Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2007
05/31/2007US20070122991 Resistor element and manufacturing method thereof
05/31/2007US20070122960 Antenna and manufacturing method thereof, semiconductor device including antenna and manufacturing method thereof, and radio communication system
05/31/2007US20070122945 Methods of fabricating integrated circuit devices having fuse structures including buffer layers
05/31/2007US20070122944 Individualized Low Parasitic Power Distribution Lines Deposited Over Active Integrated Circuits
05/31/2007US20070122919 Method of producing an integrated circuit arrangement with field-shaping electrical conductors
05/31/2007US20070122622 Electronic module with thermal dissipating surface
05/31/2007US20070122549 forming a solar cell conductive feature using monodisperse silver or silver alloy fine particles coated with a ceramic or metal; silver particles made in an aerosol stream and coated by vapor deposition
05/31/2007US20070121575 Protection for an integrated circuit chip containing confidential data
05/31/2007US20070121305 Multilayer wiring board for an electronic device
05/31/2007US20070121287 Housing arrangement
05/31/2007US20070121049 Liquid crystal display device
05/31/2007US20070120732 High frequency module
05/31/2007US20070120605 Integrated switchless programmable attenuator and low noise amplifier
05/31/2007US20070120273 Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure
05/31/2007US20070120272 Comprising sets of colored particles in dielectric fluid, where at least one of sets of particles is poly(meth)acrylate/hydrophilic monomer) emulsion aggregation polymer particles capable of field-induced charging; capable of generating and displaying full color images reliably and rapidly; stability
05/31/2007US20070120271 Dicing and die bonding adhesive tape
05/31/2007US20070120270 Flip chip hermetic seal using pre-formed material
05/31/2007US20070120269 Flip chip package and manufacturing method of the same
05/31/2007US20070120268 Intermediate connection for flip chip in packages
05/31/2007US20070120267 Multi chip module
05/31/2007US20070120266 Chip resistor
05/31/2007US20070120265 Semiconductor device and its manufacturing method
05/31/2007US20070120264 A semiconductor having a copper-based metallization stack with a last aluminum metal line layer
05/31/2007US20070120263 Conductor track arrangement and associated production method
05/31/2007US20070120262 Semiconductor device and method for manufacturing the same
05/31/2007US20070120261 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device
05/31/2007US20070120260 Semiconductor integrated circuit wiring design method and semiconductor integrated circuit
05/31/2007US20070120259 Detection of residual liner materials after polishing in damascene process
05/31/2007US20070120258 Semiconductor device
05/31/2007US20070120257 Semiconductor integrated circuit with improved power supply system
05/31/2007US20070120256 Reinforced interconnection structures
05/31/2007US20070120255 Semiconductor chip having island dispersion structure and method for manufacturing the same
05/31/2007US20070120254 Semiconductor device comprising a pn-heterojunction
05/31/2007US20070120253 Core substrate and multilayer printed circuit board using paste bumps and manufacturing method thereof
05/31/2007US20070120252 Nano-wire electronic device
05/31/2007US20070120251 Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
05/31/2007US20070120250 Thermal conductive electronics substrate and assembly
05/31/2007US20070120249 Circuit substrate and manufacturing method thereof
05/31/2007US20070120248 Semiconductor device
05/31/2007US20070120247 Semiconductor packages having leadframe-based connection arrays
05/31/2007US20070120246 Interposer and stacked chip package
05/31/2007US20070120245 Semiconductor device
05/31/2007US20070120244 Semiconductor device having electrostatic breakdown protection element
05/31/2007US20070120243 Assembly jig and manufacturing method of multilayer semiconductor device
05/31/2007US20070120242 Semiconductor device and method of fabricating the same
05/31/2007US20070120241 Pin-type chip tooling
05/31/2007US20070120240 Circuit substrate and method of manufacture
05/31/2007US20070120239 Method and apparatus for full-chip thermal analysis of semiconductor chip designs
05/31/2007US20070120238 Semiconductor/printed circuit board assembly, and computer system
05/31/2007US20070120237 Semiconductor integrated circuit
05/31/2007US20070120236 Semiconductor device
05/31/2007US20070120235 Wiring board and method for manufacturing the same, and semiconductor device
05/31/2007US20070120234 Side view light emitting diode package
05/31/2007US20070120233 Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices
05/31/2007US20070120232 Laser fuse structures for high power applications
05/31/2007US20070120230 Layer structure, method of forming the layer structure, method of manufacturing a capacitor using the same and method of manufacturing a semiconductor device using the same
05/31/2007US20070120229 Wet etched insulator and electronic circuit component
05/31/2007US20070120228 Semiconductor wafer and manufacturing method therefor
05/31/2007US20070120227 Heating device of the light irradiation type
05/31/2007US20070120223 Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards
05/31/2007US20070120221 Electronically Programmable Antifuse and Circuits Made Therewith
05/31/2007US20070120215 Power semiconductor device using silicon substrate as field stop layer and method of manufacturing the same
05/31/2007US20070120193 Esd protection device
