Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2007
05/17/2007US20070108606 Semiconductor device
05/17/2007US20070108605 Bump chip carrier semiconductor package system
05/17/2007US20070108604 Stacked integrated circuit leadframe package system
05/17/2007US20070108603 Method of putting isolated metallic interconnections onto a metallic substrate
05/17/2007US20070108602 MOS device with a high voltage isolation structure
05/17/2007US20070108601 Integrated circuit package system including ribbon bond interconnect
05/17/2007US20070108600 Semiconductor device
05/17/2007US20070108599 Semiconductor chip package with a metal substrate and semiconductor module having the same
05/17/2007US20070108598 Low Voltage Drop and High Thermal Performance Ball Grid Array Package
05/17/2007US20070108597 Integrated circuit package system with heat dissipation enclosure
05/17/2007US20070108596 Integrated circuit package system using heat slug
05/17/2007US20070108595 Semiconductor device with integrated heat spreader
05/17/2007US20070108594 Semiconductor apparatus
05/17/2007US20070108593 Zeolite sol and method for preparing the same, composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
05/17/2007US20070108592 Method for fabricating semiconductor package
05/17/2007US20070108591 Interposer and method for producing the same and electronic device
05/17/2007US20070108590 Semiconductor package system with thermal die bonding
05/17/2007US20070108589 Integrated circuit package system
05/17/2007US20070108588 Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device
05/17/2007US20070108587 Integrated circuit package system with a heat sink
05/17/2007US20070108586 Composite wiring board and manufacturing method thereof
05/17/2007US20070108585 Semiconductor package including a semiconductor die having redistributed pads
05/17/2007US20070108584 Transmitter module with improved heat dissipation
05/17/2007US20070108583 Integrated circuit package-on-package stacking system
05/17/2007US20070108582 Integrated circuit package system including shield
05/17/2007US20070108581 Offset integrated circuit package-on-package stacking system
05/17/2007US20070108580 Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same
05/17/2007US20070108579 Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
05/17/2007US20070108578 Semiconductor device and manufacturing method of the same
05/17/2007US20070108577 Image sensor module with a protection layer and a method for manufacturing the same
05/17/2007US20070108576 Packaging structure of RSMMC memory card
05/17/2007US20070108575 Semiconductor package that includes stacked semiconductor die
05/17/2007US20070108574 Chip stack package and manufacturing method thereof
05/17/2007US20070108573 Wafer level package having redistribution interconnection layer and method of forming the same
05/17/2007US20070108571 Method for fabricating semiconductor package with stacked chips
05/17/2007US20070108570 Semiconductor device and method of manufacturing the same
05/17/2007US20070108569 Integrated circuit package system with interconnect support
05/17/2007US20070108568 Integrated circuit package to package stacking system
05/17/2007US20070108567 Integrated circuit leadless package system
05/17/2007US20070108566 Integrated circuit package system with multi-planar paddle
05/17/2007US20070108565 Etched leadframe flipchip package system
05/17/2007US20070108564 Thermally enhanced power semiconductor package system
05/17/2007US20070108563 Semiconductor device
05/17/2007US20070108562 Semiconductor chip having bond pads
05/17/2007US20070108561 Image sensor chip package
05/17/2007US20070108560 Stackable power semiconductor package system
05/17/2007US20070108559 Integrated circuit package system with integrated circuit support
05/17/2007US20070108551 High performance system-on-chip inductor using post passivation process
05/17/2007US20070108532 Semiconductor device
05/17/2007US20070108527 Novel method for four direction low capacitance esd protection
05/17/2007US20070108523 Semiconductor device and fabrication method for the same
05/17/2007US20070108521 Flexible semiconductor device and identification label
05/17/2007US20070108478 Cell electro-physiological sensor and method of manufacturing the same
05/17/2007US20070107933 Internal conductor connection structure and multilayer substrate
05/17/2007US20070107875 Flat plate heat transfer device
05/17/2007US20070107872 Heat sink with increased cooling capacity and semiconductor device comprising the hear sink
05/17/2007US20070107206 Spiral Inductor Formed in a Semiconductor Substrate and a Method for Forming the Inductor
05/16/2007EP1786247A2 Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon
05/16/2007EP1786034A2 Power semiconductor module
05/16/2007EP1786033A2 Semiconductor device and manufacturing method of the same
05/16/2007EP1785916A1 Smartcard body, smart card and method of manufacturing
05/16/2007EP1785441A1 Epoxy resin composition, products of curing thereof, material for the encapsulation of semiconductors, novel phenol resin, novel epoxy resin, process for production of novel phenol resin and process for production of novel epoxy resin
05/16/2007EP1785278A1 Semiconductor device and ink tank provided with such device
05/16/2007EP1784864A2 Electric sub-assembly
05/16/2007EP1784862A2 Thermally controlled fluidic self-assembly method and support
05/16/2007EP1784860A2 Thermally controlled self-assembly method and support
05/16/2007EP1497861B1 Semiconductor component having an integrated capacitance structure and method for producing the same
05/16/2007CN2901803Y Heat radiation structure
05/16/2007CN2901802Y Two section type buckle structure of heat radiator sheet
05/16/2007CN2901801Y Heat radiator
05/16/2007CN2901587Y Heat radiation device of LED
05/16/2007CN2901586Y Package structure of light emitting module
05/16/2007CN2901582Y Integrated circuit new surface sticking device
05/16/2007CN2901580Y Single row direct insert full wave rectifier bridge stack
05/16/2007CN2901579Y Heat conductive element
05/16/2007CN2901578Y High efficiency CPU heat radiator
05/16/2007CN2901577Y Chip super conductive heat radiator
05/16/2007CN2901576Y Ball grating array package structure
05/16/2007CN1965451A Connector or other circuit element having an indirectly coupled integrated circuit
05/16/2007CN1965407A Metal interconnects for image sensors
05/16/2007CN1965406A Captive socket actuator
05/16/2007CN1965405A Manufacturing method of electronic component seal and electronic component seal
05/16/2007CN1965017A Composition for sealing optical semiconductor, optical semiconductor sealing material, and method for producing composition for sealing optical semiconductor
05/16/2007CN1964915A Temperature resistant hermetic sealing formed at low temperatures for MEMS packages
05/16/2007CN1964609A Fin for heat radiation and heat radiator using same
05/16/2007CN1964092A A large power LED using porous metal material as heat emission device
05/16/2007CN1964086A Surface adhesion type LED packaging structure
05/16/2007CN1964084A Packaging structure of LED
05/16/2007CN1964070A A vertical dual diffused MOS power device protected by polysilicon ESD structure
05/16/2007CN1964069A A vertical dual diffused MOS power device protected by polysilicon/crystalline silicon ESD structure
05/16/2007CN1964067A Thin film transistor substrate for display
05/16/2007CN1964062A Flat panel display device
05/16/2007CN1964061A Electrode substrate for organic light-emitting display device
05/16/2007CN1964055A Electrostatic discharge protection structure and thin-film transistor substrate including same
05/16/2007CN1964053A Nanotube based nonvolatile memory device
05/16/2007CN1964048A 半导体集成电路 The semiconductor integrated circuit
05/16/2007CN1964047A Semiconductor device and method of fabricating the same
05/16/2007CN1964041A A multiple-chip structure and multiple-chip electronic device with multiple-chip structure
05/16/2007CN1964039A 功率半导体模块 Power semiconductor module
05/16/2007CN1964037A A stacking type semiconductor chip package
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