| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/16/2007 | CN1964036A A stacking type wafer packaging structure |
| 05/16/2007 | CN1964035A ESD protection circuit for high voltage of power supply by electrostatic elimination with low voltage component |
| 05/16/2007 | CN1964034A An electronic assembly and circuit board for same |
| 05/16/2007 | CN1964033A A flexible substrate for packaging |
| 05/16/2007 | CN1964032A 半导体装置 Semiconductor device |
| 05/16/2007 | CN1964031A Heat radiator |
| 05/16/2007 | CN1964030A Fastener of radiator |
| 05/16/2007 | CN1964029A Heat radiation module |
| 05/16/2007 | CN1964028A 散热器 Heat sink |
| 05/16/2007 | CN1964027A Heat radiator of computer CPU |
| 05/16/2007 | CN1964026A A slice radial radiator of cold bulbs for water drinking machine |
| 05/16/2007 | CN1964025A Heat radiator |
| 05/16/2007 | CN1964024A A porous silicon chip and its preparing method |
| 05/16/2007 | CN1964023A An array substrate of thin-film transistor and its manufacture method |
| 05/16/2007 | CN1964010A Electrical interconnection structure formation |
| 05/16/2007 | CN1964009A A stand of wire loop |
| 05/16/2007 | CN1964007A A method to manufacture packaging structure of 'L' shaped electric connection wafer level chip size |
| 05/16/2007 | CN1964006A Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same |
| 05/16/2007 | CN1963995A Processing method and semiconductor manufacturing method |
| 05/16/2007 | CN1963994A Processing method and semiconductor manufacturing method |
| 05/16/2007 | CN1962802A Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 05/16/2007 | CN1962713A Fluorine-containing phenol resin derivative and its composition and preparation method |
| 05/16/2007 | CN1316860C Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit |
| 05/16/2007 | CN1316858C High frequency circuit base board and its producing method |
| 05/16/2007 | CN1316744C Antifuse reroute of dies |
| 05/16/2007 | CN1316736C Electronic component mfg. device |
| 05/16/2007 | CN1316698C Shorter wavelength laser module and method of manufacturing the laser module |
| 05/16/2007 | CN1316628C 半导体器件 Semiconductor devices |
| 05/16/2007 | CN1316620C 半导体芯片 Semiconductor chip |
| 05/16/2007 | CN1316618C Semiconductor device, electrostatic discharging protection device and its making method |
| 05/16/2007 | CN1316617C 集成电路 IC |
| 05/16/2007 | CN1316616C Design of lithography alignment and overlay measurement marks on CMP finished damascene surface |
| 05/16/2007 | CN1316615C Integrated circuit and method for arranging integrated circuit electric bus grid |
| 05/16/2007 | CN1316614C Semiconductor devices |
| 05/16/2007 | CN1316613C Sandwich antireflection structural metal layer of semiconductor and making process thereof |
| 05/16/2007 | CN1316612C Electronic assembly with llaterally connected capacitors and mfg. method |
| 05/16/2007 | CN1316611C Wafer-level semiconductor package having lamination structure and making method thereof |
| 05/16/2007 | CN1316610C Chip packaging structure and chip and subtrate electric connection structure |
| 05/16/2007 | CN1316609C Semiconductor device and its producing method |
| 05/16/2007 | CN1316608C A heat radiation needle arrangement for improving LED temperature rise |
| 05/16/2007 | CN1316607C Semiconductor package with high heat radiation performance and making method thereof |
| 05/16/2007 | CN1316606C 半导体器件 Semiconductor devices |
| 05/16/2007 | CN1316605C Substrate for use in joining element and method thereof |
| 05/16/2007 | CN1316604C Semiconductor package device with layer-increasing structure and making method thereof |
| 05/16/2007 | CN1316596C Method of generating wiring pattern |
| 05/16/2007 | CN1316593C Method of forming metal line in semiconductor device |
| 05/16/2007 | CN1316591C Method of forming wiring structure and semiconductor device |
| 05/16/2007 | CN1316589C Method for locally increasing sidewall density by ion implantation |
| 05/16/2007 | CN1316585C 半导体器件 Semiconductor devices |
| 05/16/2007 | CN1316584C Semiconductor device and its mfg. method |
| 05/16/2007 | CN1316581C Encapsulated pin structure for improved reliability of wafer |
| 05/16/2007 | CN1316579C Semiconductor device and method of manufacturing the same |
