| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/30/2007 | CN1319263C Multiple fault redundant motor |
| 05/30/2007 | CN1319230C Sheet-shape surging absorber |
| 05/30/2007 | CN1319173C Semiconductor device |
| 05/30/2007 | CN1319171C Semiconductor apparatus with improved ESD withstanding voltage |
| 05/30/2007 | CN1319170C Inductor device having improved quality factor and its manufacturing method |
| 05/30/2007 | CN1319168C Electrostatic discharge protection mechanism and LCD display panel using the same |
| 05/30/2007 | CN1319167C Gate equal potential circuit and method for input/output electrostatic dischare protection |
| 05/30/2007 | CN1319166C Semiconductor device |
| 05/30/2007 | CN1319165C Semiconductor device and its manufacturing method |
| 05/30/2007 | CN1319164C Semiconductor device and its manufacturing method |
| 05/30/2007 | CN1319163C Semiconductor package with radiating fins |
| 05/30/2007 | CN1319162C Heat conducting material and forming method therefor |
| 05/30/2007 | CN1319161C Semiconductor device |
| 05/30/2007 | CN1319160C Method of connecting heat conduit and radiation fin |
| 05/30/2007 | CN1319159C Semiconductor package part with radiation fin |
| 05/30/2007 | CN1319158C Method of constructing electronic assembly having indium thermal couple |
| 05/30/2007 | CN1319157C Multilayer circuit board and semiconductor device |
| 05/30/2007 | CN1319156C Negative thermal dilation system device and conductive elastomer in mlcroelectronics seal connection |
| 05/30/2007 | CN1319155C SOI substrate and semiconductor integrated circuit device |
| 05/30/2007 | CN1319143C Wafer pre-alignment apparatus and method |
| 05/30/2007 | CN1319139C Production of local vacuum sealing protective structure of silicon based sensor flexible piece |
| 05/30/2007 | CN1319138C Packaged semiconductor device and its forming method |
| 05/30/2007 | CN1319131C Process and apparatus for treating a workpiece such as a semiconductor wafer |
| 05/30/2007 | CN1319125C Deposition method of insulating layers having low dielectric constant of semiconductor device |
| 05/30/2007 | CN1319121C Method for forming alignment pattern of semiconductor device |
| 05/30/2007 | CN1319085C Flat capacitor |
| 05/30/2007 | CN1319023C Semiconductor device and production method thereof |
| 05/30/2007 | CN1319009C Semiconductor device |
| 05/30/2007 | CN1318937C Non-fan cooling device for CPU of passive base-plate type engineering controlled computer |
| 05/30/2007 | CN1318936C Centrifugal fan |
| 05/30/2007 | CN1318651C Plating apparatus, plating method and method for manufacturing semiconductor device |
| 05/30/2007 | CN1318626C Metallic material for electronic part, electronic part, electronic equipment, method of working metallic material, process for producing electronic part and electronic optical part |
| 05/30/2007 | CN1318528C Varnish containing polyamide resin and use thereof |
| 05/30/2007 | CN1318490C Solidifying promoter, epoxy resin composition and semiconductor device |
| 05/29/2007 | US7224884 Design method for a video signal processing integrated circuit and integrated circuit and video signal processing apparatus thereby |
| 05/29/2007 | US7224634 Hardware security device for magnetic memory cells |
| 05/29/2007 | US7224627 Integrated semiconductor circuit and method for testing the same |
| 05/29/2007 | US7224587 Heat sink and chip sandwich system |
| 05/29/2007 | US7224586 Method of maintaining an IC-module near a set-point |
| 05/29/2007 | US7224585 Liquid-cooled heat sink assembly |
| 05/29/2007 | US7224115 Display apparatus and method of manufacturing the same |
| 05/29/2007 | US7224076 Electronic component package |
| 05/29/2007 | US7224075 Methods and systems for attaching die in stacked-die packages |
| 05/29/2007 | US7224074 Active area bonding compatible high current structures |
| 05/29/2007 | US7224073 Substrate for solder joint |
| 05/29/2007 | US7224072 Mounting structure for ball grid array type IC |
| 05/29/2007 | US7224071 System and method to increase die stand-off height |
| 05/29/2007 | US7224070 Plurality of semiconductor die in an assembly |
| 05/29/2007 | US7224069 Dummy structures extending from seal ring into active circuit area of integrated circuit chip |
| 05/29/2007 | US7224068 Stable metal structure with tungsten plug |
| 05/29/2007 | US7224067 Intermetallic solder with low melting point |
