| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/23/2007 | CN1967851A Via structures in solar cells with bypass diode |
| 05/23/2007 | CN1967847A 半导体器件 Semiconductor devices |
| 05/23/2007 | CN1967845A Semiconductor device and its manufacturing method |
| 05/23/2007 | CN1967839A Stacking method and stacked structure for attaching memory components to associated device |
| 05/23/2007 | CN1967838A A package having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuitry and methods of forming thereof |
| 05/23/2007 | CN1967837A Alignment mark with improved resistance to dicing induced cracking and delamination in the scribe region |
| 05/23/2007 | CN1967836A A chip |
| 05/23/2007 | CN1967835A Electro-optical device and electronic device |
| 05/23/2007 | CN1967834A Semiconductor device and method for designing same |
| 05/23/2007 | CN1967833A Symmetric connect passage of programmable logic device |
| 05/23/2007 | CN1967832A Wiring board and semiconductor device using the same |
| 05/23/2007 | CN1967831A Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon |
| 05/23/2007 | CN1967830A Mounting structure and method of electronic component |
| 05/23/2007 | CN1967829A Mounting structure of electronic component |
| 05/23/2007 | CN1967828A Semiconductor device and method for manufacturing the same |
| 05/23/2007 | CN1967827A Outer down-lead assembly of multimodule spliced long alignment infrared focal plane detector |
| 05/23/2007 | CN1967826A Chip module made of multilayer circuit board |
| 05/23/2007 | CN1967825A Surface pasted plastic packaged diode and its manufacturing method |
| 05/23/2007 | CN1967824A Drive element mount display |
| 05/23/2007 | CN1967823A Integrated liquid cooling heat radiator |
| 05/23/2007 | CN1967822A Integrated liquid cooling heat radiator |
| 05/23/2007 | CN1967821A Radiating system of light-emitting diode |
| 05/23/2007 | CN1967820A Fin heat abstractor |
| 05/23/2007 | CN1967819A Radiator cover and radiator assembly |
| 05/23/2007 | CN1967818A Heat abstractor |
| 05/23/2007 | CN1967817A Semiconductor package structure and method of manufacture |
| 05/23/2007 | CN1967816A Wafer and wafer cutting and dividing method |
| 05/23/2007 | CN1967815A Wafer product and processing method therefor |
| 05/23/2007 | CN1967804A Interlinkage structure and its forming method |
| 05/23/2007 | CN1967803A Display device and manufacturing method of the same |
| 05/23/2007 | CN1967802A Active matrix substrate, manufacturing method thereof, electro-optical device, and electronic apparatus |
| 05/23/2007 | CN1967801A Method for manufacturing semiconductor device |
| 05/23/2007 | CN1967799A Manufacturing method for ic with air interval |
| 05/23/2007 | CN1967775A Semiconductor component and method of manufacture |
| 05/23/2007 | CN1967764A Wafer fuse and its making method |
| 05/23/2007 | CN1967444A Drive bay heat exchanger |
| 05/23/2007 | CN1967131A 热管 Heat pipe |
| 05/23/2007 | CN1967130A 热管 Heat pipe |
| 05/23/2007 | CN1967129A Heat pipe |
| 05/23/2007 | CN1966580A Radiation-curable silicone rubber composition |
| 05/23/2007 | CN1317769C Semiconductor storage device and its producing method |
| 05/23/2007 | CN1317763C Electrostatic discharge protecting circuit |
| 05/23/2007 | CN1317762C Lead frame and its manufacturing method |
| 05/23/2007 | CN1317761C Flip chip packaging joint structure and method for manufacturing same |
| 05/23/2007 | CN1317760C Semiconductor integrated circuit device and semiconductor integrated circuit chip thereof |
| 05/23/2007 | CN1317759C Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrate |
| 05/23/2007 | CN1317757C Pattern for reducing interconnect failures |
| 05/23/2007 | CN1317756C Method for forming double Damascus interconnecting by using low-K dielectric material |
| 05/23/2007 | CN1317750C Wiring base board and its producing method, semiconductor device and electronic machine |
| 05/23/2007 | CN1317667C On-the-fly beam path error correction for memory link processing |
| 05/23/2007 | CN1317620C Manufacturing method for forming thermal conductor and radiating fins |
| 05/23/2007 | CN1317594C Interconnector structure and its manufacturing method |