| 05/16/2007 | CN1316578C Semiconductor device and its producing method, curcuit board and electronic instrument |
| 05/16/2007 | CN1316577C Chip scale surface mounted device and its process of manufacture |
| 05/16/2007 | CN1316566C Interconnects with improved barrier layer adhesion |
| 05/16/2007 | CN1316329C Scalable computer system having surface-mounted capacitive couplers for intercommunication |
| 05/16/2007 | CN1316309C Electronic device and its mfg. method |
| 05/16/2007 | CN1316224C Heat sink, control device having the heat sink and machine tool provided with the device |
| 05/15/2007 | USRE39628 Stackable flex circuit IC package and method of making same |
| 05/15/2007 | US7219286 Built off self test (BOST) in the kerf |
| 05/15/2007 | US7219247 Methods and apparatus for replacing cooling systems in operating computers |
| 05/15/2007 | US7218529 Circuit arrangement with a programmable memory element on a circuit board, with security against reprogramming |
| 05/15/2007 | US7218525 Fastener for heat sink |
| 05/15/2007 | US7218524 Locking device for heat dissipating device |
| 05/15/2007 | US7218523 Liquid cooling system |
| 05/15/2007 | US7218520 Retainer for heat sink |
| 05/15/2007 | US7218519 Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels |
| 05/15/2007 | US7218266 Electromagnetic wave absorber, method of manufacturing the same and appliance using the same |
| 05/15/2007 | US7218008 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 05/15/2007 | US7218007 Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices |
| 05/15/2007 | US7218006 Multi-chip stack package |
| 05/15/2007 | US7218005 Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same |
| 05/15/2007 | US7218004 Fusing nanowires using in situ crystal growth |
| 05/15/2007 | US7218003 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods |
| 05/15/2007 | US7218002 Electronic device and intermediate product of electronic device |
| 05/15/2007 | US7218001 Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components |
| 05/15/2007 | US7218000 Liquid solder thermal interface material contained within a cold-formed barrier and methods of making same |
| 05/15/2007 | US7217999 Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semiconductor chip on the interconnection board |
| 05/15/2007 | US7217998 Semiconductor device having a heat-dissipation member |
| 05/15/2007 | US7217997 Ground arch for wirebond ball grid arrays |
| 05/15/2007 | US7217996 Ball grid array socket having improved housing |
| 05/15/2007 | US7217995 Apparatus for stacking electrical components using insulated and interconnecting via |
| 05/15/2007 | US7217994 Stack package for high density integrated circuits |
| 05/15/2007 | US7217993 Stacked-type semiconductor device |
| 05/15/2007 | US7217992 Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device |
| 05/15/2007 | US7217991 Fan-in leadframe semiconductor package |
| 05/15/2007 | US7217990 Tape package having test pad on reverse surface and method for testing the same |
| 05/15/2007 | US7217989 Composition for selectively polishing silicon nitride layer and polishing method employing it |
| 05/15/2007 | US7217980 CMOS silicon-control-rectifier (SCR) structure for electrostatic discharge (ESD) protection |
| 05/15/2007 | US7217979 Semiconductor apparatus including a radiator for diffusing the heat generated therein |
| 05/15/2007 | US7217965 Semiconductor device including fuse elements and bonding pad |
| 05/15/2007 | US7217957 Optical transmission module |
| 05/15/2007 | US7217954 Silicon carbide semiconductor device and method for fabricating the same |
| 05/15/2007 | US7217946 Method for making a wire nanostructure in a semiconductor film |
| 05/15/2007 | US7217890 Method for fabricating a through-hole interconnection substrate and a through-hole interconnection substrate |
| 05/15/2007 | US7217888 Electronic parts packaging structure and method of manufacturing the same |
| 05/15/2007 | US7217887 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device |
| 05/15/2007 | US7217655 Electroplated CoWP composite structures as copper barrier layers |
| 05/15/2007 | US7217649 System and method for stress free conductor removal |
| 05/15/2007 | US7217646 Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement |