| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/15/2007 | US7217645 Method for manufacturing semiconductor device and electronic device and method for calculating connection condition |
| 05/15/2007 | US7217631 Semiconductor device and method for fabricating the device |
| 05/15/2007 | US7217599 Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor |
| 05/15/2007 | US7217598 Method for manufacturing plastic ball grid array package with integral heatsink |
| 05/15/2007 | US7217597 Die stacking scheme |
| 05/15/2007 | US7217596 Stacked die module and techniques for forming a stacked die module |
| 05/15/2007 | US7217595 Sealed three dimensional metal bonded integrated circuits |
| 05/15/2007 | US7217594 Alternative flip chip in leaded molded package design and method for manufacture |
| 05/15/2007 | US7217581 Misalignment test structure and method thereof |
| 05/15/2007 | US7217580 Method for processing an integrated circuit |
| 05/15/2007 | US7217579 Voltage contrast test structure |
| 05/15/2007 | US7217370 Wiring board and process for producing the same |
| 05/15/2007 | US7216792 Self assembled nano-devices using DNA |
| 05/15/2007 | US7216695 Method of operating a thermal management system |
| 05/15/2007 | CA2520140C Split-channel antifuse array architecture |
| 05/15/2007 | CA2215338C Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys |
| 05/10/2007 | WO2007053686A2 Monolithically integrated semiconductor materials and devices |
| 05/10/2007 | WO2007053606A2 Multiple die integrated circuit package |
| 05/10/2007 | WO2007053523A2 Stacked module systems and methods |
| 05/10/2007 | WO2007053479A2 Contact pad structure for flip chip semiconductor die |
| 05/10/2007 | WO2007053383A2 Methods and apparatus for flip-chip-on-lead semiconductor package |
| 05/10/2007 | WO2007053376A2 Methods and apparatus for designing and using micro-targets in overlay metrology |
| 05/10/2007 | WO2007053308A2 Diffusion barrier layer for mems devices |
| 05/10/2007 | WO2007052799A1 Multilayer printed wiring board and process for producing the same |
| 05/10/2007 | WO2007052761A1 Ic chip mounted package |
| 05/10/2007 | WO2007052597A1 Electronic component package |
| 05/10/2007 | WO2007052476A1 Electronic circuit device and method for manufacturing same |
| 05/10/2007 | WO2007052273A2 Novel material and process for integrated ion chip |
| 05/10/2007 | WO2007052234A2 Surface treatments for contact pads used in semiconductor chip packages and methods of providing such surface treatments |
| 05/10/2007 | WO2007052199A1 Methods of packaging a semiconductor die and package formed by the methods |
| 05/10/2007 | WO2007052198A1 An air cavity package for a semiconductor die and methods of forming the air cavity package |
| 05/10/2007 | WO2007051765A2 Electrically programmable fuse |
| 05/10/2007 | WO2007051727A1 Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed fingers |
| 05/10/2007 | WO2007051718A2 Structure and method for monitoring stress-induced degradation of conductive interconnects |
| 05/10/2007 | WO2007051336A1 Method for bonding electronic components |
| 05/10/2007 | WO2007002902A3 Thermal interface material and method |
| 05/10/2007 | WO2006023594A3 High strain glass/glass-ceramic containing semiconductor-on-insulator structures |
| 05/10/2007 | WO2005122236A3 Semiconductor device with reduced contact resistance |
| 05/10/2007 | WO2005098335A3 Low-profile thermosyphon cooling system for computers |
| 05/10/2007 | US20070105459 Joining method and joining device |
| 05/10/2007 | US20070105454 Diode |
| 05/10/2007 | US20070105369 Semiconductor device and manufacturing method thereof |
| 05/10/2007 | US20070105367 Method for forming barrier layer |
| 05/10/2007 | US20070105366 Long-term heat-treated integrated circuit arrangements and methods for producing the same |
| 05/10/2007 | US20070105361 Method for forming a joint |
| 05/10/2007 | US20070105360 Method of Forming Bump, Method of Forming Image Sensor Using the Method, Semiconductor Chip and the Sensor so Formed |
| 05/10/2007 | US20070105357 Silicided recessed silicon |
| 05/10/2007 | US20070105346 Small chips with fan-out leads |
| 05/10/2007 | US20070105340 Interlayer bond to a substrate which, at least in regions on a surface, is provided with a coating of a metal, a method for production thereof and use |
| 05/10/2007 | US20070105284 Method for forming a memory cell comprising a semiconductor junction diode crystallized adjacent to a silicide |
| 05/10/2007 | US20070105283 Manufacturing method of semiconductor device and semiconductor device |
| 05/10/2007 | US20070105281 Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package |
| 05/10/2007 | US20070105280 Brace for wire loop |
| 05/10/2007 | US20070105278 Printed wiring board and method of manufacturing the same |
