| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/10/2007 | US20070102801 Stack-type semiconductor device and method of manufacturing the same |
| 05/10/2007 | US20070102800 Pad redistribution chip for compactness, method of manufacturing the same, and stacked package using the same |
| 05/10/2007 | US20070102799 Ic card |
| 05/10/2007 | US20070102798 Ic card |
| 05/10/2007 | US20070102797 Electrode package for semiconductor device |
| 05/10/2007 | US20070102796 Power semiconductor module |
| 05/10/2007 | US20070102795 Radiator plate and semiconductor device |
| 05/10/2007 | US20070102794 Lead arrangement and chip package using the same |
| 05/10/2007 | US20070102793 Semiconductor chip and method of fabricating the same |
| 05/10/2007 | US20070102792 Multi-layer crack stop structure |
| 05/10/2007 | US20070102765 Layout structure of electrostatic discharge protection circuit |
| 05/10/2007 | US20070102764 Information storage medium, information reproducing apparatus, and information reproducing method |
| 05/10/2007 | US20070102757 Semiconductor device and a method of manufacturing the same |
| 05/10/2007 | US20070102701 Structure and Method for Parallel Testing of Dies on a Semiconductor Wafer |
| 05/10/2007 | US20070102700 Electrical Open/Short Contact Alignment Structure for Active Region vs. Gate Region |
| 05/10/2007 | US20070102530 Ic card |
| 05/10/2007 | US20070102482 Assembly of a component mounted on a transfer surface |
| 05/10/2007 | US20070102191 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
| 05/10/2007 | US20070102144 Radiating module and the manufacturing method thereof |
| 05/10/2007 | DE202007003496U1 Elektronische Einrichtung mit Wärmeabführung Electronic device with heat dissipation |
| 05/10/2007 | DE10333841B4 Verfahren zur Herstellung eines Nutzens mit in Zeilen und Spalten angeordneten Halbleiterbauteilpositionen und Verfahren zur Herstellung eines Halbleiterbauteils A process for preparing a panel with arranged in rows and columns semiconductor device positions and processes for the manufacture of a semiconductor device |
| 05/10/2007 | DE10224164B4 Eine zweidimensionale Struktur zum Bestimmen einer Überlagerungsgenauigkeit mittels Streuungsmessung A two-dimensional structure for determining an overlay accuracy using scatterometry |
| 05/10/2007 | DE102006003377B3 Semiconductor chip and electronic component has chip(s) integrated into chip housing with four sets of conductive leads connected both to external contacts and to upper and lower housing surfaces |
| 05/10/2007 | DE102005052208A1 Metamaterial mit der Fähigkeit zur linkshändigen Leitung elektromagnetischer Wellen Metamaterial having the ability to left-hand line of electromagnetic waves |
| 05/10/2007 | DE10144705B4 Vorrichtung zum Einstellen der Temperatur von Halbleiterbausteinen auf Testsystemen A device for adjusting the temperature of semiconductor devices on test systems |
| 05/09/2007 | EP1784007A2 Cycling LED heat spreader |
| 05/09/2007 | EP1783834A2 Support structures for semiconductor devices |
| 05/09/2007 | EP1783833A2 Heat Spreaders with Vias |
| 05/09/2007 | EP1783832A1 Interposer and interposer producing method |
| 05/09/2007 | EP1783829A1 Method for bonding electronic components |
| 05/09/2007 | EP1783548A2 Photosensitive composition |
| 05/09/2007 | EP1783169A2 Thermally conductive phase change materials |
| 05/09/2007 | EP1782665A1 Cooling assembly for an electrical appliance, and method for cooling liquid |
| 05/09/2007 | EP1782469A1 Electrical via connection and associated contact means as well as a method for their manufacture |
| 05/09/2007 | EP1782468A1 Electric device comprising a housing and a cooling body |
| 05/09/2007 | EP1782464A1 Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks |
| 05/09/2007 | EP1782455A1 Ic chip and its manufacturing method |
| 05/09/2007 | EP1782428A1 An organic ferroelectric or electret memory circuit and a method for making same |
| 05/09/2007 | EP1781741A1 Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoter |
| 05/09/2007 | EP1668692A4 Adjustable self-aligned air gap dielectric for low capacitance wiring |
| 05/09/2007 | EP1556896A4 Anti-reflective compositions comprising triazine compounds |
| 05/09/2007 | EP1552557A4 Flat plate heat transferring apparatus and manufacturing method thereof |
| 05/09/2007 | EP1523078B1 Optical semiconductor device |
| 05/09/2007 | EP1384268A4 Three-dimensional metal devices highly suspended above semiconductor substrate, their circuit model, and method for manufacturing the same |
| 05/09/2007 | EP1362005B1 Method for forming electrically conductive contact structures |
