| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/13/2007 | CN1978122A High-temperature solder, high-temperature solder paste and power semiconductor device using same |
| 06/13/2007 | CN1977825A Aseptic medicinal composition |
| 06/13/2007 | CN1321456C Method of forming molten through hole structure |
| 06/13/2007 | CN1321455C Semiconductor device and packaging and its manufacturing method |
| 06/13/2007 | CN1321454C Semiconductor element cooler and its control method |
| 06/13/2007 | CN1321453C Semiconductor chip module and heat radiating assembly thereof |
| 06/13/2007 | CN1321452C Grid matrix packed body for enhancing electric connected ground and packing method thereof |
| 06/13/2007 | CN1321451C Semiconductor integrated circuit device |
| 06/13/2007 | CN1321444C Wiring pattern embedding checking method, semiconductor device manufacturing method and checking device |
| 06/13/2007 | CN1321440C Forming method of contact hole and manufacturing method of semiconductor device |
| 06/13/2007 | CN1321437C Producing method for semiconductor device, semiconductor device, circuit placode and electronic apparatus |
| 06/13/2007 | CN1321436C Simulation circuit pattern evaluation method, manufacturing method of semiconductor integrated circuit, test substrate, and test substrate group |
| 06/13/2007 | CN1321226C Plating machine and process for producing film carrier tapes for mounting electronic parts |
| 06/12/2007 | USRE39690 Enhanced planarization technique for an integrated circuit |
| 06/12/2007 | US7230830 Semiconductor device socket |
| 06/12/2007 | US7230828 Heat dissipation device |
| 06/12/2007 | US7230749 Light blocking electrical interconnect |
| 06/12/2007 | US7230705 Alignment target with designed in offset |
| 06/12/2007 | US7230668 Reflection type liquid crystal display device with a passivation layer directly on the pad electrode |
| 06/12/2007 | US7230477 Semiconductor integrated circuit device |
| 06/12/2007 | US7230450 Programming semiconductor dies for pin map compatibility |
| 06/12/2007 | US7230342 Registration mark within an overlap of dopant regions |
| 06/12/2007 | US7230341 Electronic device and method of manufacturing the same, circuit board, and electronic instrument |
| 06/12/2007 | US7230340 Post passivation interconnection schemes on top of the IC chips |
| 06/12/2007 | US7230339 Copper ring solder mask defined ball grid array pad |
| 06/12/2007 | US7230338 Semiconductor device that improves electrical connection reliability |
| 06/12/2007 | US7230337 Semiconductor device including ladder-shaped siloxane hydride and method for manufacturing same |
| 06/12/2007 | US7230336 Dual damascene copper interconnect to a damascene tungsten wiring level |
| 06/12/2007 | US7230335 Inspection methods and structures for visualizing and/or detecting specific chip structures |
| 06/12/2007 | US7230334 Semiconductor integrated circuit chip packages having integrated microchannel cooling modules |
| 06/12/2007 | US7230333 Semiconductor package |
| 06/12/2007 | US7230332 Chip package with embedded component |
| 06/12/2007 | US7230331 Chip package structure and process for fabricating the same |
| 06/12/2007 | US7230330 Semiconductor die packages with recessed interconnecting structures |
| 06/12/2007 | US7230329 Semiconductor device, electronic device, electronic equipment, method of manufacturing semiconductor device, and method of manufacturing electronic device |
| 06/12/2007 | US7230328 Semiconductor package and laminated semiconductor package |
| 06/12/2007 | US7230327 IC card |
| 06/12/2007 | US7230326 Semiconductor device and wire bonding chip size package therefor |
| 06/12/2007 | US7230325 Encapsulation for particle entrapment |
| 06/12/2007 | US7230324 Strobe light control circuit and IGBT device |
| 06/12/2007 | US7230323 Ground-enhanced semiconductor package and lead frame for the same |
| 06/12/2007 | US7230322 Semiconductor device and method of manufacturing the same |
| 06/12/2007 | US7230321 Integrated circuit package with laminated power cell having coplanar electrode |
| 06/12/2007 | US7230320 Electronic circuit device with reduced breaking and cracking |
| 06/12/2007 | US7230319 Electronic substrate |
| 06/12/2007 | US7230318 RF and MMIC stackable micro-modules |
| 06/12/2007 | US7230317 Capacitor placement for integrated circuit packages |
| 06/12/2007 | US7230316 Semiconductor device having transferred integrated circuit |
| 06/12/2007 | US7230314 Semiconductor device and method of forming a semiconductor device |