05/31/2007US20070120192 Method and apparatus that provides differential connections with improved ESD protection and routing
05/31/2007US20070120191 High trigger current electrostatic discharge protection device
05/31/2007US20070120190 Electrostatic discharge (ESD) protection structure and a circuit using the same
05/31/2007US20070120149 Package stiffener
05/31/2007US20070120125 Semiconductor Integrated Circuit Device and Method of Testing the Same
05/31/2007US20070120041 Sealed Package With Glass Window for Optoelectronic Components, and Assemblies Incorporating the Same
05/31/2007US20070119820 Power Module
05/31/2007US20070119617 Method for manufacturing component built-in module, and component built-in module
05/31/2007US20070119582 Thermal interface apparatus, systems, and methods
05/31/2007US20070119574 Flow distributing unit and cooling unit having bypass flow
05/31/2007US20070119369 Method for producing reactive intermediates for transport polymerization
05/31/2007US20070119051 Inductive Heating of Microelectronic Components
05/31/2007DE202006001000U1 Wärmeableitvorrichtung Heat sink
05/31/2007DE19963264B4 Trägermaterial für elektronische Hochleistungs-Bauelemente in SMD-Bauform und ein damit hergestelltes elektronisches Hochleistungs-Bauelement Support material for high performance electronic components in SMD style and thus produced high-performance electronic component
05/31/2007DE19958229B4 Optisches Halbleiter-Sensorbauelement A semiconductor optical sensor device
05/31/2007DE19817484B4 Legierungsblech auf Fe-Ni-Basis mit hervorragenden Oberflächeneigenschaften und hervorragender Ätzbarkeit Alloy sheet of Fe-Ni-base with excellent surface properties and excellent etchability
05/31/2007DE112005001952T5 Flüssigmetall-Wärmeschnittstelle für eine integrierte Schaltvorrichtung Liquid metal thermal interface for an integrated circuit device
05/31/2007DE112005001949T5 Verfahren und Vorrichtung zum Bereitstellen von Stapelchipelementen Method and apparatus for providing chip stack elements
05/31/2007DE112005001661T5 Halbleitervorrichtung, Substrat zum Herstellen einer Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device substrate for preparing a semiconductor device and method of manufacturing the same
05/31/2007DE10341059B4 Integrierte Schaltungsanordnung mit Kondensator und Herstellungsverfahren Integrated circuit arrangement having a capacitor and manufacturing method
05/31/2007DE10240641B4 Hochflexible Kühlluftführung Highly flexible cooling air
05/31/2007DE102006053927A1 Semiconductor component and production process has source-drain region with gate electrode and intermetallic dielectric layer of damascene structure with barrier and metallic cover layers
05/31/2007DE102006002449A1 Kühlungsmodul-Halterung Cooling module holder
05/31/2007DE102005057401A1 Semiconductor component and production process for power uses has semiconductor element with chip island having two contact strips in separate planes above the semiconductor element
05/31/2007DE102005057129A1 Schaltungsanordnung, Verfahren zur Steuerung einer Schwellenspannung eines Transistors, Diferenzverstärker mit der Schaltungsanordnung sowie Verwendung der Schaltungsanordnung Circuit arrangement, method for controlling a threshold voltage of a transistor, Diferenzverstärker with the circuit arrangement and use of the circuit arrangement
05/31/2007DE102005057076A1 Increasing adhesion of metal layers comprises determination of regions of reduced contact hole density and formation of position-holding contacts with metal
05/31/2007DE102005057075A1 Semiconductor component has copper alloy employed as barrier layer within copper metalizing layer
05/31/2007DE102005057072A1 Semiconductor component used in the production of integrated circuits comprises a metallizing layer stack having copper-based metal guiding layers and contact leadthrough layers
05/31/2007DE102005056908A1 Integrated circuit and production process has Shockley diode or thyristor especially for electrostatic discharge, ESD, protection with inner region screened by tub implantation
05/31/2007DE102005056906A1 Integrated circuit used as a block-type capacitor between two operating potential lines of the integrated circuit comprises two capacitors arranged in series forming a circuit node electrically insulated from other components of the circuit
05/31/2007DE102005056262A1 Production of layer arrangement, such arrangement and electronic component, comprises covers carbon layer with protective layer of carbide before applying electrically isolating layer
05/31/2007DE102005055950A1 Vorrichtung zur Passivierung wenigstens eines Bauelements durch ein Gehäuse und Verfahren zur Herstellung einer Vorrichtung Apparatus for passivation at least of a device through a housing and method for producing a device
05/31/2007DE102005055761A1 Leistungshalbleiterbauelement mit Halbleiterchipstapel in Brückenschaltung und Verfahren zur Herstellung desselben Power semiconductor component with the same semiconductor chip stack in a bridge circuit and methods for making
05/31/2007DE102005055713A1 Leistungshalbleitermodul mit Anschlusselementen Power semiconductor module with connecting elements
05/31/2007DE102005055402A1 Producing wiring structure on wafer substrate for center row arrangement or wafer level packaging comprises sputtering of seed layer to form trench and application of copper layer
05/31/2007DE102005054543A1 Halbleiterschalter mit integrierter Ansteuerschaltung Semiconductor switch with integrated control circuit
05/31/2007DE102005047104B3 Halbleiterbauelement mit miteinander verschalteten Zellstreifen A semiconductor device comprising interconnected cell strips
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