Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2007
06/06/2007DE102006041575A1 Halbleitervorrichtung Semiconductor device
06/06/2007DE102005056760A1 Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung A method for mounting semiconductor chips and corresponding semiconductor chip system
06/06/2007DE102005056569A1 Zwischenverbindung für Flip-Chip in Package Aufbauten Intermediate for flip-chip package in structures
06/06/2007DE102005055132A1 Vorrichtung zum Umrichten eines elektrischen Stromes und Verfahren zur Reduzierung der Lastwechselbeanspruchung von Leistungshalbleitereinheiten im Bereich der Hochspannungsenergieverteilung und -übertragung Apparatus for converting an electric current and method for reducing the load cycling of power semiconductor devices in the field of high voltage power distribution and transmission
06/06/2007DE102005051853B3 Damped mounting for electric blower has a circular damping element between a central mounting hole and an outer support rim
06/06/2007DE102005031262B4 Kühlkörpervorrichtung Heat sink device
06/06/2007CN2909803Y Heat sink
06/06/2007CN2909802Y Water-cooled radiator of extendable heat absorption element
06/06/2007CN2909801Y Improved structure of fin
06/06/2007CN2909800Y Water-cooled radiation unit
06/06/2007CN2909799Y Heat sink
06/06/2007CN2909798Y Liquid-cooled radiation head
06/06/2007CN2909797Y Heat sink
06/06/2007CN2909796Y Heat sink
06/06/2007CN2909795Y Water-cooled heat sink with cooling chip
06/06/2007CN2909641Y Arc protection cover of large rectifier element and its end cap
06/06/2007CN2909532Y 半导体器件 Semiconductor devices
06/06/2007CN2909531Y Storage card structure
06/06/2007CN2909530Y Control structure capable of reducing noise of transistor high frequency signal
06/06/2007CN2909529Y Chip pckage structure of 46-pin integrated circuit
06/06/2007CN2909528Y Point electroplating triode lead frame
06/06/2007CN2909527Y Point electroplating lead frame
06/06/2007CN2909526Y Point electroplating high power lead frame
06/06/2007CN2909525Y Improved structure of package chip for manufactured management control
06/06/2007CN2909524Y 半导体元件 Semiconductor device
06/06/2007CN2909523Y Nondirectional passive chip heat sink
06/06/2007CN2909522Y Heat sink structure
06/06/2007CN2909521Y Chip level silicon punching heat sink structure
06/06/2007CN2909520Y Chip packing structure and chip array block for prolonging tin-ball service life
06/06/2007CN2909365Y Heat sink structure
06/06/2007CN1977574A Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device and electronic device using multilayer wiring board
06/06/2007CN1977401A Integrated parallel peltier/seebeck element chip and production method therefor, connection method
06/06/2007CN1977384A Methods and apparatus for packaging integrated circuit devices
06/06/2007CN1977380A A screened electrical device and a process for manufacturing the same
06/06/2007CN1977379A Cooling tube in electronic devices
06/06/2007CN1977378A Aluminum-silicon carbide composite
06/06/2007CN1977377A Twin fin arrayed cooling devices
06/06/2007CN1977376A Improved etch method
06/06/2007CN1977375A Stacked module systems and methods
06/06/2007CN1977370A Lead solder indicator and method
06/06/2007CN1977365A Through substrate and interposer, and method for manufacturing through substrate
06/06/2007CN1977200A Optoelectronic flip-chip package with optical waveguide accomodated in upper layers of substrate board
06/06/2007CN1977153A Temperature control mechanism in a memory device
06/06/2007CN1976807A Resin-impregnated flexible graphite articles
06/06/2007CN1976574A Electronic apparatus
06/06/2007CN1976573A Heat transfer apparatus, cooled electronic module and fabrication methods thereof
06/06/2007CN1976570A Heat exchange assemblies and methods of manufacturing the same
06/06/2007CN1976396A 照相机组件封装件 The camera module package
06/06/2007CN1976080A Large power light-emitting diode reflective cup parts
06/06/2007CN1976079A Light emitting device and method for manufacturing light emitting device