| 06/12/2007 | US7230310 Super-junction voltage sustaining layer with alternating semiconductor and High-K dielectric regions |
| 06/12/2007 | US7230309 Semiconductor component and sensor component for data transmission devices |
| 06/12/2007 | US7230273 Semiconductor device with a plurality of semiconductor elements each including a wide band-gap semiconductor |
| 06/12/2007 | US7229924 Surface barriers for copper and silver interconnects produced by a damascene process |
| 06/12/2007 | US7229922 Method for making a semiconductor device having increased conductive material reliability |
| 06/12/2007 | US7229921 Semiconductor device and manufacturing method for the same |
| 06/12/2007 | US7229914 Wiring layer structure for ferroelectric capacitor |
| 06/12/2007 | US7229913 Stitched micro-via to enhance adhesion and mechanical strength |
| 06/12/2007 | US7229911 Adhesion improvement for low k dielectrics to conductive materials |
| 06/12/2007 | US7229910 Method of producing a semiconductor device having a multi-layered insulation film |
| 06/12/2007 | US7229905 Alignment and orientation features for a semiconductor package |
| 06/12/2007 | US7229857 Method for producing a protection for chip edges and system for the protection of chip edges |
| 06/12/2007 | US7229856 Method of manufacturing electronic part packaging structure |
| 06/12/2007 | US7229855 Process for assembling a double-sided circuit component |
| 06/12/2007 | US7229849 Method for packaging a semiconductor device |
| 06/12/2007 | US7229848 Method and apparatus for fabricating self-assembling microstructures |
| 06/12/2007 | US7229572 Photoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same |
| 06/12/2007 | US7229569 For manufacturing a wiring using low resistance copper |
| 06/12/2007 | US7228894 Heat spreader with controlled Z-axis conductivity |
| 06/12/2007 | US7228623 Process for fabricating a multi layer circuit assembly |
| 06/12/2007 | CA2351687C Device for increasing heat transfer |
| 06/09/2007 | CA2570880A1 Method of making an electronic device cooling system |
| 06/09/2007 | CA2570847A1 Method of making an electronic device cooling system |
| 06/07/2007 | WO2007065117A2 Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices |
| 06/07/2007 | WO2007064572A1 Improved heat sink assembly |
| 06/07/2007 | WO2007064012A1 METHOD FOR FORMING Cu FILM |
| 06/07/2007 | WO2007063991A1 Thin film transistor substrate and display device |
| 06/07/2007 | WO2007063960A1 Prepreg, process for producing prepreg, substrate, and semiconductor device |
| 06/07/2007 | WO2007063954A1 Circuit device and method for manufacturing circuit device |
| 06/07/2007 | WO2007063921A1 Method for forming wiring film |
| 06/07/2007 | WO2007063692A1 Ceramic substrate, electronic device, and process for producing ceramic substrate |
| 06/07/2007 | WO2007063510A2 Bumpless flip-chip assembly with a compliant interposer contractor |
| 06/07/2007 | WO2007063170A1 A component casing comprising a micro circuit |
| 06/07/2007 | WO2007063113A1 3d electronic module |
| 06/07/2007 | WO2007063044A2 Laser fuse structures for high power applications |
| 06/07/2007 | WO2007062976A1 Method for mounting semiconductor chips and corresponding semiconductor chip arrangement |
| 06/07/2007 | WO2007062500A1 Semiconductor light engine for automotive lighting |
| 06/07/2007 | WO2007043340A9 Semiconductor device |
| 06/07/2007 | WO2007021563A3 Thickness tapered substrate launch |
| 06/07/2007 | WO2007008171A3 Integrated circuit device and method of manufacturing thereof |
| 06/07/2007 | WO2006104582A3 Method and system for increasing tensile stress in a thin film using collimated electromagnetic radiation |
| 06/07/2007 | WO2006051188A3 Iron-nickel alloy strip for the manufacture of support grids for integrated circuits |
| 06/07/2007 | US20070130554 Integrated Circuit With Dual Electrical Attachment Pad Configuration |
| 06/07/2007 | US20070129000 Rack enclosure |
| 06/07/2007 | US20070128881 Adhesion by plasma conditioning of semiconductor chip surfaces |
| 06/07/2007 | US20070128879 Reactive cyclodextrin derivatives as pore-forming templates, and low dielectric materials prepared by using the same |
| 06/07/2007 | US20070128868 Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby |
| 06/07/2007 | US20070128867 Method for enhanced uni-directional diffusion of metal and subsequent silicide formation |
| 06/07/2007 | US20070128862 Apparatus and process for plasma-enhanced atomic layer deposition |
| 06/07/2007 | US20070128848 Dual damascene wiring and method |
| 06/07/2007 | US20070128847 Semiconductor device and a method for manufacturing the same |