| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/01/2007 | US7211878 Semiconductor nonvolatile memory, method of recording data in the semiconductor nonvolatile memory and method of reading data from the semiconductor nonvolatile memory |
| 05/01/2007 | US7211877 Chip scale surface mount package for semiconductor device and process of fabricating the same |
| 05/01/2007 | US7211868 Protection circuit device using MOSFETs and a method of manufacturing the same |
| 05/01/2007 | US7211842 System with meshed power and signal buses on cell array |
| 05/01/2007 | US7211742 Fire resistant, forced air cooled enclosure for computer digital data storage device |
| 05/01/2007 | US7211512 Selective electroless-plated copper metallization |
| 05/01/2007 | US7211510 Stacking circuit elements |
| 05/01/2007 | US7211507 PE-ALD of TaN diffusion barrier region on low-k materials |
| 05/01/2007 | US7211505 Production method for wiring structure of semiconductor device |
| 05/01/2007 | US7211504 Process and arrangement for the selective metallization of 3D structures |
| 05/01/2007 | US7211497 Method for fabricating semiconductor devices |
| 05/01/2007 | US7211496 Freestanding multiplayer IC wiring structure |
| 05/01/2007 | US7211495 Semiconductor devices having a capacitor and methods of manufacturing the same |
| 05/01/2007 | US7211476 Semiconductor device and method of manufacturing the same |
| 05/01/2007 | US7211472 Method for producing a multichip module and multichip module |
| 05/01/2007 | US7211471 Exposed lead QFP package fabricated through the use of a partial saw process |
| 05/01/2007 | US7211469 Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same |
| 05/01/2007 | US7211468 Method for encapsulating a plurality of electronic components |
| 05/01/2007 | US7211467 Method for fabricating leadless packages with mold locking characteristics |
| 05/01/2007 | US7211465 Method of using capacitive bonding in a high frequency integrated circuit |
| 05/01/2007 | US7211464 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices |
| 05/01/2007 | US7211460 Methods for exposing device features on a semiconductor device |
| 05/01/2007 | US7211459 Fabrication method of an ion sensitive field effect transistor |
| 05/01/2007 | US7211453 Method and apparatus for personalization of semiconductor |
| 05/01/2007 | US7211451 Process for producing a component module |
| 05/01/2007 | US7211449 Enhanced uniqueness for pattern recognition |
| 05/01/2007 | US7211448 Semiconductor device manufacturing method capable of reliable inspection for hole opening and semiconductor devices manufactured by method |
| 05/01/2007 | US7211345 Membrane electrode assemblies for use in fuel cells |
| 05/01/2007 | US7211299 UV curing method and apparatus |
| 05/01/2007 | US7210862 Optical subassembly with a heat-radiating fin and an optical transceiver installing the same |
| 05/01/2007 | US7210859 Optoelectronic components with multi-layer feedthrough structure |
| 05/01/2007 | US7210635 System and method for encapsulation and protection of components |
| 05/01/2007 | US7210227 Decreasing thermal contact resistance at a material interface |
| 05/01/2007 | US7210224 Method for forming an antifuse |
| 05/01/2007 | CA2403231C Vertical electrical interconnections in a stack |
| 05/01/2007 | CA2392273C Active package for integrated circuit |
| 04/26/2007 | WO2007048090A2 Semiconductor assembly for improved device warpage and solder ball coplanarity |
| 04/26/2007 | WO2007047808A2 Stacked integrated circuit chip assembly |
| 04/26/2007 | WO2007047384A1 Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto |
| 04/26/2007 | WO2007046771A1 Method of forming component package |
| 04/26/2007 | WO2007046399A1 Thermosetting resin composition and photosemiconductor encapsulation material |
| 04/26/2007 | WO2007046271A1 Vertical signal path, printed board provided with such vertical signal path, and semiconductor package provided with such printed board and semiconductor element |
| 04/26/2007 | WO2007046197A1 Circuit module and circuit device using such circuit module |
| 04/26/2007 | WO2007046164A1 Cladding material and its fabrication method, method for molding cladding material, and heat sink using cladding material |
| 04/26/2007 | WO2007046062A2 Redistribution layer for wafer-level chip scale package and method therefor |
| 04/26/2007 | WO2007045786A1 Lighting structure comprising at least one light-emitting diode, method for making same and uses thereof |
| 04/26/2007 | WO2007045772A1 Device for passivating a transversal semiconductor component |
| 04/26/2007 | WO2007045568A2 Increasing electromigration lifetime and current density in ic |
| 04/26/2007 | WO2007045520A2 Ic component comprising a cooling arrangement |
| 04/26/2007 | WO2007045409A1 Monolithically integrable circuit arrangement |
| 04/26/2007 | WO2007045232A2 Photodiode chip having a high limit frequency |
