| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/24/2007 | US20070114647 Carrier board structure with semiconductor chip embedded therein |
| 05/24/2007 | US20070114646 Die package having an adhesive flow restriction area |
| 05/24/2007 | US20070114645 Integrated circuit package system configured for singulation |
| 05/24/2007 | US20070114644 Scaling of functional assignments in packages |
| 05/24/2007 | US20070114643 Mems flip-chip packaging |
| 05/24/2007 | US20070114642 Semiconductor device having a heat spreader exposed from a seal resin |
| 05/24/2007 | US20070114641 Ultra-thin quad flat no-lead (QFN) package |
| 05/24/2007 | US20070114640 Semiconductor devices including voltage switchable materials for over-voltage protection |
| 05/24/2007 | US20070114639 Integrated circuit package system with bump pad |
| 05/24/2007 | US20070114638 Printed circuit board with quartz crystal oscillator |
| 05/24/2007 | US20070114637 Article with protective film |
| 05/24/2007 | US20070114635 Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same |
| 05/24/2007 | US20070114614 Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage |
| 05/24/2007 | US20070114611 Structure and method for mosfet with reduced extension resistance |
| 05/24/2007 | US20070114606 Semiconductor device and a method of manufacturing the same |
| 05/24/2007 | US20070114586 Electrical contact for high dielectric constant capacitors and method for fabricating the same |
| 05/24/2007 | US20070114547 Optical element sealing structure, optical coupler, and optical element sealing method |
| 05/24/2007 | US20070114450 Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device |
| 05/24/2007 | US20070114058 Circuit board and its manufacturing method |
| 05/24/2007 | US20070114052 Apparatus and method to prevent loss of conductive ground electrode |
| 05/24/2007 | US20070114010 Liquid cooling for backlit displays |
| 05/24/2007 | DE4329260B9 Verfahren zur Herstellung einer Verdrahtung in einem Halbleiterbauelement A process for producing a wiring in a semiconductor device |
| 05/24/2007 | DE202007003725U1 Wärmeabführvorrichtung Heat removal |
| 05/24/2007 | DE112005001578T5 Bond-Pad-Struktur zur Kupfer-Metallisierung mit verbesserter Zuverlässigkeit, und Verfahren zum Herstellen dieser Struktur Bond pad structure for copper metallization having improved reliability, and methods for making this structure |
| 05/24/2007 | DE10342981B4 Verfahren zum selektiven Aufbringen einer Folie auf definierte Bereiche eines Wafers A method of selectively applying a film to defined areas of a wafer |
| 05/24/2007 | DE10340409B4 Trägerwafer und Verfahren zum Bearbeiten eines Halbleiterwafers unter Verwendung eines Trägerwafers Carrier wafer and method of processing a semiconductor wafer by using a carrier wafer |
| 05/24/2007 | DE10234208B4 Waferlevel-Stapelchippackung und Herstellungsverfahren hierfür Wafer-level stack chip package and manufacturing method thereof |
| 05/24/2007 | DE10228509B4 Lotstruktur zur elektrischen und/oder mechanischen Kontaktierung sowie Vorrichtung und Verfahren zu ihrer Herstellung Lotstruktur for electrical and / or mechanical contact, as well as apparatus and methods for their preparation |
| 05/24/2007 | DE102006001602A1 Halbleiterbauteil und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation |
| 05/24/2007 | DE102005055769A1 Verfahren zur temporären Fixierung eines polymeren Schichtmaterials auf rauen Oberflächen Procedures for temporary fixing of a polymeric layer material on rough surfaces |
| 05/24/2007 | DE102005055477A1 Vorrichtung zur Verpackung eines Bauelements, Verfahren zur Herstellung der Vorrichtung und Verwendung der Vorrichtung Device for packaging a device, method for manufacturing the device and using the device |
| 05/24/2007 | DE102005054631A1 Sensoranordnung mit einem Substrat und mit einem Gehäuse und Verfahren zur Herstellung einer Sensoranordnung Sensor arrangement having a substrate and having a housing and method for producing a sensor arrangement |
| 05/24/2007 | DE102005054268A1 Halbleiterbauteil mit mindestens einem Halbleiterchip und Verfahren zu dessen Herstellung A semiconductor device comprising at least a semiconductor chip and method of manufacture |
| 05/24/2007 | DE102005054267B3 Halbleiterbauteil und Verfahren zu dessen Herstellung sowie Verwendung des Elektrospinningverfahrens A semiconductor device and method for its production and use of the electrospinning method |
| 05/24/2007 | DE102005053876A1 Drucksensor-Bauteil Pressure sensor component |
| 05/24/2007 | DE102005052637A1 Monolithisch integrierte Schaltung The monolithic integrated circuit |
| 05/24/2007 | DE102005045767A1 Halbleiterbauteil mit Kunststoffgehäusemasse und Verfahren zur Herstellung desselben Of the same semiconductor device with plastic housing composition and method for producing |
| 05/24/2007 | DE102005039478B4 Leistungshalbleiterbauteil mit Halbleiterchipstapel und Verfahren zur Herstellung desselben Power semiconductor component with the same semiconductor chip stack and processes for preparing |
| 05/24/2007 | DE102005035393B4 Verfahren zur Herstellung eines Bauelementes mit mehreren Chips sowie ein solches Bauelement A method for producing a component with a plurality of chips, as well as such a component |
