Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2007
05/31/2007DE102005037869B4 Anordnung zur hermetischen Abdichtung von Bauelementen und Verfahren zu deren Herstellung Assembly for hermetic sealing of components and processes for their preparation
05/31/2007DE102005037573B4 Thyristor mit Freiwerdeschutz in Form eines Thyristorsystems und Verfahren zur Herstellung des Thyristorsystems Thyristor with free Become protection in the form of a Thyristorsystems and method for producing the Thyristorsystems
05/31/2007DE102004061308B4 Halbleiterbauteil mit Passivierungsschicht A semiconductor device comprising passivating
05/31/2007DE102004030860B4 Verfahren zum Schützen eines Metallisierungsgebiets in einer Halbleiterstrukturmit mindestens einem Metallisierungsgebiet A method of protecting a Metallisierungsgebiets in a Halbleiterstrukturmit least one Metallisierungsgebiet
05/31/2007CA2628141A1 Semiconductor-based lighting systems and lighting system components for automotive use
05/30/2007EP1791410A2 Multilayer printed circuit board
05/30/2007EP1791404A1 Electronic component and manufacturing method thereof
05/30/2007EP1791180A1 Semiconductor device
05/30/2007EP1791179A2 Semiconductor Integrated Circuit and Design Method Thereof
05/30/2007EP1791178A2 Pressure contact type power semiconductor module
05/30/2007EP1791177A1 Semiconductor unit with improved heat coupling
05/30/2007EP1791176A1 Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same
05/30/2007EP1790935A2 Fow distributing element for a cooling plate
05/30/2007EP1790048A1 Connector or other circuit element having an indirectly coupled integrated circuit
05/30/2007EP1790008A1 Chip comprising at least one test contact configuration
05/30/2007EP1790007A2 Micro-structured cooler and use thereof
05/30/2007EP1789827A1 Optoelectronic flip-chip package with optical waveguide accommodated in upper layers of substrate board
05/30/2007EP1553622B1 Anisotropic conductivity testconnector
05/30/2007EP1446993A4 I-channel surface-mount connector with extended flanges
05/30/2007EP1354353B1 Clean release, phase change thermal interface
05/30/2007EP1259103B1 Multilayer printed wiring board and method for producing multilayer printed wiring board
05/30/2007EP1143779B1 Heat sink and semiconductor laser apparatus using the same
05/30/2007EP1060645B1 Electric conductor with a surface structure in the form of flanges and etched grooves
05/30/2007EP0966185B1 Method of manufacturing a printed wiring board
05/30/2007CN2907195Y Fan guard
05/30/2007CN2907194Y Multiple heat radiation structure of display card
05/30/2007CN2907193Y Heat radiator
05/30/2007CN2907191Y Radiator with refrigerating chip
05/30/2007CN2907182Y 固定扣具 Fastener
05/30/2007CN2906935Y Novel extra high power LED encapsulation structure
05/30/2007CN2906933Y Heat dissipation structure for white light LED encapsulation
05/30/2007CN2906928Y 集成电路芯片 IC chip
05/30/2007CN2906925Y Semiconductor power crystal solder wire structure
05/30/2007CN2906924Y High-power integrated circuit encapsulation structure
05/30/2007CN2906923Y Diode passivation zone structure suitable for transparent polyimide glue
05/30/2007CN2906922Y Thin plastic capsulation structure
05/30/2007CN2906921Y Combined injection molded shell structure for LED display matrix module
05/30/2007CN1973590A Printed circuit board and manufacturing method thereof
05/30/2007CN1973377A High frequency transistor layout for low source drain capacitance
05/30/2007CN1973372A Integrated circuit package with improved power signal connection
05/30/2007CN1973371A Elongated features for improved alignment process integration
05/30/2007CN1973370A Angled elongated features for improved alignment process integration
05/30/2007CN1973369A Process for producing a ceramic printed-circuit board
05/30/2007CN1973174A Method of assembling a semiconductor component and apparatus therefor
05/30/2007CN1972998A Epoxy resin molding material for encapsulation and electronic device
05/30/2007CN1972583A Cooling packaging method for vehicle-mounted liquid cooling power electronic controller
05/30/2007CN1972557A Flexible copper clad laminate, film carrier tape manufactured using the same, and method for manufacturing same, and flexible printed circuit board, and semiconductor device
