Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2007
06/14/2007WO2006127107A3 Semiconductor package and method for forming the same
06/14/2007WO2006124597B1 Infinitely stackable interconnect device and method
06/14/2007WO2006121828A3 One time programmable memory cell
06/14/2007WO2006068654A3 Systems and methods for nanowire growth and manufacturing
06/14/2007WO2006038907A3 Lead-free solder composition for substrates
06/14/2007US20070136702 Semiconductor device layout inspection method
06/14/2007US20070135616 Production of method of granular epoxy resin, and granular epoxy resin package
06/14/2007US20070135565 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
06/14/2007US20070135072 Wireless communication system
06/14/2007US20070134907 Substrate processing method and fabrication process of a semiconductor device
06/14/2007US20070134894 Removable liners for charged particle beam systems
06/14/2007US20070134851 Space-efficient package for laterally conducting device
06/14/2007US20070134848 Chip Module and Method for Producing a Chip Module
06/14/2007US20070134846 Electronic member fabricating method and ic chip with adhesive material
06/14/2007US20070134845 Method of forming molded resin semiconductor device
06/14/2007US20070134841 Electrical and thermal contact for use in semiconductor devices and corresponding methods
06/14/2007US20070134496 Carbon nanotube-dispersed composite material, method for producing same and article same is applied to
06/14/2007US20070134491 Metal nano-particles and method for preparing the same, dispersion of metal nano-particles and method for preparing the same, and thin metallic wire and metal film and method for preparing these substances
06/14/2007US20070133183 Electric motor and method for producing said motor
06/14/2007US20070132593 RFID tag
06/14/2007US20070132478 Semiconductor Fuse Covering
06/14/2007US20070132127 Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods
06/14/2007US20070132113 Alkyl-phenyl silsesquioxane resins compositions
06/14/2007US20070132112 Semiconductor device and mold for resin-molding semiconductor device
06/14/2007US20070132111 Fine-sized chip package structure
06/14/2007US20070132110 Semiconductor device having a molded package
06/14/2007US20070132109 Electrical microfilament to circuit interface
06/14/2007US20070132108 Method for manufacturing a wafer level chip scale package
06/14/2007US20070132107 Chip package structure and process for fabricating the same
06/14/2007US20070132106 Forming compliant contact pads for semiconductor packages
06/14/2007US20070132105 Selective activation of aluminum, copper, and tungsten structures
06/14/2007US20070132104 Semiconductor component having plate, stacked dice and conductive vias
06/14/2007US20070132103 Semiconductor device, and method and apparatus for inspecting appearance thereof
06/14/2007US20070132102 Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device
06/14/2007US20070132101 Semiconductor device and method of manufacturing a semiconductor device
06/14/2007US20070132100 Semiconductor device and method for fabricating the same
06/14/2007US20070132099 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
06/14/2007US20070132098 Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin
06/14/2007US20070132097 Projected contact structures for engaging bumped semiconductor devices
06/14/2007US20070132096 Semiconductor device and method of manufacturing the same
06/14/2007US20070132095 Integrated circuit chip with external pads and process for fabricating such a chip
06/14/2007US20070132094 Circuit module
06/14/2007US20070132093 System-in-package structure
06/14/2007US20070132092 Light-emitting diode assembly and method of fabrication
06/14/2007US20070132091 Thermal enhanced upper and dual heat sink exposed molded leadless package
06/14/2007US20070132090 Semiconductor device
06/14/2007US20070132089 Microelectronic devices and methods for manufacturing microelectronic devices
06/14/2007US20070132088 Printed circuit board
06/14/2007US20070132087 Via hole having fine hole land and method for forming the same
06/14/2007US20070132086 Integrated circuit devices including compliant material under bond pads and methods of fabrication
06/14/2007US20070132085 Stacked semiconductor device
06/14/2007US20070132084 Multichip stacking structure
06/14/2007US20070132083 Semiconductor package having increased resistance to electrostatic discharge
06/14/2007US20070132082 Copper plating connection for multi-die stack in substrate package
06/14/2007US20070132081 Multiple stacked die window csp package and method of manufacture
06/14/2007US20070132080 Semiconductor chip mounted interposer, semiconductor device, semiconductor chip interposer fabrication method, bare chip mounted interposer, and interposer sheet
06/14/2007US20070132079 Power Semiconductor Component With Semiconductor Chip Stack In A Bridge Circuit And Method For Producing The Same
