Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2007
06/13/2007EP1796165A2 Method of making an electronic device cooling system
06/13/2007EP1796164A1 Aluminum-silicon carbide composite
06/13/2007EP1796163A1 Semiconductor device and electronic control unit using the same
06/13/2007EP1796160A1 Semiconductor device, power supply apparatus using the same, and electronic device
06/13/2007EP1796137A2 Apparatus and clocked method for pressure sintering
06/13/2007EP1795852A1 Cooling device for semiconductor elements
06/13/2007EP1795627A1 CVD method for forming a porous low dielectric constant SiOCH film
06/13/2007EP1795626A1 Chemical vapor deposition of fluorocarbon polymer thin films
06/13/2007EP1795550A1 Epoxy resin composition for optical semiconductor encapsulation
06/13/2007EP1795548A1 Curable diamantane compound
06/13/2007EP1794794A1 Analogue measurement of alignment between layers of a semiconductor device
06/13/2007EP1794792A2 Gap-change sensing through capacitive techniques
06/13/2007EP1794787A1 Conductor frame for an electronic component and method for the production thereof
06/13/2007EP1794224A1 Thermally conductive composite and uses for microelectronic packaging
06/13/2007EP1794081A1 Packaged microchip with premolded-type package
06/13/2007EP1683404B1 Flow distributing unit and cooling unit having bypass flow
06/13/2007EP1664198B1 Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance
06/13/2007EP1614125B1 Method for producing soldering globules on an electrical component
06/13/2007EP1432664B1 Self-constrained low temperature glass-ceramic unfired tape for microelectronics and methods for making and using the same
06/13/2007EP1340245B1 Method for incorporating silicon into cvd metal films
06/13/2007EP1295078A4 Graphite-based heat sink
06/13/2007EP1150551B1 Conductive connecting pin and package board
06/13/2007EP0928021B1 Process for manufacturing semiconductor device
06/13/2007EP0885457A4 Method for making a circuit structure having a flip-mounted matrix of devices
06/13/2007EP0803132B1 Flip chip bonding with non-conductive adhesive
06/13/2007CN2912206Y Fastener structure of radiator
06/13/2007CN2912204Y Radiator
06/13/2007CN2912203Y Simple buckling structure of radiating fins
06/13/2007CN2912201Y Radiator having deflection structure
06/13/2007CN2912200Y 散热器结构 Radiator structure
06/13/2007CN2912096Y 3-level large power module
06/13/2007CN2911965Y White-light LED
06/13/2007CN2911964Y Electromagnetic shielding device for infrared receiver
06/13/2007CN2911962Y Flat rectifying bridge
06/13/2007CN2911961Y Reverselly encapsulated chip element
06/13/2007CN2911960Y Encapsulated chip element
06/13/2007CN2911959Y Buckle of radiator
06/13/2007CN2911958Y Encapsulated chip element with externally arranged radiator fins
06/13/2007CN1981377A System and method for encapsulation and protection of components
06/13/2007CN1980767A Methods of drilling through-holes in homogenous and non-homogeneous substrates
06/13/2007CN1980562A Liquid-cooling type electronic-device radiator
06/13/2007CN1980560A Water-cooling type radiating structure and mfg. method
06/13/2007CN1980559A Radiating system
06/13/2007CN1980547A Electronic apparatus and method of manufacturing the same
06/13/2007CN1980526A Circuit board assembly and flat coil
06/13/2007CN1980523A Metal core, package board, and fabricating method thereof
06/13/2007CN1980518A Electrostatic-discharge-proof electronic apparatus
06/13/2007CN1979906A Led光源装置 Led light source device
06/13/2007CN1979903A Light emitting-diode module group
06/13/2007CN1979881A Package structure of image sensor
06/13/2007CN1979880A Image sensing-detecting chip and circuit board combination
06/13/2007CN1979877A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
06/13/2007CN1979876A Array baseplate of film transistor with electrostatic protection
06/13/2007CN1979872A Diode-less array for one-time programmable memory
06/13/2007CN1979868A Semiconductor metal capacitor
06/13/2007CN1979867A 半导体金属电容 Semiconductor metal capacitors
06/13/2007CN1979861A Electrostatic-preventing protection circuit structure NPN-type triode triggered by selflining base
06/13/2007CN1979858A Electrostatic-proof protection device
06/13/2007CN1979856A Electrostatic discharge protection circuit, display panel, and electronic system utilizing the same
06/13/2007CN1979854A Electrostatic discharge protection circuit triggered by grid voltage
06/13/2007CN1979853A Improved polycrystalline silicon source region boundary electric-field structure for electrostatic discharge protection
06/13/2007CN1979849A 电容结构 Capacitance structure
06/13/2007CN1979847A Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device
06/13/2007CN1979846A Electrostatic-proof protection structure using NMOS
06/13/2007CN1979845A Electrostatic protection circuit in integrated circuit
06/13/2007CN1979844A Electrostatic protection circuit in integrated circuit
06/13/2007CN1979843A Electroelectric discharging circuit using diode chain
06/13/2007CN1979842A Electrostatic discharging protection circuit triggered by lining-bottom
06/13/2007CN1979841A Semiconductor structure and manufacture method thereof
06/13/2007CN1979840A Flat panel display and method of fabricating the same
06/13/2007CN1979839A Structure of reducing guide-hole stress and making method
06/13/2007CN1979838A Internal connection-wire structure and its mfg. method
06/13/2007CN1979837A Application method of press welding block on top of logic integrated circuit
06/13/2007CN1979836A Semiconductor device and electronic control unit using the same
06/13/2007CN1979835A Solder bonding structure using a bridge type pattern
06/13/2007CN1979834A Base-plate structure of semiconductor package direct electric-connection
06/13/2007CN1979833A Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device
06/13/2007CN1979832A 芯片与封装结构 Chip package structure
06/13/2007CN1979831A Jointing welding plate of low-k dielectric material and method for making semiconductor device
06/13/2007CN1979830A Chip with projection cube structure
06/13/2007CN1979829A Tape carrier package and display device including tape carrier package
06/13/2007CN1979828A Metal silicide nano-wire and its making method
06/13/2007CN1979827A Radiating apparatus
06/13/2007CN1979826A Radiating apparatus and high-heat-conductive composite material used therefor
06/13/2007CN1979825A Micro-jet-flow water-cooling system for luminuous diode LED
06/13/2007CN1979824A Radiating apparatus
06/13/2007CN1979823A Radiating apparatus
06/13/2007CN1979822A Radiating apparatus
06/13/2007CN1979821A Radiating module
06/13/2007CN1979820A Radiating apparatus
06/13/2007CN1979819A Radiating module
06/13/2007CN1979818A Semiconductor devices and manufacturing method thereof
06/13/2007CN1979817A Semiconductor structure and its preparing process
06/13/2007CN1979801A Contact window forming method and semiconductor element
06/13/2007CN1979683A Nonvolatile semiconductor memory
06/13/2007CN1979380A Embedded heat pipe in a hybrid cooling system
06/13/2007CN1979361A High-power-consumption integrated circuit over-hot protection method
06/13/2007CN1979205A Methods for variability measurement of integrated circuit components and integrated circuit components
06/13/2007CN1978582A Heat-conductive cream and electronic device using same
06/13/2007CN1978580A Heat-conductive cream and electronic device using same
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