| 05/29/2007 | US7224066 Bonding material and circuit device using the same |
| 05/29/2007 | US7224065 Contact/via force fill techniques and resulting structures |
| 05/29/2007 | US7224064 Semiconductor device having conductive interconnections and porous and nonporous insulating portions |
| 05/29/2007 | US7224063 Dual-damascene metallization interconnection |
| 05/29/2007 | US7224062 Chip package with embedded panel-shaped component |
| 05/29/2007 | US7224061 Package structure |
| 05/29/2007 | US7224060 Integrated circuit with protective moat |
| 05/29/2007 | US7224059 Method and apparatus for thermo-electric cooling |
| 05/29/2007 | US7224058 Integrated circuit package employing a heat-spreader member |
| 05/29/2007 | US7224057 Thermal enhance package with universal heat spreader |
| 05/29/2007 | US7224056 Back-face and edge interconnects for lidded package |
| 05/29/2007 | US7224055 Center pad type IC chip with jumpers, method of processing the same and multi chip package |
| 05/29/2007 | US7224054 Semiconductor device and system having semiconductor device mounted thereon |
| 05/29/2007 | US7224053 Semiconductor device responsive to different levels of input and output signals and signal processing system using the same |
| 05/29/2007 | US7224052 IC card with controller and memory chips |
| 05/29/2007 | US7224051 Semiconductor component having plate and stacked dice |
| 05/29/2007 | US7224050 Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging |
| 05/29/2007 | US7224049 Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same |
| 05/29/2007 | US7224048 Flip chip ball grid array package |
| 05/29/2007 | US7224047 Semiconductor device package with reduced leakage |
| 05/29/2007 | US7224046 Multilayer wiring board incorporating carbon fibers and glass fibers |
| 05/29/2007 | US7224045 Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package |
| 05/29/2007 | US7224044 Semiconductor chip mounting substrate and flat display |
| 05/29/2007 | US7224043 Semiconductor element with improved adhesion characteristics of the non-metallic surfaces |
| 05/29/2007 | US7224042 Integrated circuit wafer with inter-die metal interconnect lines traversing scribe-line boundaries |
| 05/29/2007 | US7224040 Multi-level thin film capacitor on a ceramic substrate |
| 05/29/2007 | US7224033 Structure and method for manufacturing strained FINFET |
| 05/29/2007 | US7223992 Thermal conducting trench in a semiconductor structure |
| 05/29/2007 | US7223964 Integration of electronic data storage into a telecommunications component |
| 05/29/2007 | US7223924 Via placement for layer transitions in flexible circuits with high density ball grid arrays |
| 05/29/2007 | US7223696 Methods for maskless lithography |
| 05/29/2007 | US7223692 Multi-level semiconductor device with capping layer for improved adhesion |
| 05/29/2007 | US7223690 Substrate processing method |
| 05/29/2007 | US7223686 Semiconductor interconnection line and method of forming the same |
| 05/29/2007 | US7223683 Wafer level bumping process |
| 05/29/2007 | US7223681 Interconnection pattern design |
| 05/29/2007 | US7223680 Method of forming a dual damascene metal trace with reduced RF impedance resulting from the skin effect |
| 05/29/2007 | US7223674 Methods for forming backside alignment markers useable in semiconductor lithography |
| 05/29/2007 | US7223652 Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device |
| 05/29/2007 | US7223639 Method of producing an electronic component and a panel with a plurality of electronic components |
| 05/29/2007 | US7223638 Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material |
| 05/29/2007 | US7223637 Method of manufacturing a sensor device with binding material having a foaming agent |
| 05/29/2007 | US7223636 Manufacturing method of semiconductor device and semiconductor device |
| 05/29/2007 | US7223634 Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus |
| 05/29/2007 | US7223633 Method for solder crack deflection |
| 05/29/2007 | US7223616 Test structures in unused areas of semiconductor integrated circuits and methods for designing the same |
| 05/29/2007 | US7223612 Alignment of MTJ stack to conductive lines in the absence of topography |
| 05/29/2007 | US7223316 Method for manufacturing electronic component |
| 05/29/2007 | US7222776 Printed wiring board and manufacturing method therefor |