| 05/22/2007 | US7221991 System and method for monitoring manufacturing apparatuses |
| 05/22/2007 | US7221571 Package unit, printed board having the same, and electronic apparatus having the printed board |
| 05/22/2007 | US7221570 Heat dissipating device for an integrated circuit chip |
| 05/22/2007 | US7221567 Heat sink fan |
| 05/22/2007 | US7221551 Cascaded gate-driven ESD clamp |
| 05/22/2007 | US7221549 Circuitry for protecting electronic circuits against electrostatic discharges and methods of operating the same |
| 05/22/2007 | US7221173 Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process |
| 05/22/2007 | US7221060 Composite alignment mark scheme for multi-layers in lithography |
| 05/22/2007 | US7221059 Wafer level semiconductor component having thinned, encapsulated dice and polymer dam |
| 05/22/2007 | US7221058 Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip |
| 05/22/2007 | US7221057 Stacked IC device having functions for selecting and counting IC chips |
| 05/22/2007 | US7221056 Semiconductor integrated circuit device and manufacturing method thereof |
| 05/22/2007 | US7221055 System and method for die attach using a backside heat spreader |
| 05/22/2007 | US7221054 Bump structure |
| 05/22/2007 | US7221053 Integrated device and electronic system |
| 05/22/2007 | US7221052 Chip scale package with micro antenna and method for manufacturing the same |
| 05/22/2007 | US7221051 Semiconductor device, module for optical devices, and manufacturing method of semiconductor device |
| 05/22/2007 | US7221050 Substrate having a functionally gradient coefficient of thermal expansion |
| 05/22/2007 | US7221049 Circuit device and manufacturing method thereof |
| 05/22/2007 | US7221048 Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier |
| 05/22/2007 | US7221047 Pressure-contact type semiconductor device |
| 05/22/2007 | US7221046 System to control effective series resistance of power delivery circuit |
| 05/22/2007 | US7221045 Flat chip semiconductor device and manufacturing method thereof |
| 05/22/2007 | US7221044 Heterogeneous integrated high voltage DC/AC light emitter |
| 05/22/2007 | US7221043 Integrated circuit carrier with recesses |
| 05/22/2007 | US7221042 Leadframe designs for integrated circuit plastic packages |
| 05/22/2007 | US7221041 Multi-chips module package and manufacturing method thereof |
| 05/22/2007 | US7221040 Semiconductor package assembly and method for electrically isolating modules |
| 05/22/2007 | US7221039 Thin film transistor (TFT) device structure employing silicon rich silicon oxide passivation layer |
| 05/22/2007 | US7221034 Semiconductor structure including vias |
| 05/22/2007 | US7221026 Computer systems containing resistors which include doped silicon/germanium |
| 05/22/2007 | US7221007 Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet |
| 05/22/2007 | US7221004 Semiconductor module |
| 05/22/2007 | US7220990 Technique for evaluating a fabrication of a die and wafer |
| 05/22/2007 | US7220989 Test apparatus for a semiconductor package |
| 05/22/2007 | US7220975 Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device |
| 05/22/2007 | US7220921 Sheet-like board member and method of manufacturing a semiconductor device |
| 05/22/2007 | US7220915 Memory card and its manufacturing method |
| 05/22/2007 | US7220684 Semiconductor device and method of manufacturing the same |
| 05/22/2007 | US7220674 Copper alloys for interconnections having improved electromigration characteristics and methods of making same |
| 05/22/2007 | US7220667 Semiconductor device and method of fabricating the same |
| 05/22/2007 | US7220666 Interconnection element for BGA housings and method for producing the same |
| 05/22/2007 | US7220663 Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby |
| 05/22/2007 | US7220657 Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and device |
| 05/22/2007 | US7220624 Windowed package for electronic circuitry |
| 05/22/2007 | US7220619 Process of cutting electronic package |
| 05/22/2007 | US7220618 Method for forming a redistribution layer in a wafer structure |
| 05/22/2007 | US7220616 Methods for epoxy loc die attachment |