| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/02/2007 | CN1957222A Multiple evaporator heat pipe assisted heat sink |
| 05/02/2007 | CN1957221A Integrated circuit heat pipe heat spreader with through mounting holes |
| 05/02/2007 | CN1957113A External palladium plating structure of semiconductor component and semiconductor device manufacturing method |
| 05/02/2007 | CN1957108A Multi-stage curing method of low k nano-porous films |
| 05/02/2007 | CN1957013A Resin composition for encapsulating semiconductor and semiconductor device |
| 05/02/2007 | CN1956647A Cooling apparatus and method of manufacturing the same |
| 05/02/2007 | CN1956646A Heat-generating electronic part cover and cover mounting method |
| 05/02/2007 | CN1956640A Radiator fastener and radiator device assembly |
| 05/02/2007 | CN1956635A Structure of thin wire of multi-dielectric layer circuit board and its manufacturing method |
| 05/02/2007 | CN1956213A Semiconductor material, production method thereof and semiconductor device |
| 05/02/2007 | CN1956212A 显示板 Dashboard |
| 05/02/2007 | CN1956202A Image chip package structure and its package method |
| 05/02/2007 | CN1956201A Package structure of image sensing device |
| 05/02/2007 | CN1956200A 薄膜晶体管阵列面板 The thin film transistor array panel |
| 05/02/2007 | CN1956194A Semiconductor device and method for fabricating the same |
| 05/02/2007 | CN1956193A Buried chip package structure |
| 05/02/2007 | CN1956192A Power circuit package and fabrication method |
| 05/02/2007 | CN1956190A Stacked semiconductor module |
| 05/02/2007 | CN1956189A Stacked semiconductor device and lower module of stacked semiconductor device |
| 05/02/2007 | CN1956188A Static protection device suitable for programmable element |
| 05/02/2007 | CN1956187A Semiconductor device that attains a high integration |
| 05/02/2007 | CN1956186A Semiconductor device and method for fabricating the same |
| 05/02/2007 | CN1956185A Internal connection wire structure and its manufacturing method |
| 05/02/2007 | CN1956184A High depth-width ratio open and its manufacturing method |
| 05/02/2007 | CN1956183A Electronic part built-in substrate and manufacturing method thereof |
| 05/02/2007 | CN1956182A Semiconductor mount circuit board, semiconductor device and method of manufacturing semiconductor package |
| 05/02/2007 | CN1956181A Surface structure of flip-chip substrate |
| 05/02/2007 | CN1956180A Substrate structure of electronic device packed by liquid resin drip |
| 05/02/2007 | CN1956179A Chip package structure and lug manufacturing process |
| 05/02/2007 | CN1956178A Photoelectric chip package structure, manufacturing method and its chip carrier |
| 05/02/2007 | CN1956177A Chip structure, chip package structure and its process |
| 05/02/2007 | CN1956176A 整流装置 Fairing |
| 05/02/2007 | CN1956175A Heat sink device |
| 05/02/2007 | CN1956174A Heak sink device |
| 05/02/2007 | CN1956173A Semiconductor device and method of manufacture thereof |
| 05/02/2007 | CN1956171A Methods of forming non-volatile memory devices and devices formed thereby |
| 05/02/2007 | CN1956166A Method of forming metal film and tungsten film |
| 05/02/2007 | CN1956165A Controlling lateral distribution of air gaps in interconnects |
| 05/02/2007 | CN1956158A Manufacturing method and middle structure of solder projection |
| 05/02/2007 | CN1955252A Nano metal fluid with high heat-transfer performance |
| 05/02/2007 | CN1955209A Method of producing high molecular weight organopolysiloxane, compositon comprising the high molecular weight organopolysiloxane, and optical semiconductor device sealed with cured product thereof |
| 05/02/2007 | CN1314305C Multi-layer thermal interface and method for forming a thermal interface with low thermal resistance |
| 05/02/2007 | CN1314207C Voice encoding device and voice decoding device, and voice transmission method |
| 05/02/2007 | CN1314126C Solid device and solid imaging unit and their production method and imaging device |
| 05/02/2007 | CN1314125C Module for optical apparatus and its mfg. method |
| 05/02/2007 | CN1314124C Integrated antifuse structure for FINFFT and CMOS devices and method for making same |
| 05/02/2007 | CN1314119C Semiconductor device and its producing method, curcuit board and electronic instrument |
| 05/02/2007 | CN1314118C 多芯片组件 Multi-chip module |
| 05/02/2007 | CN1314117C Structure and method of integrated circuit package |
| 05/02/2007 | CN1314116C Insulating film for use in semiconductor device |
| 05/02/2007 | CN1314115C Multiple metallic layers inner connecting wire structure |
