Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2007
05/03/2007US20070096283 Configuration of an electronic device
05/03/2007US20070096282 Integrated circuit package system including high-density small footprint system-in-package
05/03/2007US20070096281 Implantable microelectronic device and method of manufacture
05/03/2007US20070096280 Image sensor module structure and a method for manufacturing the same
05/03/2007US20070096279 Protecting structure and manufacturing method for electronic packaging contacts
05/03/2007US20070096278 Semiconductor unit, and power conversion system and on-vehicle electrical system using the same
05/03/2007US20070096277 Packaging for high speed integrated circuits
05/03/2007US20070096276 Structure and manufacturing method of power semiconductor with twin metal and ceramic plates
05/03/2007US20070096275 Supporting frame for surface-mount diode package
05/03/2007US20070096274 IMS formed as can for semiconductor housing
05/03/2007US20070096273 Reduction of Electromagnetic Interference in Integrated Circuit Device Packages
05/03/2007US20070096272 Light emitting diode package
05/03/2007US20070096271 Substrate frame
05/03/2007US20070096270 Semiconductor device package with integrated heat spreader
05/03/2007US20070096269 Leadframe for semiconductor packages
05/03/2007US20070096268 Integrated circuit packaging
05/03/2007US20070096267 Motherboard with selective chip layout
05/03/2007US20070096266 High density three dimensional semiconductor die package
05/03/2007US20070096265 Multiple die integrated circuit package
05/03/2007US20070096264 Damascene structure with high moisture-resistant oxide and method for making the same
05/03/2007US20070096246 Semiconductor device
05/03/2007US20070096245 Semiconductor device and manufacturing method for the same
05/03/2007US20070096221 Semiconductor device comprising copper-based contact plug and a method of forming the same
05/03/2007US20070096214 Electrostatic discharge protection circuit and driving circuit for an LCD using the same
05/03/2007US20070096213 Electro-static discharge protection circuit
05/03/2007US20070096165 In-situ wet chemical process monitor
05/03/2007US20070096164 Sensing system
05/03/2007US20070096160 High frequency chip packages with connecting elements
05/03/2007US20070096137 Semiconductor device and method of manufacturing semiconductor device
05/03/2007US20070096095 Test pattern for semiconductor device and method for measuring pattern shift
05/03/2007US20070096094 Methods and apparatus for designing and using micro-targets in overlay metrology
05/03/2007US20070096093 Calibration technique for measuring gate resistance of power MOS gate device at wafer level
05/03/2007US20070096092 Semiconductor device fault detection system and method
05/03/2007US20070096091 Layer structure and removing method thereof and mehod of testing semiconductor machine
05/03/2007US20070095652 Dendritic fiber material
05/03/2007US20070095569 Enhanced blind-mated input/output card cassette packaging concept
05/03/2007US20070095566 Printed wiring board and printed circuit board using the same
05/03/2007US20070095383 Thermoelectric material, thermoelectric element, thermoelectric module and methods for manufacturing the same
05/03/2007US20070095288 Thermal processing method and thermal processing unit
05/03/2007DE112005001414T5 Verfahren zur Herstellung eines Elektronikmoduls A process for producing an electronic module
05/03/2007DE102006046986A1 Holding component for holding the cooling body module comprises an earthing module with a spring contact and an earthing region which is integrated in a covered opening to fix the earthing module to a holding frame
05/03/2007DE102006046820A1 Chip-level packaging method for integrated circuit, involves bonding singulated die chip to cap wafer such that ends of conductive paths on cap wafer are electrically connected to respective electrical contact points on die chips
05/03/2007DE102005052563A1 Semiconductor chip and production processes has adhesive-free three layer metallization with aluminum layer, diffusion blocking layer and diffusion solder layer
05/03/2007DE102005052053A1 Semiconductor structure and production process for a dielectric barrier stack has metal region and dielectric layer of low dielectric constant and barrier layer stack having two layers
