| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/05/2007 | US7227750 Heat dissipating pin structure for mitigation of LED temperature rise |
| 06/05/2007 | US7227268 Placement of sacrificial solder balls underneath the PBGA substrate |
| 06/05/2007 | US7227267 Semiconductor package using flip-chip mounting technique |
| 06/05/2007 | US7227266 Interconnect structure to reduce stress induced voiding effect |
| 06/05/2007 | US7227265 Electroplated copper interconnection structure, process for making and electroplating bath |
| 06/05/2007 | US7227264 Semiconductor device and method for manufacturing semiconductor device |
| 06/05/2007 | US7227263 Semiconductor device with recessed post electrode |
| 06/05/2007 | US7227262 Manufacturing method for semiconductor device and semiconductor device |
| 06/05/2007 | US7227261 Vertical surface mount assembly and methods |
| 06/05/2007 | US7227260 Method and system for a pad structure for use with a semiconductor package |
| 06/05/2007 | US7227259 Low-inductance circuit arrangement for power semiconductor modules |
| 06/05/2007 | US7227258 Mounting structure in integrated circuit module |
| 06/05/2007 | US7227257 Cooling micro-channels |
| 06/05/2007 | US7227256 Die-up ball grid array package with printed circuit board attachable heat spreader |
| 06/05/2007 | US7227255 Semiconductor device and method of producing the same |
| 06/05/2007 | US7227254 Integrated circuit package |
| 06/05/2007 | US7227253 Ultra thin dual chip image sensor package structure and method for fabrication |
| 06/05/2007 | US7227252 Semiconductor component having stacked, encapsulated dice and method of fabrication |
| 06/05/2007 | US7227251 Semiconductor device and a memory system including a plurality of IC chips in a common package |
| 06/05/2007 | US7227250 Ball grid array substrate having window and method of fabricating same |
| 06/05/2007 | US7227249 Three-dimensional stacked semiconductor package with chips on opposite sides of lead |
| 06/05/2007 | US7227248 Stacked land grid array package |
| 06/05/2007 | US7227247 IC package with signal land pads |
| 06/05/2007 | US7227246 Matching circuits on optoelectronic devices |
| 06/05/2007 | US7227245 Die attach pad for use in semiconductor manufacturing and method of making same |
| 06/05/2007 | US7227244 Integrated low k dielectrics and etch stops |
| 06/05/2007 | US7227243 Semiconductor device |
| 06/05/2007 | US7227240 Semiconductor device with wire bond inductor and method |
| 06/05/2007 | US7227238 Integrated fuse with regions of different doping within the fuse neck |
| 06/05/2007 | US7227231 Semiconductor integrated circuit device |
| 06/05/2007 | US7227222 Semiconductor device and manufacturing method thereof |
| 06/05/2007 | US7227214 Semiconductor device and method of manufacturing the same |
| 06/05/2007 | US7227213 Process for manufacturing a through insulated interconnection in a body of semiconductor material |
| 06/05/2007 | US7227212 Method of forming a floating metal structure in an integrated circuit |
| 06/05/2007 | US7227204 Structure for improved diode ideality |
| 06/05/2007 | US7227198 Half-bridge package |
| 06/05/2007 | US7227181 Organic light emitting device and method of fabricating the same |
| 06/05/2007 | US7227179 Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
| 06/05/2007 | US7227095 Wire bonders and methods of wire-bonding |
| 06/05/2007 | US7227086 Semiconductor chip package having an adhesive tape attached on bonding wires |
| 06/05/2007 | US7226867 Method of etching a metal layer using a mask, a metallization method for a semiconductor device, a method of etching a metal layer, and an etching gas |
| 06/05/2007 | US7226858 Submicron contact fill using a CVD TiN barrier and high temperature PVD aluminum alloy deposition |
| 06/05/2007 | US7226855 Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor |
| 06/05/2007 | US7226828 Architecture to monitor isolation integrity between floating gate and source line |
| 06/05/2007 | US7226816 Method of forming connection and anti-fuse in layered substrate such as SOI |
| 06/05/2007 | US7226815 Method for manufacturing semiconductor device |
| 06/05/2007 | US7226814 Semiconductor package device and method for fabricating the same |
| 06/05/2007 | US7226813 Semiconductor package |
| 06/05/2007 | US7226812 Wafer support and release in wafer processing |
| 06/05/2007 | US7226809 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods |
| 06/05/2007 | US7226807 Method of production of circuit board utilizing electroplating |
| 06/05/2007 | US7226654 Laminated wiring board and its mounting structure |