| 05/09/2007 | EP1222624B1 Non-contact or non-contact hybrid smart card for limiting risks of fraud |
| 05/09/2007 | EP1104017B1 Method of flip-chip mounting a semiconductor chip to a circuit board |
| 05/09/2007 | EP1060646B1 Method for manufacturing a resistor |
| 05/09/2007 | EP1042812B1 Method of making a semiconductor substrate with embedded isolating layer for integrated circuits |
| 05/09/2007 | CN2899406Y Radiator with down-blowing flow guide |
| 05/09/2007 | CN2899405Y Radiator |
| 05/09/2007 | CN2899404Y Radiating structure |
| 05/09/2007 | CN2899403Y Radiator |
| 05/09/2007 | CN2899117Y Radiating structure of light-emitting diodes |
| 05/09/2007 | CN2899116Y Solid-crystal conductive and heat-transfer packing structure of light-emitting diodes |
| 05/09/2007 | CN2899114Y Laminated chip packing structure |
| 05/09/2007 | CN2899113Y Superthin conducting wire packing structure |
| 05/09/2007 | CN2899112Y LED wireframe structure |
| 05/09/2007 | CN2899111Y Planar convex-point packing base plate of electronic device |
| 05/09/2007 | CN2899110Y Planar convex-point superthin packing base plate of electronic device |
| 05/09/2007 | CN2899109Y Packer structure, electronic packing structure and its connecting carrier plate |
| 05/09/2007 | CN2899108Y Tin-ball connector for packing integrated circuits |
| 05/09/2007 | CN2899107Y Radiating module structure |
| 05/09/2007 | CN2899106Y Chip electronic part |
| 05/09/2007 | CN1961429A Gate stack and gate stack etch sequence for metal gate integration |
| 05/09/2007 | CN1961428A Semiconductor package having integrated metal parts for thermal enhancement |
| 05/09/2007 | CN1961425A Method and apparatus for precise marking and placement of an object |
| 05/09/2007 | CN1961424A Chip having two groups of chip contacts |
| 05/09/2007 | CN1961423A Integrated circuit socket corner relief |
| 05/09/2007 | CN1961422A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 05/09/2007 | CN1961421A Integrated circuit stacking system and method |
| 05/09/2007 | CN1961418A Method of adhesion improvement for low K dielectrics to conductive materials |
| 05/09/2007 | CN1961415A Flexible leadframe structure and method for forming integrated circuit packages |
| 05/09/2007 | CN1961382A Method and apparatus for administering passivator to a conductor |
| 05/09/2007 | CN1961209A 集成电子传感器 Integrated electronic sensors |
| 05/09/2007 | CN1961191A Heat transfer device and method of making same |
| 05/09/2007 | CN1960088A Semiconductor device and method of manufacturing semiconductor device |
| 05/09/2007 | CN1960016A Light emitting diode |
| 05/09/2007 | CN1959993A Thin film transistor array substrate, manufacturing method for the same, and transflective liquid crystal display |
| 05/09/2007 | CN1959992A Thin film multilayer substrate, manufacturing method thereof, and liquid crystal display having thin film multilayer substrate |
| 05/09/2007 | CN1959991A Method of manufacturing symmetric arrays |
| 05/09/2007 | CN1959987A Improved calibration method for measuring gate resistance of power MOS gate device at wafer level |
| 05/09/2007 | CN1959986A 半导体器件 Semiconductor devices |
| 05/09/2007 | CN1959984A Thin film transistor, pixel structure, and method for repairing pixel structure |
| 05/09/2007 | CN1959983A Semiconductor element and process of manufacturing the same |
| 05/09/2007 | CN1959981A Capsulation structure of luminous secondary body |
| 05/09/2007 | CN1959980A Conductive structure, manufacturing method for conductive structure, element substrate, and manufacturing method for element substrate |
| 05/09/2007 | CN1959979A Semiconductor device and manufacturing method therof |
| 05/09/2007 | CN1959978A 半导体元件及其形成方法 Semiconductor device and method of forming |
| 05/09/2007 | CN1959977A Semiconductor device, method of forming wiring pattern, and method of generating mask wiring data |
| 05/09/2007 | CN1959976A Back-end metallation structure and manufacturing method thereof |
| 05/09/2007 | CN1959975A Semiconductor integrated circuit and packaging conductor frame thereof |
| 05/09/2007 | CN1959974A Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device |
| 05/09/2007 | CN1959973A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 05/09/2007 | CN1959972A Capsulation structure of semiconductor |
| 05/09/2007 | CN1959971A Extensive use type chip capsulation structure |
| 05/09/2007 | CN1959970A 半导体装置 Semiconductor device |
| 05/09/2007 | CN1959969A 散热器 Heat sink |
| 05/09/2007 | CN1959968A 散热器 Heat sink |
| 05/09/2007 | CN1959967A Heat sink and fabricating method |