05/03/2007DE102005052052A1 Semiconductor structure has metal region and dielectric layer of low dielectric constant with a three layer barrier stack of silicon carbide nitride and silicon nitride
05/03/2007DE102005051848A1 Temperature compensating circuit for a resistance measuring structure integrated in a semiconductor body has further resistance structure to measure temperature-dependent compensating voltage
05/03/2007DE102005051811A1 Semiconductor component with semiconductor chip in surface conductive frame technology has chip carrier on chip connection surface with metallic buffer layer and cover layer
05/03/2007DE102005002631B4 Mehrchippackung Multi-chip package
05/03/2007CA2627193A1 Wire embedded bridge
05/02/2007EP1780791A2 Power circuit package and fabrication method
05/02/2007EP1780790A2 Electronic part built-in substrate and manufacturing method therefor
05/02/2007EP1780789A1 Heat pipe heat sink
05/02/2007EP1780783A1 Methods for protecting metal surfaces
05/02/2007EP1780728A2 Electrode structure for use in an integrated circuit
05/02/2007EP1780242A2 Resin composition for sealing optical device and method of sealing semiconductor element
05/02/2007EP1780239A1 Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material
05/02/2007EP1779429A2 Multiple chip semiconductor device
05/02/2007EP1779428A2 Wiring substrate of a semiconductor component comprising external contact pads for external contacts and method for producing the same
05/02/2007EP1779427A2 Heat exchange apparatus with parallel flow
05/02/2007EP1779420A1 Economical assembly and connection technique by means of a printing method
05/02/2007EP1779202A2 Apparatus for suspending a chip-scale device and atomic clock system
05/02/2007EP1779053A1 Micro heat pipe with wedge capillaries
05/02/2007EP1779052A1 Heat transfer assembly
05/02/2007EP1778896A1 Method of barrier layer surface treatment to enable direct copper plating on barrier metal
05/02/2007EP1442153A4 Gcib processing to improve interconnection vias and improved interconnection via
05/02/2007EP1356508A4 Inkjet device encapsulated at the wafer scale
05/02/2007EP1307820A4 Crosspoint switch with switch matrix module
05/02/2007EP1042801B1 Method of selectively forming silicide
05/02/2007CN2896808Y Water-cooling radiating device and water cooling head
05/02/2007CN2896806Y Radiating-board sheet and circuit board configuration
05/02/2007CN2896793Y Circuit board arranged by non-signal through holes
05/02/2007CN2896529Y Crystal-coated luminous dipolar body with high luminance
05/02/2007CN2896528Y High-power LED package structure
05/02/2007CN2896527Y Improved self-adhesive conductive loading band
05/02/2007CN2896526Y Lead-wire frame
05/02/2007CN2896525Y 3-D colloid-molded lead-wire carriage
05/02/2007CN2896524Y Package body
05/02/2007CN2896523Y Spring-force-adjustable fixing fastener
05/02/2007CN2896522Y Improved radiating-fiu structure
05/02/2007CN2896521Y Radiating apparatus
05/02/2007CN2896520Y Integrated circuit-board enclosed super-thin radiating structure
05/02/2007CN2896519Y CPU radiating fan with support structure
05/02/2007CN2896518Y Chip packing structure
05/02/2007CN1957649A 多层印刷配线板 Multilayer printed wiring board
05/02/2007CN1957483A Thermoelectric nano-wire devices
05/02/2007CN1957472A Integrated circuit chip with electrostatic discharge protection device
05/02/2007CN1957469A Manufacture of porous diamond films
05/02/2007CN1957468A Bottom heat spreader
05/02/2007CN1957467A Heat sink made from diamond-copper composite material containing boron
05/02/2007CN1957466A Use of nanoscale particles for creating scratch-resistant protective layers on semiconductor chips
05/02/2007CN1957465A Semiconductor device and wiring board
05/02/2007CN1957464A Semiconductor device, wiring board and manufacturing method thereof
05/02/2007CN1957463A Double density method for wirebond interconnect
05/02/2007CN1957462A Vertically stacked semiconductor device
05/02/2007CN1957455A Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
05/02/2007CN1957451A Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin
05/02/2007CN1957450A Solder bumps formation using paste retaining its shape after UV irradiation
05/02/2007CN1957316A Modularization expansible thermolysis resolve scheme
05/02/2007CN1957315A System for efficiently cooling a processor
05/02/2007CN1957296A Cooling for projection light emitting diode
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