| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/09/2007 | CN1959966A Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink |
| 05/09/2007 | CN1959965A Ripple heat dissipation techniques of single sided aluminum substrate |
| 05/09/2007 | CN1959964A 电容器及其制造方法 Capacitor and manufacturing method |
| 05/09/2007 | CN1959963A Method and structure for packaging power module |
| 05/09/2007 | CN1959955A Method of forming an electrical isolation associated with a wiring level on a semiconductor wafer |
| 05/09/2007 | CN1959954A Film pattern forming method, device, electro-optical apparatus, and electronic appliance |
| 05/09/2007 | CN1959948A Chip capsulation structure, and fabricating method |
| 05/09/2007 | CN1959946A Method of designing package for semiconductor device, method of manufacturing the same, and layout design tool |
| 05/09/2007 | CN1959836A Electronic equipment |
| 05/09/2007 | CN1959197A Heat sink for lamp of light emitting diodes |
| 05/09/2007 | CN1958664A 液状环氧树脂组合物 A liquid epoxy resin composition |
| 05/09/2007 | CN1958663A 液状环氧树脂组成物 A liquid epoxy resin composition |
| 05/09/2007 | CN1315360C Thermal management and power delivery systems for integrated circuits |
| 05/09/2007 | CN1315195C Vertical conduction flip chip device with bump contacts on single surface |
| 05/09/2007 | CN1315192C Semiconductor memory device |
| 05/09/2007 | CN1315190C Semiconductor device including interconnects formed by damascene process and manufacturing method thereof |
| 05/09/2007 | CN1315189C Character line interface point arranging structure |
| 05/09/2007 | CN1315188C Semiconductor IC device |
| 05/09/2007 | CN1315187C Method for forming a wafer level chip scale package, and package formed thereby |
| 05/09/2007 | CN1315186C Method for manufacturing mini flip transistor |
| 05/09/2007 | CN1315185C Electronic device with carrier, method of manufacturing same |
| 05/09/2007 | CN1315184C Epoxy composition for semiconductor package, preparation method and semiconductor device using same |
| 05/09/2007 | CN1315183C Wiring substrate, circuit substrate, electro-optical device and its mfg. method, and electronic device |
| 05/09/2007 | CN1315177C Semiconductor device and method of fabricating semiconductor device |
| 05/09/2007 | CN1315174C Method for manufacturing liquid discharging head |
| 05/09/2007 | CN1315168C Wafer-class packaging technology and its chip structure |
| 05/09/2007 | CN1315166C Process for forming fusible links |
| 05/09/2007 | CN1315158C Method for selective electroplating of semiconductor device i/o pads |
| 05/09/2007 | CN1315096C IC module and IC card |
| 05/09/2007 | CN1315003C Electronic device and its making method, spattering target |
| 05/09/2007 | CN1314752C 环氧树脂组合物 The epoxy resin composition |
| 05/09/2007 | CN1314726C Resin compound for forming interlayer insualting layer of printed wiring board, resin for forming insulating layer using resin compound, copper foil coated with resin and copper-coating layer-pressing |
| 05/08/2007 | US7216327 Device for estimating number of board layers constituting board, system including the device, and method for estimating the same and program for executing the method |
| 05/08/2007 | US7215558 EMI shield for transceiver |
| 05/08/2007 | US7215551 Memory module assembly including heat sink attached to integrated circuits by adhesive |
| 05/08/2007 | US7215546 Pump, electronic apparatus, and cooling system |
| 05/08/2007 | US7215545 Liquid cooled diamond bearing heat sink |
| 05/08/2007 | US7215544 Apparatus for enhancing heat transfer efficiency of endothermic/exothermic article |
| 05/08/2007 | US7215543 Duct for cooling multiple components in a processor-based device |
| 05/08/2007 | US7215531 Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board |
| 05/08/2007 | US7215361 Method for automated testing of the modulation transfer function in image sensors |
| 05/08/2007 | US7215065 Surface acoustic wave device, package for the device, and method of fabricating the device |
| 05/08/2007 | US7215033 Wafer level stack structure for system-in-package and method thereof |
| 05/08/2007 | US7215031 Multi chip package |
| 05/08/2007 | US7215030 Lead-free semiconductor package |
| 05/08/2007 | US7215029 Multilayer interconnection structure of a semiconductor |
| 05/08/2007 | US7215028 Semiconductor device and method for fabricating the same |