| 06/05/2007 | US7226653 Printed circuit board and method for producing a printed circuit board |
| 06/05/2007 | US7226547 Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same |
| 06/05/2007 | US7226219 High-frequency signal transmitting optical module and method of fabricating the same |
| 06/05/2007 | US7225861 Bubble cycling heat exchanger |
| 06/05/2007 | US7225538 Resilient contact structures formed and then attached to a substrate |
| 06/05/2007 | CA2287682C High performance fan tail heat exchanger |
| 06/05/2007 | CA2248141C Semiconductor device shielded by an array of electrically conducting pins and a method to manufacture such a device |
| 05/31/2007 | WO2007062345A2 Method and system for iteratively, selectively tuning a parameter of a doped workpiece using a pulsed laser |
| 05/31/2007 | WO2007062165A2 Alloys for flip chip interconnects and bumps |
| 05/31/2007 | WO2007062122A2 Semiconductor devices including voltage switchable materials for over-voltage protection |
| 05/31/2007 | WO2007062025A1 Synthetic fibrillar structure and method of making thereof |
| 05/31/2007 | WO2007061854A2 Compliant base to increase contact for micro- or nano-fibers |
| 05/31/2007 | WO2007061429A2 Printed circuit boards and the like with improved signal integrity for differential signal pairs |
| 05/31/2007 | WO2007061245A1 Ic holder |
| 05/31/2007 | WO2007061124A1 Semiconductor wafer including semiconductor chips divided by scribe line and process-monitor electrode pads formed on scribe line |
| 05/31/2007 | WO2007061112A1 Circuit member, method for manufacturing circuit member, and semiconductor device comprising circuit member |
| 05/31/2007 | WO2007061062A1 Method for manufacturing wafer level package structure |
| 05/31/2007 | WO2007061059A1 Sensor device and method for manufacturing same |
| 05/31/2007 | WO2007061056A1 Sensor device and method for manufacturing same |
| 05/31/2007 | WO2007061054A1 Wafer level package structure and sensor device obtained from such package structure |
| 05/31/2007 | WO2007061050A1 Sensor device and method for manufacturing same |
| 05/31/2007 | WO2007061047A1 Wafer level package structure and method for manufacturing same |
| 05/31/2007 | WO2007061037A1 Liquid resin composition for electronic component and electronic component device |
| 05/31/2007 | WO2007061026A1 Composite sheet and use thereof |
| 05/31/2007 | WO2007060966A1 Electronic component mounting board and method for manufacturing such board |
| 05/31/2007 | WO2007060812A1 Semiconductor device and method for manufacturing semiconductor device |
| 05/31/2007 | WO2007060784A1 Circuit module and method for fabricating the same |
| 05/31/2007 | WO2007060704A1 Finned heat sink, particularly for a thermoelectric module |
| 05/31/2007 | WO2007060657A1 System and method for producing a solar cell array |
| 05/31/2007 | WO2007060640A2 Method of forming a self aligned copper capping layer |
| 05/31/2007 | WO2007060414A1 Method of enclosing a micro-electromechanical element |
| 05/31/2007 | WO2007059657A1 Package structure of light-emitting diode |
| 05/31/2007 | WO2007059551A1 Low area screen printed metal contact structure and method |
| 05/31/2007 | WO2007043639A9 Printed wiring board and method for manufacturing printed wiring board |
| 05/31/2007 | WO2007027902A3 Package-on-package semiconductor assembly |
| 05/31/2007 | WO2007024483A3 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices |
| 05/31/2007 | WO2007013024A3 Flip-chip package with air cavity |
| 05/31/2007 | WO2006086114A3 Method of manufacturing a hermetic chamber with electrical feedthroughs |
| 05/31/2007 | WO2006009782A3 Persistent p-type group ii-vi semiconductors |
| 05/31/2007 | US20070123684 Epoxy compound, preparation method thereof, and use thereof |
| 05/31/2007 | US20070123066 Interconnection element for BGA housings and method for producing the same |
| 05/31/2007 | US20070123055 Insulating material |
| 05/31/2007 | US20070123043 A semiconductor device comprising a copper alloy as a barrier layer in a copper metallization layer |
| 05/31/2007 | US20070123036 Method of filling structures for forming via-first dual damascene interconnects |
| 05/31/2007 | US20070123030 Semiconductor devices and methods of manufacturing semiconductor devices |
| 05/31/2007 | US20070123029 Semiconductor device and method for manufacturing the same |
| 05/31/2007 | US20070123026 Semiconductor device having high frequency components and manufacturing method thereof |
| 05/31/2007 | US20070123025 Forming a barrier layer in joint structures |