| 05/24/2007 | DE102005025083B4 Thermoplast-Duroplast-Verbund und Verfahren zum Verbinden eines thermoplastischen Materials mit einem duroplastischen Material Thermoplastic-thermoset composite and method of joining a thermoplastic material with a thermosetting material |
| 05/24/2007 | DE102004032001A1 Kühlrohreinheit für Computerchips/Formpatent/der für einzelne oder Kompakt mit Chips besetzt wird und durch die Rohrdurchleitung mit einer oder mehreren Kühlflüssigkeiten, die zueinander ableiten gekühlt wird. Cooling tube unit for computer chips / Form Patent / key for individual or compact is set with chips and through the pipe line with one or more cooling fluids, which is cooled to derive each other. Bei Ionenchips kann somit zunächst über 10 Ghz erzielt werden. In ion chips can thus initially be achieved over 10 GHz. |
| 05/23/2007 | EP1788852A2 Method for packaging flash memory cards |
| 05/23/2007 | EP1788626A1 Multilayer circuit with variable inductor, and method of manufacturing it |
| 05/23/2007 | EP1788625A1 Module with electrical pressure contacted capacitors |
| 05/23/2007 | EP1788624A1 Process for manufacturing deep through vias in a semiconductor device, and semiconductor device made thereby. |
| 05/23/2007 | EP1788623A1 Embedding seat comprising a sliding cover and a body with one or more IC containers having an array of conducting elastic pin units |
| 05/23/2007 | EP1788622A1 Memory module comprising one or more embedding seats with a sliding cover and a body with one or more IC containers having an array of conducting elastic pin units |
| 05/23/2007 | EP1788616A2 Thick film conductor compositions and processing technology thereof for use in multilayer electronic circuits and devices |
| 05/23/2007 | EP1788514A1 Electronic micromodule and method of fabrication |
| 05/23/2007 | EP1788512A1 A semiconductor device and a method of manufacturing the same |
| 05/23/2007 | EP1788034A2 Moisture absorbing formed article |
| 05/23/2007 | EP1787955A1 Single-layer carbon nanotube and alinged single-layer carbon nanotube bulk structure, and their production process, production apparatus and use |
| 05/23/2007 | EP1787326A1 Cooled integrated circuit |
| 05/23/2007 | EP1787325A1 Sub-assembly |
| 05/23/2007 | EP1787080A1 Composite heat sink with metal base and graphite fins |
| 05/23/2007 | EP1487759B1 Method for the production of a metal-ceramic substrate, preferably a copper-ceramic substrate |
| 05/23/2007 | EP1442266A4 High heat flux single-phase heat exchanger |
| 05/23/2007 | EP1380056B1 Optoelectronic component array and method for the production of an optoelectronic component array |
| 05/23/2007 | EP1266926B1 Adhesive polyimide resin and adhesive laminate |
| 05/23/2007 | CN2904598Y Radiator for power amplifier main board |
| 05/23/2007 | CN2904597Y Radiating device |
| 05/23/2007 | CN2904596Y Radiating device |
| 05/23/2007 | CN2904595Y Heat radiation fan module |
| 05/23/2007 | CN2904594Y Turbulence resistance combined radiator |
| 05/23/2007 | CN2904593Y Fiber type radiating fin |
| 05/23/2007 | CN2904592Y Water cooled radiating device |
| 05/23/2007 | CN2904589Y Liquid cooling system |
| 05/23/2007 | CN2904588Y Synthetic board for heat radiation |
| 05/23/2007 | CN2904582Y Radiator fixer |
| 05/23/2007 | CN2904567Y Fastener for radiator |
| 05/23/2007 | CN2904455Y Water cooling radiator for high frequency switch power |
| 05/23/2007 | CN2904306Y Total reflection SMD LED supporter |
| 05/23/2007 | CN2904303Y Led集成芯片 Led integrated chip |
| 05/23/2007 | CN2904302Y U groove LED integrated chip |
| 05/23/2007 | CN2904301Y High performance high reliable fuse regulating circuit |
| 05/23/2007 | CN2904300Y Improvement of chip module |
| 05/23/2007 | CN2904299Y Improved high power triode lead wire frame |
| 05/23/2007 | CN2904298Y Chip packaging body |
| 05/23/2007 | CN2904297Y Plastic diode and plastic rectifying bridge guide pin |
| 05/23/2007 | CN2904296Y IC water cooler |
| 05/23/2007 | CN2904295Y Surface mount transistor packaging frame |
| 05/23/2007 | CN1969424A Transmission line pair |
| 05/23/2007 | CN1969423A Circuitry module |
| 05/23/2007 | CN1969397A 热电模块 Thermoelectric Modules |
| 05/23/2007 | CN1969396A Thermoelectric converter and its manufacturing method |
| 05/23/2007 | CN1969383A Lead frame structure with aperture or groove for flip chip in a leaded molded package |
| 05/23/2007 | CN1969382A Heat dissipating device with enhanced boiling/condensation structure |
| 05/23/2007 | CN1968810A Multi-layered thermally conductive sheet |
| 05/23/2007 | CN1968596A Array jetting micro heat exchanger |
| 05/23/2007 | CN1968595A Electronic component cooling device |
| 05/23/2007 | CN1968588A Fasteners |
| 05/23/2007 | CN1968564A Printed circuit board with dual type inner structure |
| 05/23/2007 | CN1967885A LBD lamp assembly |
| 05/23/2007 | CN1967873A 半导体器件 Semiconductor devices |
| 05/23/2007 | CN1967869A Semiconductor device and its manufacturing method |
| 05/23/2007 | CN1967867A Display device and method for manufacturing the same |
| 05/23/2007 | CN1967866A Display apparatus |
| 05/23/2007 | CN1967863A Emissive device and electronic apparatus |
| 05/23/2007 | CN1967853A Semiconductor device and manufacturing method of the same |
| 05/23/2007 | CN1967852A 影像感测器封装 The image sensor package |