| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/29/2007 | US7222423 Method of manufacturing a finned heat sink |
| 05/29/2007 | US7222420 Method for making a front and back conductive substrate |
| 05/29/2007 | US7222419 Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package |
| 05/24/2007 | WO2007059191A1 Enhancing shock resistance in semiconductor packages |
| 05/24/2007 | WO2007058909A2 Method of controlling nanowire growth and device with controlled-growth nanowire |
| 05/24/2007 | WO2007058854A2 Semiconductor package including a semiconductor die having redistributed pads |
| 05/24/2007 | WO2007058385A1 Method of producing body having flow path therein, and body having flow path therein |
| 05/24/2007 | WO2007058365A1 Composition for chemical vapor deposition film-formation and method for production of low dielectric constant film |
| 05/24/2007 | WO2007058280A1 Electronic part sealing board, electronic part sealing board in multiple part form, electronic device using electronic part sealing board, and electronic device fabricating method |
| 05/24/2007 | WO2007058261A1 Sealing epoxy resin forming material and electronic component device |
| 05/24/2007 | WO2007058134A1 Semiconductor package, electronic parts, and electronic device |
| 05/24/2007 | WO2007058074A1 Double-faced electrode package, and its manufacturing method |
| 05/24/2007 | WO2007058073A1 Semiconductor package, method of producing the same, semiconductor module, and electronic apparatus |
| 05/24/2007 | WO2007058042A1 Semiconductor device and method for manufacturing same |
| 05/24/2007 | WO2007058005A1 Process for producing wiring board and wiring board |
| 05/24/2007 | WO2007057954A1 Semiconductor device and method for manufacturing same |
| 05/24/2007 | WO2007057952A1 Electronic element, package having same, and electronic device |
| 05/24/2007 | WO2007057918A2 A hand-held thumb touch typable ascii/unicode keypad for a remote, mobile telephone or a pda |
| 05/24/2007 | WO2007057472A2 Method and structure for charge dissipation in integrated circuits |
| 05/24/2007 | WO2007056890A1 Surface mounting plastic packaging diode and manufacture method of the same |
| 05/24/2007 | WO2007037500A9 Epoxy resin composition and semiconductor device |
| 05/24/2007 | WO2007037458A9 Package and electronic device |
| 05/24/2007 | WO2007021736A3 Semiconductor device having improved mechanical and thermal reliability |
| 05/24/2007 | WO2006115576A3 Semiconductor die edge reconditioning |
| 05/24/2007 | WO2006053118A3 Spaced, bumped component structure |
| 05/24/2007 | WO2006047235A3 Transient thermoelectric cooling of optoelectronic devices |
| 05/24/2007 | WO2006029388A3 Method and apparatus for fabricating low-k dielectrics, conducting films, and strain-controlling conformable silica-carbon materials |
| 05/24/2007 | US20070118828 Generation of metal holes by via mutation |
| 05/24/2007 | US20070118242 System and method for product yield prediction |
| 05/24/2007 | US20070117423 Camera module using printed circuit board with step portion |
| 05/24/2007 | US20070117405 Method of manufacturing a semiconductor device |
| 05/24/2007 | US20070117404 Modification of electrical properties for semiconductor wafers |
| 05/24/2007 | US20070117388 Fabrication of semiconductor devices |
| 05/24/2007 | US20070117387 Semiconductor device and manufacturing method thereof |
| 05/24/2007 | US20070117386 Substrate for evaluation |
| 05/24/2007 | US20070117380 Resin product, production method for the same, and deposition method for a metallic coating |
| 05/24/2007 | US20070117379 Multiple seed layers for interconnects |
| 05/24/2007 | US20070117374 Method of forming via recess in underlying conductive line |
| 05/24/2007 | US20070117373 Thin film magnetic head with a metal lamination part and method of manufacturing the same |
| 05/24/2007 | US20070117370 Method of forming contact and semiconductor device |
| 05/24/2007 | US20070117369 Method for interconnecting active and passive components, and a resulting thin heterogeneous component |
| 05/24/2007 | US20070117368 Structure of bumps forming on an under metallurgy layer and method for making the same |
| 05/24/2007 | US20070117362 Heat treatment apparatus and method of manufacturing a semiconductor device |
| 05/24/2007 | US20070117361 Method for Manufacturing an SOI Substrate |
| 05/24/2007 | US20070117349 Solid state imaging device and method for manufacturing the same |
| 05/24/2007 | US20070117345 Methods of fabricating highly conductive regions in semiconductor substrates for radio frequency applications |
| 05/24/2007 | US20070117343 Semiconductor device having align mark layer and method of fabricating the same |
| 05/24/2007 | US20070117339 Via including multiple electrical paths |
