor device and manufacturing method of the same |
| 04/25/2007 | EP1777739A2 Semiconductor device and fabrication method therefor |
| 04/25/2007 | EP1777645A2 Semiconductor device |
| 04/25/2007 | EP1777278A1 Adhesive composition and sheet having an adhesive layer of the composition |
| 04/25/2007 | EP1777194A2 Method for forming microelectronic spring structures on a substrate |
| 04/25/2007 | EP1776715A1 Method for forming a gate electrode having a metal |
| 04/25/2007 | EP1723836A4 A radio frequency circuit board topology |
| 04/25/2007 | EP1634039B1 Octagonal pedestal for stabilizing filling |
| 04/25/2007 | EP1532683A4 Prevention of tampering in electronic devices |
| 04/25/2007 | EP1525586B1 Sublithographic nanoscale memory architecture |
| 04/25/2007 | EP1444541B1 Multilayer monolithic electronic device and method for making same |
| 04/25/2007 | EP1425109B1 Electro-optical component including a fluorinated poly (phenylene ether ketone) protective coating and related methods |
| 04/25/2007 | EP1386356B1 Fluxless flip chip interconnection |
| 04/25/2007 | EP1376452B1 Multi media card and its manufacturing method |
| 04/25/2007 | EP1358675B1 Electronic assembly comprising substrate with embedded capacitors and methods of manufacture |
| 04/25/2007 | EP1323761B1 Polyphenol resin, process for its production, epoxy resin composition and its use |
| 04/25/2007 | EP1266399A4 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners |
| 04/25/2007 | EP1021827B1 Dual damascene metallization |
| 04/25/2007 | EP1008176B1 Method for making an anisotropic conductive coating with conductive inserts |
| 04/25/2007 | CN2894209Y Micro-jet flow matrix impact radiator |
| 04/25/2007 | CN2893930Y Support improved structure for light-emitting diode |
| 04/25/2007 | CN2893922Y Improved large-power lead wire frame |
| 04/25/2007 | CN2893921Y Total colour sidelight type SMD support |
| 04/25/2007 | CN2893920Y Integrated circuit package structure |
| 04/25/2007 | CN2893919Y Semiconductor and lead wire bonded chip size encapsulation used thereof |
| 04/25/2007 | CN2893918Y Power transistor radiating device capable of raising voltage-resisting class |
| 04/25/2007 | CN1954443A Electronic part and method of producing the same |
| 04/25/2007 | CN1954427A Power semiconductor assembly |
| 04/25/2007 | CN1954426A System for shielding integrated circuits |