06/14/2007US20070132078 Underfill film having thermally conductive sheet
06/14/2007US20070132077 Flip chip MLP with conductive ink
06/14/2007US20070132076 High temperature package flip-chip bonding to ceramic
06/14/2007US20070132075 Structure and method for thin single or multichip semiconductor QFN packages
06/14/2007US20070132074 Chip package structure
06/14/2007US20070132073 Device and method for assembling a top and bottom exposed packaged semiconductor
06/14/2007US20070132072 Chip package and coreless package substrate thereof
06/14/2007US20070132071 Package module with alignment structure and electronic device with the same
06/14/2007US20070132069 Semiconductor chip and shielding structure thereof
06/14/2007US20070132068 Large-sized substrate and method of producing the same
06/14/2007US20070132067 Wafer-to-wafer alignments
06/14/2007US20070132066 Substrate having minimum kerf width
06/14/2007US20070132030 ESD Protection Circuits And Related Techniques
06/14/2007US20070132029 ESD protection for passive integrated devices
06/14/2007US20070132028 Semiconductor device and method of manufacturing the same
06/14/2007US20070131966 Programmable memory cell in an integrated circuit chip
06/14/2007US20070131943 Active matrix electroluminescence device having a metallic protective layer and method for fabricating the same
06/14/2007US20070131931 Semiconductor wafer and semiconductor device, and method for manufacturing same
06/14/2007US20070131930 Semiconductor device and method for fabricating the same
06/14/2007US20070131409 Heat radiating apparatus and electronic apparatus
06/14/2007US20070131387 Heat sink with heat pipes and method for manufacturing the same
06/14/2007US20070131349 Method for manufacturing an electronic module, and an electronic module
06/14/2007US20070131173 Wafer support system
06/14/2007US20070131141 Surface processing agent for tin or tin alloy material
06/14/2007DE60311755T2 Elektronisches Substrat, Leistungsmodul und Motorantrieb Electronic substrate, power module and motor drive
06/14/2007DE202007003916U1 Magnetisch-anziehende Struktur für einen Ventilator und deren magnetisch-anziehende Elemente Electromagnetic attractive structure for a fan and the magnetic-catching elements
06/14/2007DE19957326B4 Verfahren zur Herstellung von Kontaktstrukturen A method for producing contact structures
06/14/2007DE19837336B4 Verfahren zur Herstellung einer Platte von gekapselten integrierten Schaltkreisen und Form zum Kapseln eines plattenförmigen Substrats von integrierten Schaltkreisen A method for manufacturing a plate of the encapsulated integrated circuits and to form capsules of a plate-shaped substrate of integrated circuits
06/14/2007DE19722507B4 Verfahren zur Herstellung einer elektrtrisch leitend mit einer integrierten Schaltung verbundenen Litze integrierte Schaltung mit einem Anschluss und Drehzahlsensor A method for producing a conductive elektrtrisch integrated with an integrated circuit connected to a terminal wire circuit and speed sensor
06/14/2007DE19708325B4 Klebeverbindung von elektrisch leitenden Fügeteilen Adhesive bond electrically conductive parts to be joined
06/14/2007DE112005001733T5 Ultraviolettbestrahlungseinrichtung Ultraviolet irradiation device
06/14/2007DE112005001321T5 Halbelastischer Verbindungsmechanismus für Halbleiterkühlanwendungen Semi-Flexible coupling mechanism for semiconductor cooling applications
06/14/2007DE102006057041A1 Halbleitervorrichtungen mit Struktur zum Erfassen von elektrischem Strom Semiconductor devices with structures for detecting electric current
06/14/2007DE102006056066A1 Halbleiterbauelement mit Justiermarkierungsschicht und Herstellungsverfahren A semiconductor device manufacturing method and with Justiermarkierungsschicht
06/14/2007DE102005058780A1 Mikrowärmeübertrager sowie die Verwendung desselben als Fluidkühler für elektronische Bauteile Micro heat exchangers and the use thereof as a fluid cooler for electronic components
06/14/2007DE102005053842A1 Chip components made from semiconductor wafer, include connection elements coplanar with plastic mass, for surface mounting on higher-order circuit board
06/14/2007DE102005011652B4 Verfahren zum Herstellen eines Halbleiterbauelements A method of manufacturing a semiconductor device
06/14/2007DE10196082B4 FLIP-CHIP-Montageverfahren Flip-chip mounting method
06/14/2007DE10106492B4 Verbiegefähige Halbleitervorrichtung und Verfahren zu deren Herstellung Verbiegefähige semiconductor device and process for their preparation
06/13/2007EP1796445A2 Multilayer printed circuit board
06/13/2007EP1796376A1 Camera-module manufacturing method
06/13/2007EP1796267A1 Electronic component
06/13/2007EP1796166A1 Integrated circuit chip with external lands and fabrication method of the same
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