06/06/2007CN1976077A Paster diode with new structure and producing method thereof
06/06/2007CN1976054A Organic illuminating display device
06/06/2007CN1976051A Displaying panel of display device
06/06/2007CN1976044A Thin-film transistor display panel and manufacturing method therefor
06/06/2007CN1976038A Semiconductor device and method for manufacturing the same
06/06/2007CN1976036A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
06/06/2007CN1976035A CMOS compatible shallow-trench e-fuse structure and method of manufacturing the same
06/06/2007CN1976032A 半导体器件 Semiconductor devices
06/06/2007CN1976028A ESD protection element
06/06/2007CN1976027A Semiconductor structure and method of forming capacitance circuit element
06/06/2007CN1976024A 电路模块 Circuit module
06/06/2007CN1976023A Output match transistor
06/06/2007CN1976022A Layout for detected device arrays used in semiconductor wafer testing
06/06/2007CN1976021A Multipurpose measurement marking, and method, system and computer program product using the same
06/06/2007CN1976020A 互连结构及其形成方法 Interconnect structure and method of forming
06/06/2007CN1976019A Semiconductor apparatus integrating an electrical device under an electrode pad
06/06/2007CN1976018A Wiring board and method for producing the same
06/06/2007CN1976017A Wiring board and method for manufacturing the same, and semiconductor device
06/06/2007CN1976016A Lead frame comprising tin plating or an intermetallic layer formed therefrom
06/06/2007CN1976015A Semiconductor device and method for manufacturing same, and semiconductor wafer
06/06/2007CN1976014A Semiconductor device and its production method
06/06/2007CN1976013A Optical semiconductor device and its manufacture method
06/06/2007CN1976012A Semiconductor chip having island dispersion structure and method for manufacturing the same
06/06/2007CN1976009A Method for repairing thin-film transistor array substrate and thin film removing method
06/06/2007CN1975948A Sheet capacitor
06/06/2007CN1975942A Sheet capacitor
06/06/2007CN1975741A System and method for product yield prediction
06/06/2007CN1320846C Circuit board and its manufacturing method
06/06/2007CN1320695C Structure and method for fabrication of a leadless chip carrier with embedded antenna
06/06/2007CN1320651C Chip with a plurality of internal functional blocks and method for power supply and noise reduction
06/06/2007CN1320648C Electronic module
06/06/2007CN1320647C 集成电路芯片 IC chip
06/06/2007CN1320646C 半导体器件 Semiconductor devices
06/06/2007CN1320645C Semiconductor device and its making method
06/06/2007CN1320644C Wafer grade package, multiple package overlapping and its producing method
06/06/2007CN1320643C Flat curved type heat pipe integrated heat radiator for electron element
06/06/2007CN1320642C Method and structure for self healing cracks in under-fill material between an I/C chip and a substrate bonded together with solder balls
06/06/2007CN1320640C 半导体晶片 Semiconductor wafer
06/06/2007CN1320633C Structure and producing method of back-fuse type memory assembly
06/06/2007CN1320630C Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect
06/06/2007CN1320622C Semiconductor element and system, wafers, its use and measuring method
06/06/2007CN1320620C Semiconductor device and producing method thereof
06/06/2007CN1320619C Method for producing semiconductor and heat-resisting pressure-sensitive adhesive tape
06/06/2007CN1320617C Semiconductor device chip scale surface assembling and packaging, and manufacturing method therefor
06/06/2007CN1320597C Device and method for preventing oxidizing of electronic device
06/06/2007CN1320417C Electronic apparatus having a circulating path of liquid coolant
06/06/2007CN1320075C Heat curable adhesive composition, article, semiconductor apparatus and method
06/06/2007CN1320073C Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
06/06/2007CN1320019C Epoxy resin composition for sealing optical semiconductor
06/05/2007US7227753 Method and apparatus for cooling heat-generating structure
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