Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2007
06/07/2007US20070128845 Interconnect structure of an integrated circuit and manufacturing method thereof
06/07/2007US20070128818 Method and system for hermetically sealing packages for optics
06/07/2007US20070128806 High performance CMOS transistors using PMD liner stress
06/07/2007US20070128802 Nonvolatile semiconductor memory and manufacturing method thereof
06/07/2007US20070128784 Method and structure for buried circuits and devices
06/07/2007US20070128778 Nonvolatile semiconductor memory and manufacturing method thereof
06/07/2007US20070128772 Metal-base circuit board and its manufacturing method
06/07/2007US20070128770 Microelectronic component assemblies having lead frames adapted to reduce package bow
06/07/2007US20070128769 Semiconductor device and manufacturing method thereof
06/07/2007US20070128754 Sensor component and panel used for the production thereof
06/07/2007US20070128744 Self-assembly of molecules and nanotubes and/or nanowires in nanocell computing devices, and methods for programming same
06/07/2007US20070128741 System and method for using a split capacitive barrier edge sensor
06/07/2007US20070128739 Method for making tools for micro replication
06/07/2007US20070128737 Microelectronic devices and methods for packaging microelectronic devices
06/07/2007US20070127217 Electronic device
06/07/2007US20070127025 Periodic Patterns and Technique to Control Misalignment Between Two Layers
06/07/2007US20070126959 Liquid Crystal Display Device
06/07/2007US20070126446 Ground-signal-ground (gsg) test structure
06/07/2007US20070126316 Electronic device
06/07/2007US20070126131 Sensor system having a substrate and a housing, and method for manufacturing a sensor system
06/07/2007US20070126130 Sensor Module And Method For Manufacturing Same
06/07/2007US20070126129 Die bonding adhesive tape
06/07/2007US20070126128 Semiconductor device and method of manufacturing the same
06/07/2007US20070126127 Semiconductor device and method of manufacturing the same
06/07/2007US20070126126 Solder bonding structure using bridge type pattern
06/07/2007US20070126125 Memory Module System and Method
06/07/2007US20070126124 Memory Module System and Method
06/07/2007US20070126123 Wiring board and wiring board connecting apparatus
06/07/2007US20070126122 Semiconductor device with a wiring substrate and method for producing the same
06/07/2007US20070126121 Via structure with improved reliability
06/07/2007US20070126120 Semiconductor device
06/07/2007US20070126119 Semiconductor element, production process thereof, semiconductor laser and production process thereof
06/07/2007US20070126118 Mounting flexible circuits onto integrated circuit substrates
06/07/2007US20070126117 Semiconductor module and manufacturing method thereof
06/07/2007US20070126116 Integrated Circuit Micro-Cooler Having Tubes of a CNT Array in Essentially the Same Height over a Surface
06/07/2007US20070126115 Package substrate
06/07/2007US20070126114 Heat-dissipating member, method of manufacturing the same, semiconductor module having the heat-dissipating member, and method of manufacturing the semiconductor module
06/07/2007US20070126113 Semiconductor device
06/07/2007US20070126112 Metal core, package board, and fabricating method thereof
06/07/2007US20070126111 Microelectronic packaging and components
06/07/2007US20070126110 Circuit film with bump, film package using the same, and related fabrication methods
06/07/2007US20070126109 Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device
06/07/2007US20070126108 External connection structure for semiconductor package, and method for manufacturing the same
06/07/2007US20070126107 Multi-chip semiconductor connector assembly method
06/07/2007US20070126106 Multi-chip semiconductor connector and method
06/07/2007US20070126105 Stacked type semiconductor memory device and chip selection circuit
06/07/2007US20070126104 Method of assembling a carriage assembly and assembling apparatus
06/07/2007US20070126103 Microelectronic 3-D package defining thermal through vias and method of making same
06/07/2007US20070126102 Stacked microelectronic packages
06/07/2007US20070126101 Memory card module
06/07/2007US20070126100 Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes
06/07/2007US20070126099 Memory card
06/07/2007US20070126098 Surface-mountable light-emitting diode structural element
06/07/2007US20070126097 Chip package structure
06/07/2007US20070126096 Leadframe comprising tin plating or an intermetallic layer formed therefrom
06/07/2007US20070126095 Semiconductor device and manufacturing method thereof
06/07/2007US20070126094 Microelectronic package having a stiffening element and method of making same
06/07/2007US20070126093 High thermal conducting circuit substrate and manufacturing process thereof
06/07/2007US20070126092 Leadless semiconductor package and method of manufacture
06/07/2007US20070126091 Semiconductor components having through wire interconnects (TWI)