| 05/08/2007 | US7215027 Electrical coupling stack and processes for making same |
| 05/08/2007 | US7215026 Semiconductor module and method of forming a semiconductor module |
| 05/08/2007 | US7215025 Wafer scale semiconductor structure |
| 05/08/2007 | US7215024 Barrier-less integration with copper alloy |
| 05/08/2007 | US7215023 Power module |
| 05/08/2007 | US7215022 Multi-die module |
| 05/08/2007 | US7215021 Electronic device |
| 05/08/2007 | US7215020 Semiconductor device having metal plates and semiconductor chip |
| 05/08/2007 | US7215019 Semiconductor chip assembly with pillar press-fit into ground plane |
| 05/08/2007 | US7215018 Stacked die BGA or LGA component assembly |
| 05/08/2007 | US7215017 Wafer level package, wafer level packaging procedure for making wafer level package |
| 05/08/2007 | US7215016 Multi-chips stacked package |
| 05/08/2007 | US7215015 Imaging system |
| 05/08/2007 | US7215014 Solderable metal finish for integrated circuit package leads and method for forming |
| 05/08/2007 | US7215013 Semiconductor device and semiconductor apparatus |
| 05/08/2007 | US7215012 Space-efficient package for laterally conducting device |
| 05/08/2007 | US7215011 Flip chip in leaded molded package and method of manufacture thereof |
| 05/08/2007 | US7215010 Device for packing electronic components using injection molding technology |
| 05/08/2007 | US7215009 Expansion plane for PQFP/TQFP IR—package design |
| 05/08/2007 | US7215008 In-line apparatus and method for manufacturing double-sided stacked multi-chip packages |
| 05/08/2007 | US7215007 Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards |
| 05/08/2007 | US7215006 Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement |
| 05/08/2007 | US7215005 Bipolar ESD protection structure |
| 05/08/2007 | US7215002 Electronically programmable antifuse and circuits made therewith |
| 05/08/2007 | US7215001 Semiconductor device and method of manufacturing the same |
| 05/08/2007 | US7215000 Selectively encased surface metal structures in a semiconductor device |
| 05/08/2007 | US7214997 Integrated optical device |
| 05/08/2007 | US7214962 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer |
| 05/08/2007 | US7214961 Semiconductor testing device and semiconductor testing method |
| 05/08/2007 | US7214889 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating |
| 05/08/2007 | US7214886 High performance chip carrier substrate |
| 05/08/2007 | US7214615 Method of manufacturing semiconductor device, semiconductor device, circuit substrate and electronic apparatus |
| 05/08/2007 | US7214609 Methods for forming single damascene via or trench cavities and for forming dual damascene via cavities |
| 05/08/2007 | US7214606 Method of fabricating a wire bond with multiple stitch bonds |
| 05/08/2007 | US7214605 Deposition of diffusion barrier |
| 05/08/2007 | US7214604 Method of fabricating ultra thin flip-chip package |
| 05/08/2007 | US7214597 Electronic components and method of fabricating the same |
| 05/08/2007 | US7214594 Method of making semiconductor device using a novel interconnect cladding layer |
| 05/08/2007 | US7214585 Methods of fabricating integrated circuits with openings that allow electrical contact to conductive features having self-aligned edges |
| 05/08/2007 | US7214577 Method of fabricating semiconductor integrated circuit device |
| 05/08/2007 | US7214576 Manufacturing method of semiconductor device |
| 05/08/2007 | US7214569 Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
| 05/08/2007 | US7214568 Semiconductor device configured for reducing post-fabrication damage |
| 05/08/2007 | US7214566 Semiconductor device package and method |
| 05/08/2007 | US7214564 Method of forming film bulk acoustic wave filter assembly |
| 05/08/2007 | US7214562 Method for encapsulating lead frame packages |
| 05/08/2007 | US7214561 Packaging assembly and method of assembling the same |
| 05/08/2007 | US7214116 Light-emitting diode and method for its production |
| 05/08/2007 | US7214103 Connecting a solenoid to a lead frame |
| 05/08/2007 | US7214069 Normally closed zero insertion force connector |
| 05/08/2007 | US7213977 Optical module with can package |
| 05/08/2007 | US7213739 Underfill fluxing curative |
| 05/08/2007 | US7213391 Cooling systems |