| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/22/2007 | US7220615 Alternative method used to package multimedia card by transfer molding |
| 05/22/2007 | US7220608 Transferring semiconductor crystal from a substrate to a resin |
| 05/22/2007 | US7220607 Method of manufacturing a semiconductor device |
| 05/22/2007 | US7220606 Integrated circuit identification |
| 05/22/2007 | US7220604 Method and apparatus for repairing shape, and method for manufacturing semiconductor device using those |
| 05/22/2007 | US7220485 Bulk high thermal conductivity feedstock and method of making thereof |
| 05/22/2007 | US7220481 High dielectric constant composite material and multilayer wiring board using the same |
| 05/22/2007 | US7220448 Providing a used glass molding die, removing the passivation film and partially removing the third noble metal layer using oxygen plasma;grinding and polishing, cleaning, forming noble metal layer, forming a second passivation film |
| 05/22/2007 | US7220365 Devices using a medium having a high heat transfer rate |
| 05/22/2007 | US7219826 Method for producing metal/ceramic bonding substrate |
| 05/22/2007 | US7219825 SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same |
| 05/22/2007 | US7219721 Heat sink having high efficiency cooling capacity and semiconductor device comprising it |
| 05/22/2007 | US7219708 Apparatus and method for inspecting film carrier tape for mounting electronic component |
| 05/22/2007 | US7219421 Method of a coating heat spreader |
| 05/22/2007 | CA2405830C Process for the manufacture of printed circuit boards with plated resistors |
| 05/18/2007 | WO2007056599A2 Liquid cooling for backlit displays |
| 05/18/2007 | WO2007056253A2 A semiconductor package that includes stacked semiconductor die |
| 05/18/2007 | WO2007056183A1 Implantable microelectronic device and method of manufacture |
| 05/18/2007 | WO2007056063A2 Semiconductor device package with integrated heat spreader |
| 05/18/2007 | WO2007055863A2 Fine pitch interconnect and method of making |
| 05/18/2007 | WO2007055625A1 Cooling assembly |
| 05/18/2007 | WO2007055309A1 Method for manufacturing semiconductor device |
| 05/18/2007 | WO2007055209A1 Method for manufacturing laminated lead frame and laminated lead frame |
| 05/18/2007 | WO2007054434A1 Method of dicing integrated-circuit chips on a thinned substrate |
| 05/18/2007 | WO2007053976A1 A new glass packaging diode |
| 05/18/2007 | WO2007002939A3 System for liquid cooling of electrical components |
| 05/18/2007 | WO2006105834A3 Cooling unit |
| 05/18/2007 | WO2006099936A3 Device and method for determining the temperature of a heat sink |
| 05/18/2007 | WO2006086471A3 A method to grow iii-nitride materials using no buffer layer |
| 05/18/2007 | WO2006012127A3 Microelectronic packages and methods therefor |
| 05/18/2007 | CA2625635A1 Cooling assembly |
| 05/17/2007 | US20070113305 Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof |
| 05/17/2007 | US20070112147 Curable organopolysiloxane composition and semiconductor device |
| 05/17/2007 | US20070111567 Method and device for connecting chips |
| 05/17/2007 | US20070111544 Systems with a gate dielectric having multiple lanthanide oxide layers |
| 05/17/2007 | US20070111541 Barrier film material and pattern formation method using the same |
| 05/17/2007 | US20070111524 Semiconductor device and method of fabricating same |
| 05/17/2007 | US20070111516 Semiconductor Assembly Having Substrate with Electroplated Contact Pads |
| 05/17/2007 | US20070111512 Semiconductor integrated circuit device and a method of manufacturing the same |
| 05/17/2007 | US20070111511 Fabrication method of a semiconductor device |
| 05/17/2007 | US20070111510 Dual damascene multi-level metallization |
| 05/17/2007 | US20070111503 Self-aligning nanowires and methods thereof |
| 05/17/2007 | US20070111499 Wafer redistribution structure with metallic pillar and method for fabricating the same |
| 05/17/2007 | US20070111493 Nanowires comprising metal nanodots and method for producing the same |
| 05/17/2007 | US20070111481 Wafer and wafer cutting and dividing method |
| 05/17/2007 | US20070111477 Semiconductor wafer |
| 05/17/2007 | US20070111475 Method for the structured application of a laminatable film to a substrate for a semiconductor module |
| 05/17/2007 | US20070111430 High density mimcap with a unit repeatable structure |
| 05/17/2007 | US20070111395 Lead frame structure and semiconductor package integrated with the lead frame structure |
| 05/17/2007 | US20070111390 Semiconductor device and method for processing wafer |