06/07/2007US20070126090 Tape carrier package and display device including tape carrier package
06/07/2007US20070126089 Method of manufacturing a semiconductor package using lead frame having through holes or hollows therein
06/07/2007US20070126088 Chip on lead frame for small package speed sensor
06/07/2007US20070126085 Semiconductor device and method of manufacturing the same
06/07/2007US20070126084 Semiconductor device including fuse focus detector, fabrication method thereof and laser repair method using the fuse detector
06/07/2007US20070126068 Microcomponent comprising a hermetically-sealed cavity and a plug, and method of producing one such microcomponent
06/07/2007US20070126029 Integrated circuit devices having fuse structures including buffer layers
06/07/2007US20070125526 Cooling device for electronic components
06/07/2007US20070125525 Arrangement used to secure a fan frame
06/07/2007US20070125522 Embedded heat pipe in a hybrid cooling system
06/07/2007US20070125517 Cooling element for heat dissipation in electronic components
06/07/2007US20070124928 Circuit substrates, semiconductor devices, semiconductor manufacturing apparatuses, methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devices
06/07/2007US20070124926 Circuit board and method for manufacturing the same
06/07/2007CA2632044A1 Semiconductor light engine for automotive lighting
06/07/2007CA2630041A1 Improved heat sink assembly
06/06/2007EP1793426A2 Semiconductor device having a via hole and its manufacturing method
06/06/2007EP1793422A2 System and method of enhanced boiling heat transfer using pin fins
06/06/2007EP1793421A2 Semiconductor device, substrate for mounting a semiconductor chip, process for their production, adhesive, and double-sided adhesive film
06/06/2007EP1792938A2 Thermally conductive polyterafluorethylene article
06/06/2007EP1792528A2 Method for mounting an electronic component on a preferably soft support, and resulting electronic enitity, such as a passport
06/06/2007EP1792526A1 Electronic device provided with an integrated heat spreader
06/06/2007EP1792517A1 Audio processing device with encapsulated electronic component.
06/06/2007EP1792344A1 Integrated circuit module and multi-chip circuit module comprising an integrated circuit module of this type
06/06/2007EP1792343A2 Formation of metal-insulator metal capacitor simultaneously with aluminum metal wiring level using a hardmask
06/06/2007EP1791874A1 Thermally conductive sheet
06/06/2007EP1552735A4 Heat sink made from longer and shorter graphite sheets
06/06/2007EP1532416A4 Composite heat sink with metal base and graphite fins
06/06/2007EP1490908B1 Power module comprising at least two substrates and method for producing the same
06/06/2007EP1325516A4 Integrating metal with ultra low-k dielectrics
06/06/2007EP1216266B1 Transparent liquid resin material for smt-enabled led-applications at higher temperatures and higher luminosities
06/06/2007EP0760165B1 Electronic device comprising means for compensating an undesired capacitance
06/06/2007DE19959725B4 Integrierte elektronische Schaltung mit wenigstens einer Induktivität und Verfahren zu ihrer Herstellung Integrated electronic circuit comprising at least an inductor and process for their preparation
06/06/2007DE19910111B4 Verfahren zur Herstellung eines elektrotechnischen Bauteils mit einer kunststoffpassivierten Oberfläche und Vorrichtung zum Durchführen des Verfahrens Process for the preparation of an electrotechnical component with a plastic passivated surface and device for carrying out the method
06/06/2007DE112005001681T5 Halbleitervorrichtung, Substrat zum Herstellen einer Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device substrate for preparing a semiconductor device and method of manufacturing the same
06/06/2007DE112005001479T5 Halbleiter-Laser-Vorrichtung A semiconductor laser device
06/06/2007DE10303925B4 Dielektrische Barrierenschicht für eine Kupfermetallisierungsschicht mit einer über die Dicke hinweg variierenden Siliziumkonzentration und Verfahren zu deren Herstellung Dielectric barrier layer for a copper metallization with a varying across the thickness of silicon concentration, and process for their preparation
06/06/2007DE10201781B4 Hochfrequenz-Leistungsbauteil und Hochfrequenz-Leistungsmodul sowie Verfahren zur Herstellung derselben Radio frequency power device and high-frequency power module and method of producing same
06/06/2007DE102006051672A1 System und Verfahren für adaptive Abkühlungsprofile für ein Informationsverarbeitungssystem System and method for adaptive cooling profiles for an information processing system
06/06/2007DE102006051151A1 Verfahren zum Bilden von Mehrschicht-Bumps auf einem Substrat A method for forming multi-layer bumps on a substrate
06/06/2007DE102006046425A1 Verfahren zur Bildung einer Justiermarke eines Halbleiterbauelements A method of forming an alignment mark of a semiconductor device
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