05/30/2007CN1972554A 薄型化电路板结构 Thinning circuit board structure
05/30/2007CN1971959A Special finned pipe shaped radiator for semiconductor refrigeration unit and its preparation method
05/30/2007CN1971954A Side-view light emitting diode package
05/30/2007CN1971942A Low-inductance gated thyristor and its power semiconductor assembly
05/30/2007CN1971939A Display device and manufacturing method of display device
05/30/2007CN1971938A 有机发光二极管显示器 The organic light emitting diode display
05/30/2007CN1971936A An organic light-emitting display device electrode substrate
05/30/2007CN1971935A Organic light-emitting display device electrode substrate
05/30/2007CN1971929A 半导体装置 Semiconductor device
05/30/2007CN1971928A Image sensor module and camera module package therewith
05/30/2007CN1971925A Encapsulation structure of optical sensor with gap wall
05/30/2007CN1971924A Encapsulation structure of optical sensor
05/30/2007CN1971923A Encapsulation structure of optical sensing element
05/30/2007CN1971921A Semiconductor component and inner link structure and their manufacturing method
05/30/2007CN1971919A Thin-film transistor panel and method for manufacturing the same
05/30/2007CN1971913A 半导体装置 Semiconductor device
05/30/2007CN1971912A 半导体集成电路及其设计方法 Semiconductor integrated circuit and design method
05/30/2007CN1971911A 半导体结构 Semiconductor structure
05/30/2007CN1971910A LCD apparatus, pixel array base plate and method for preventing flicker of display panel
05/30/2007CN1971905A Pressure contact type power semiconductor module
05/30/2007CN1971904A Lap connected structure of semiconductor component-buried loading board
05/30/2007CN1971903A Semiconductor device having align mark layer and method of fabricating the same
05/30/2007CN1971902A Flat panel display apparatus
05/30/2007CN1971901A Semiconductor device and its production method
05/30/2007CN1971900A Protecting structure of electron fabrication junction and its manufacturing method
05/30/2007CN1971899A Package substrate
05/30/2007CN1971898A Directly electric connected crystal covered encapsulation structure of semiconductor chip
05/30/2007CN1971897A Ball grid array wiring structure
05/30/2007CN1971896A Macromolecule conductive film structure and its semiconductor assembly encapsulation structure
05/30/2007CN1971895A Chip buried base plate encapsulation structure
05/30/2007CN1971894A Chip buried-in modularize structure
05/30/2007CN1971893A Heat radiation module and its heat pipe
05/30/2007CN1971892A Structure of radiator
05/30/2007CN1971891A Heat radiator
05/30/2007CN1971890A Preparation method of heat radiator
05/30/2007CN1971889A Heat radiator
05/30/2007CN1971888A Adhesives and electric devices
05/30/2007CN1971887A Multilayer crack-resistant ring structure and wafer with the same
05/30/2007CN1971886A Thin film transistor array base plate and its manufacturing method
05/30/2007CN1971877A Electronic component and manufacturing method thereof
05/30/2007CN1971876A Conductor-dielectric structure and method for fabricating
05/30/2007CN1971866A Smart card body, manufacturing method thereof, smart card, installation method thereof and belt carrier
05/30/2007CN1971865A Chip electric connection structure and its manufacturing method
05/30/2007CN1971864A Semiconductor buried base plate structure and its manufacturing method
05/30/2007CN1971863A Semiconductor chip buried base plate 3D construction and its manufacturing method
05/30/2007CN1971862A Chip buried in semiconductor encapsulation base plate structure and its manufacturing method
05/30/2007CN1971847A Method of producing a layer arrangement, method of producing an electrical component, layer arrangement, and electrical component
05/30/2007CN1971401A Camera module using a printed circuit board having the end difference
05/30/2007CN1970675A Resin composition for sealing optical device , its cured product and method of sealing semiconductor element
05/30/2007CN1970671A Adhesives and electric devices
05/30/2007CN1970623A 液状环氧树脂组成物 A liquid epoxy resin composition
05/30/2007CN1319428C Electronic circuit unit
05/30/2007CN1319422C Hybrid module and making method thereof and mounting method thereof
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