| 05/17/2007 | US20070111386 Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices |
| 05/17/2007 | US20070111384 Method of manufacturing a semiconductor device |
| 05/17/2007 | US20070111383 Carbon-carbon and/or metal-carbon fiber composite heat spreader |
| 05/17/2007 | US20070111382 Method for fabricating conductive bumps with non-conductive juxtaposed sidewalls |
| 05/17/2007 | US20070111376 Integrated circuit package system |
| 05/17/2007 | US20070111374 Reversible leadless package and methods of making and using same |
| 05/17/2007 | US20070111353 Hybrid microfluidic chip and method for manufacturing same |
| 05/17/2007 | US20070111352 Wafer with optical control modules in dicing paths |
| 05/17/2007 | US20070111351 Led and led light source |
| 05/17/2007 | US20070111342 Chemical mechanical polishing test structures and methods for inspecting the same |
| 05/17/2007 | US20070111341 Devices and methods for detecting current leakage between deep trench capacitors in DRAM devices |
| 05/17/2007 | US20070110947 Method and Apparatus for Forming a DMD Window Frame with Molded Glass |
| 05/17/2007 | US20070110921 Patterns of electrically conducting polymers and their application as electrodes or electrical contacts |
| 05/17/2007 | US20070110917 Bonding method, device formed by such method, surface activating unit and bonding apparatus comprising such unit |
| 05/17/2007 | US20070110145 Continuous self-calibration of internal analog signals |
| 05/17/2007 | US20070109705 Method for suppressing latch-ups occurring in a circuit, and systems for carrying out said method |
| 05/17/2007 | US20070109699 Semiconductor integrated circuit |
| 05/17/2007 | US20070109009 Method and apparatus for die testing on wafer |
| 05/17/2007 | US20070109008 Novel test structure for speeding a stress-induced voiding test and method of using the same |
| 05/17/2007 | US20070108638 Alignment mark with improved resistance to dicing induced cracking and delamination in the scribe region |
| 05/17/2007 | US20070108637 Semiconductor device and method for producing it, and use of an electrospinning method |
| 05/17/2007 | US20070108636 Semiconductor device |
| 05/17/2007 | US20070108635 Integrated circuit package system |
| 05/17/2007 | US20070108634 Packaged electronic element and method of producing electronic element package |
| 05/17/2007 | US20070108633 Semiconductor chip having bond pads |
| 05/17/2007 | US20070108632 Semiconductor chip having bond pads |
| 05/17/2007 | US20070108631 Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon |
| 05/17/2007 | US20070108630 Article having island structure and producing method thereof |
| 05/17/2007 | US20070108629 Wafer level chip scale packaging structure and method of fabricating the same |
| 05/17/2007 | US20070108628 Mounting substrate and semiconductor device |
| 05/17/2007 | US20070108627 Semiconductor device and method for manufacturing the same |
| 05/17/2007 | US20070108626 Flip-chip integrated circuit packaging method |
| 05/17/2007 | US20070108625 Package and package module of the package |
| 05/17/2007 | US20070108624 Integrated circuit package system with downset lead |
| 05/17/2007 | US20070108623 Chip and package structure |
| 05/17/2007 | US20070108622 Semiconductor device having several assembled integrated-circuit chips and method of assembling and electrically connecting the integrated-circuit chips |
| 05/17/2007 | US20070108621 Integrated circuit package system with arched pedestal |
| 05/17/2007 | US20070108620 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method |
| 05/17/2007 | US20070108618 Semiconductor device |
| 05/17/2007 | US20070108617 Semiconductor component comprising interconnected cell strips |
| 05/17/2007 | US20070108616 Semiconductor device and method for fabricating the same |
| 05/17/2007 | US20070108615 Integrated circuit system with metal-insulator-metal circuit element |
| 05/17/2007 | US20070108614 Semiconductor device and method for manufacturing the same |
| 05/17/2007 | US20070108613 Microelectronic connection component |
| 05/17/2007 | US20070108612 Chip structure and manufacturing method of the same |
| 05/17/2007 | US20070108611 Stacking method and stacked structure for attaching memory components to associated device |
| 05/17/2007 | US20070108610 Embedded semiconductor device substrate and production method thereof |
| 05/17/2007 | US20070108609 Bumped chip carrier package using lead frame and method for manufacturing the same |
| 05/17/2007 | US20070108608 Multi-chip package semiconductor device and method of detecting a failure thereof |
| 05/17/2007 | US20070108607 Semiconductor device |