| 04/26/2007 | WO2007045112A1 Power housing for semiconductor chips and the arrangement thereof for heat dissipation |
| 04/26/2007 | WO2007027790A3 Reversible-multiple footprint package and method of manufacturing |
| 04/26/2007 | WO2007025859A3 Semiconductor structure with a laterally functional construction |
| 04/26/2007 | WO2007002766A3 Optical transponder module with active heat transfer |
| 04/26/2007 | WO2006109206A3 Electronic circuit module comprising a heat producing component |
| 04/26/2007 | WO2006098820A3 Method of forming a semiconductor device having a diffusion barrier stack and structure thereof |
| 04/26/2007 | WO2006086151A3 Consolidated flip chip bga assembly process and apparatus |
| 04/26/2007 | US20070094756 Nanoscale shift register and signal demultiplexing using microscale/nanoscale shift registers |
| 04/26/2007 | US20070094632 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting ICs mis-processed during their manufacture |
| 04/26/2007 | US20070093246 Method and System for Providing Information to a Home System Regarding a Wireless Unit Roaming in a Visited System |
| 04/26/2007 | US20070093079 Imprinting method and imprinting apparatus |
| 04/26/2007 | US20070093060 Semiconductor device having a cu interconnection |
| 04/26/2007 | US20070093052 Semiconductor device have multiple wiring layers and method of producing the same |
| 04/26/2007 | US20070093030 Reduction of boron diffusivity in pfets |
| 04/26/2007 | US20070092995 Microelectronics grade metal substrate, related metal-embedded devices and methods for fabricating same |
| 04/26/2007 | US20070092987 Conductive electrode powder, a method for preparing the same, a method for preparing an electrode of a plasma display panel by using the same, and a plasma display panel comprising the same |
| 04/26/2007 | US20070092732 Low k dielectric inorganic/organic hybrid films and method of making |
| 04/26/2007 | US20070091572 Device with a heat source formed by a function element that is to be cooled, at least one heat sink, and least one intermediate layer located between the heat source and the heat sink |
| 04/26/2007 | US20070090549 Semiconductor device and method of fabricating the same |
| 04/26/2007 | US20070090548 Stacked alignment mark and method for manufacturing thereof |
| 04/26/2007 | US20070090547 Exclusion zone for stress-sensitive circuit design |
| 04/26/2007 | US20070090546 Interposer and method for fabricating the same |
| 04/26/2007 | US20070090545 Semiconductor device with improved encapsulation |
| 04/26/2007 | US20070090544 Integrated circuit package encapsulating a hermetically sealed device |
| 04/26/2007 | US20070090543 Plastic packaged device with die interface layer |
| 04/26/2007 | US20070090542 Semiconductor device with reduced package cross-talk and loss |
| 04/26/2007 | US20070090541 Bonding pad and display panel |
| 04/26/2007 | US20070090540 Semiconductor chip package and fabrication method thereof |
| 04/26/2007 | US20070090539 Semiconductor device and method for producing the same |
| 04/26/2007 | US20070090538 Wire drawing die |
| 04/26/2007 | US20070090537 Semiconductor package with controlled solder bump wetting |
| 04/26/2007 | US20070090536 Sensor having semiconductor chip and circuit chip |
| 04/26/2007 | US20070090535 Semiconductor Component of Semiconductor Chip Size with Flip-Chip-Like External Contacts |
| 04/26/2007 | US20070090534 Semiconductor module including a plurality of IC chips therein |
| 04/26/2007 | US20070090533 Closed loop thermally enhanced flip chip BGA |
| 04/26/2007 | US20070090532 Chip-packaging compositions including catalysts and hardeners, packages made therewith, and methods of assembling same |
| 04/26/2007 | US20070090531 Method of forming an electrical isolation associated with a wiring level on a semiconductor wafer |
| 04/26/2007 | US20070090530 Porous silicon undercut etching deterrent masks and related methods |
| 04/26/2007 | US20070090529 Method of fabricating a vertically mountable IC package |
| 04/26/2007 | US20070090528 Device, and manufacturing method for the device |
| 04/26/2007 | US20070090527 Integrated chip device in a package |
| 04/26/2007 | US20070090526 Semiconductor device that attains a high integration |
| 04/26/2007 | US20070090525 System and method for decreasing stress on solder holding BGA module to computer motherboard |
| 04/26/2007 | US20070090524 Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking |
| 04/26/2007 | US20070090523 Semiconductor component and methods to produce a semiconductor component |
| 04/26/2007 | US20070090522 Integrated circuit mounting for thermal stress relief useable in a multi-chip module |
| 04/26/2007 | US20070090521 Circuit device and method of manufacturing the same |
| 04/26/2007 | US20070090520 Cooling plate, bake unit, and substrate treating apparatus |
| 04/26/2007 | US20070090519 Encased thermal management device and method of making such a device |