| 05/24/2007 | US20070117332 Semiconductor devices having a pocket line and methods of fabricating the same |
| 05/24/2007 | US20070117308 Semiconductor constructions, and methods of forming semiconductor constructions |
| 05/24/2007 | US20070117277 Methods for fabricating protective layers on semiconductor device components |
| 05/24/2007 | US20070117274 Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
| 05/24/2007 | US20070117272 Method of making a semiconductor device with improved heat dissipation |
| 05/24/2007 | US20070117265 Semiconductor Device with Improved Stud Bump |
| 05/24/2007 | US20070117263 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material |
| 05/24/2007 | US20070117262 Low Profile Stacking System and Method |
| 05/24/2007 | US20070117261 Multilayer printed wiring board and method for producing the same |
| 05/24/2007 | US20070117260 Method of manufacturing semiconductor sensor |
| 05/24/2007 | US20070117258 Method for the molecular bonding of microelectronic components to a polymer film |
| 05/24/2007 | US20070117245 Wafer level package for micro device and manufacturing method thereof |
| 05/24/2007 | US20070117231 Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor |
| 05/24/2007 | US20070117228 Teaching apparatus and teaching method |
| 05/24/2007 | US20070117227 Method And System for Iteratively, Selectively Tuning A Parameter Of A Doped Workpiece Using A Pulsed Laser |
| 05/24/2007 | US20070117226 Method and apparatus for processing timeout in DSG apparatus |
| 05/24/2007 | US20070116863 Apparatus and method for manufacturing semiconductor device |
| 05/24/2007 | US20070115634 Device for the local cooling or heating of an object |
| 05/24/2007 | US20070115605 Method and arrangement for shielding a component against electrostatic interference |
| 05/24/2007 | US20070115075 Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package |
| 05/24/2007 | US20070114679 Multi-terminal hybrid switching device |
| 05/24/2007 | US20070114678 Binary sinusoidal sub-wavelength gratings as alignment marks |
| 05/24/2007 | US20070114677 Semiconductor package with heat sink, stack package using the same and manufacturing method thereof |
| 05/24/2007 | US20070114676 Pigment particles with a core having a low refractive index and a shell having a high refractive index dispersed in a dielectric solvent with refractive index different from the shell; improved contrast ratio; microencapsulation involving interfacial crosslinking of a reactive protective colloid |
| 05/24/2007 | US20070114675 Integrated circuit package with improved power signal connection |
| 05/24/2007 | US20070114674 Hybrid solder pad |
| 05/24/2007 | US20070114673 Wiring substrate and electronic parts packaging structure |
| 05/24/2007 | US20070114672 Semiconductor device and method of manufacturing the same |
| 05/24/2007 | US20070114671 Interconnect structure and fabricating method thereof |
| 05/24/2007 | US20070114670 Corrosion-resistant aluminum conductive material and process for producing the same |
| 05/24/2007 | US20070114669 Plasma display panel |
| 05/24/2007 | US20070114668 Semiconductor device |
| 05/24/2007 | US20070114667 Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing |
| 05/24/2007 | US20070114666 Capture of residual refractory metal within semiconductor device |
| 05/24/2007 | US20070114665 Power Semiconductor Circuit |
| 05/24/2007 | US20070114664 Packaged device and method of forming same |
| 05/24/2007 | US20070114663 Alloys for flip chip interconnects and bumps |
| 05/24/2007 | US20070114662 Interconnecting element between semiconductor chip and circuit support and method |
| 05/24/2007 | US20070114661 Semiconductor package and method of fabricating the same |
| 05/24/2007 | US20070114660 Memory module |
| 05/24/2007 | US20070114659 Rotary chip attach |
| 05/24/2007 | US20070114658 Integrated Circuit Micro-Cooler with Double-Sided Tubes of a CNT Array |
| 05/24/2007 | US20070114657 Integrated circuit micro-cooler having multi-layers of tubes of a cnt array |
| 05/24/2007 | US20070114656 Fluid cooled encapsulated microelectronic package |
| 05/24/2007 | US20070114655 Apparatus for cooling |
| 05/24/2007 | US20070114654 Stackable semiconductor package and method for its fabrication |
| 05/24/2007 | US20070114653 Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate |
| 05/24/2007 | US20070114652 Surface-mount packaging for chip |
| 05/24/2007 | US20070114651 Integrated circuit stacking system with integrated passive components |
| 05/24/2007 | US20070114650 Non-leaded integrated circuit package system |
| 05/24/2007 | US20070114649 Low Profile Stacking System and Method |
| 05/24/2007 | US20070114648 Semiconductor Stacked Multi-Package Module Having Inverted Second Package |