| 05/10/2007 | US20070105277 Solder joint flip chip interconnection |
| 05/10/2007 | US20070105274 Monolithically integrated semiconductor materials and devices |
| 05/10/2007 | US20070105272 Microelectronic devices and microelectronic support devices, and associated assemblies and methods |
| 05/10/2007 | US20070105263 Thin film semiconductor device, polycrystalline semiconductor thin film production process and production apparatus |
| 05/10/2007 | US20070105247 Method And Apparatus For Detecting The Endpoint Of A Chemical-Mechanical Polishing Operation |
| 05/10/2007 | US20070105246 Method of manufacturing a material compound wafer |
| 05/10/2007 | US20070105244 Analytical apparatus, processing apparatus, measuring and/or inspecting apparatus, exposure apparatus, substrate processing system, analytical method, and program |
| 05/10/2007 | US20070105243 Method and apparatus for semiconductor device production process monitoring and method and apparatus for estimating cross sectional shape of a pattern |
| 05/10/2007 | US20070104872 Method of sealing semiconductor element mounted on gold-plated printed circuit board |
| 05/10/2007 | US20070104605 Silver-containing particles, method and apparatus of manufacture, silver-containing devices made therefrom |
| 05/10/2007 | US20070103873 Heat sink module |
| 05/10/2007 | US20070103868 Electronic device cooling device and electronic device cooling method |
| 05/10/2007 | US20070103191 Semiconductor-integrated circuit utilizing magnetoresistive effect elements |
| 05/10/2007 | US20070103180 Universal wafer carrier for wafer level die burn-in |
| 05/10/2007 | US20070103144 Calibration pattern and calibration jig |
| 05/10/2007 | US20070102833 Integrated circuit device |
| 05/10/2007 | US20070102832 Plastic Semiconductor Package Having Improved Control of Dimensions |
| 05/10/2007 | US20070102831 Device and method of manufacturing the same |
| 05/10/2007 | US20070102830 Flexible printed circuit board |
| 05/10/2007 | US20070102829 Chip structure with solder bump and method for producing the same |
| 05/10/2007 | US20070102828 Fine pitch interconnect and method of making |
| 05/10/2007 | US20070102827 Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding |
| 05/10/2007 | US20070102826 Electronic Component Having at Least One Semiconductor Chip and Flip-Chip Contacts, and Method for Producing the Same |
| 05/10/2007 | US20070102825 Semiconductor package and method of fabricating same |
| 05/10/2007 | US20070102824 Tungsten plug structure of semiconductor device and method for forming the same |
| 05/10/2007 | US20070102823 Semiconductor device, electronic device and electronic apparatus |
| 05/10/2007 | US20070102822 Aluminum base target and process for producing the same |
| 05/10/2007 | US20070102821 Use of Supercritical Fluid for Low Effective Dielectric Constant Metallization |
| 05/10/2007 | US20070102820 Semiconductor integrated circuit |
| 05/10/2007 | US20070102819 Method for producing an integrated circuit assembly with an auxiliary indentation, particularly with aligning marks, and an integrated circuit arrangement |
| 05/10/2007 | US20070102818 Wiring, TFT substrate using the same, manufacturing method of TFT substrate, and LCD. |
| 05/10/2007 | US20070102817 Method and apparatus for reducing electrical interconnection fatigue |
| 05/10/2007 | US20070102816 Board structure, a ball grid array (BGA) package and method thereof, and a solder ball and method thereof |
| 05/10/2007 | US20070102815 Bumping process with self-aligned A1-cap and the elimination of 2nd passivation layer |
| 05/10/2007 | US20070102814 Semiconductor device and method of manufacturing the same |
| 05/10/2007 | US20070102813 Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device |
| 05/10/2007 | US20070102812 Reduction of macro level stresses in copper/Low-K wafers by altering aluminum pad/passivation stack to reduce or eliminate IMC cracking in post wire bonded dies |
| 05/10/2007 | US20070102811 Package having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuit and methods of forming thereof |
| 05/10/2007 | US20070102810 Sensor block |
| 05/10/2007 | US20070102809 Methods of fabricating a composite carbon nanotube thermal interface device |
| 05/10/2007 | US20070102808 Semiconductor module and radiator plate |
| 05/10/2007 | US20070102807 Coupling substrate for semiconductor components and method for producing the same |
| 05/10/2007 | US20070102806 Power distribution for high-speed integrated circuits |
| 05/10/2007 | US20070102805 Chip type electric device and method, and display device including the same |
| 05/10/2007 | US20070102803 Method for making stacked integrated circuits (ICs) using prepackaged parts |
| 05/10/2007 | US20070102802 Single chip and stack-type chip semiconductor package and method of manufacturing the same |