| 05/02/2007 | CN1314114C Electronic device carrier adapted for transmitting high frequency signals |
| 05/02/2007 | CN1314113C Leadframe for preventing pin from short circuit and method for making semiconductor package having same |
| 05/02/2007 | CN1314112C Heat-tube radiator for heating electronic element |
| 05/02/2007 | CN1314111C Functional module with built-in radiating fin |
| 05/02/2007 | CN1314110C Semiconductor device and resin-made adhesive for assembling semiconductor device |
| 05/02/2007 | CN1314109C Multilayer chip carrier and substrate thereof, deallocation method for expanding signal panel weldering plate on chip carrier |
| 05/02/2007 | CN1314108C Semiconductor chip carrier, semiconductor package component and semiconductor package method |
| 05/02/2007 | CN1314107C Surface adhesive type prefocus cup structure for placing optical crystal chip |
| 05/02/2007 | CN1314102C Semiconductor device and method for fabricating the same |
| 05/02/2007 | CN1314101C Reliable low-k interconnect structure with hybrid dielectric |
| 05/02/2007 | CN1314100C Semiconductor device and its manufacture |
| 05/02/2007 | CN1314093C Apparatus for molding a semiconductor wafer and process therefor |
| 05/02/2007 | CN1314077C Semiconductor device and its manufacturing method |
| 05/02/2007 | CN1314056C Spiral inductor and transformer |
| 05/02/2007 | CN1313902C Microflute evaporating and cooling method and apparatus using same |
| 05/02/2007 | CN1313886C Device manufacturing method |
| 05/01/2007 | USRE39603 Process for manufacturing semiconductor device and semiconductor wafer |
| 05/01/2007 | US7213218 Simulation model for design of semiconductor device, thermal drain noise analysis method, simulation method, and simulation apparatus |
| 05/01/2007 | US7212422 Stacked layered type semiconductor memory device |
| 05/01/2007 | US7212405 Method and apparatus for providing distributed fluid flows in a thermal management arrangement |
| 05/01/2007 | US7212265 Method of manufacturing an LCD having the amorphous portion of a transparent conductive layer removed |
| 05/01/2007 | US7212088 Electrical connecting element and a method of making such an element |
| 05/01/2007 | US7212022 System and method for measuring time dependent dielectric breakdown with a ring oscillator |
| 05/01/2007 | US7211934 Electronic device and method of manufacturing the same |
| 05/01/2007 | US7211904 Pad structure for bonding pad and probe pad and manufacturing method thereof |
| 05/01/2007 | US7211903 Semiconductor device and manufacturing method of them |
| 05/01/2007 | US7211902 Method of forming a bonding pad structure |
| 05/01/2007 | US7211901 Self-coplanarity bumping shape for flip chip |
| 05/01/2007 | US7211900 Thin semiconductor package including stacked dies |
| 05/01/2007 | US7211899 Circuit substrate and method for fabricating the same |
| 05/01/2007 | US7211898 cross-linked self-assembled monolayers between Si surface and metal wiring, thereby offering good adhesion ability and anti-diffusion ability |
| 05/01/2007 | US7211897 Semiconductor device and method for fabricating the same |
| 05/01/2007 | US7211896 Semiconductor device and method of manufacturing the same |
| 05/01/2007 | US7211894 Capacitor-related systems for addressing package/motherboard resonance |
| 05/01/2007 | US7211893 Integrating chip scale packaging metallization into integrated circuit die structures |
| 05/01/2007 | US7211892 Semiconductor device having a particular electrode structure |
| 05/01/2007 | US7211891 Electronic heat pump device, laser component, optical pickup and electronic equipment |
| 05/01/2007 | US7211890 Integrating thermoelectric elements into wafer for heat extraction |
| 05/01/2007 | US7211889 Semiconductor package and method for manufacturing the same |
| 05/01/2007 | US7211888 Encapsulation of pin solder for maintaining accuracy in pin position |
| 05/01/2007 | US7211887 connection arrangement for micro lead frame plastic packages |
| 05/01/2007 | US7211886 Three-dimensional multichip stack electronic package structure |
| 05/01/2007 | US7211885 Vertical electrical interconnections in a stack |
| 05/01/2007 | US7211884 Implantable medical device construction using a flexible substrate |
| 05/01/2007 | US7211883 Semiconductor chip package |
| 05/01/2007 | US7211882 LED package structure and method for making the same |
| 05/01/2007 | US7211881 Structure for containing desiccant |
| 05/01/2007 | US7211880 Photoelectric conversion apparatus and manufacturing method of same |
| 05/01/2007 | US7211879 Semiconductor package with chamfered corners and method of manufacturing the same |