| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/20/2007 | CN1983571A Polycrystalline silicon layer, flat panel display using the polyscrystalline silicon layer and method for fabricating the same |
| 06/20/2007 | CN1983570A Polycrystalline silicon layer, method for fabricating the same and flat panel display |
| 06/20/2007 | CN1983566A Stacked thin film transistor, non-volatile memory devices and methods for fabricating the same |
| 06/20/2007 | CN1983542A Method for manufacturing electronic device |
| 06/20/2007 | CN1983540A Process for producing flip-chip type semiconductor device and semiconductor device produced by the process |
| 06/20/2007 | CN1983538A Method of making semiconductor package with reduced moisture sensitivity |
| 06/20/2007 | CN1983461A Low dielectric materials and methods for making same |
| 06/20/2007 | CN1982405A Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages |
| 06/20/2007 | CN1322798C Arrangement introduced in an electronic device for the identification of apparel goods within production chain |
| 06/20/2007 | CN1322587C Electrical contacts for flexible displays |
| 06/20/2007 | CN1322586C Electrostatic discharge protection device for high-voltage integrated circuit |
| 06/20/2007 | CN1322585C Fuse element and integrated circuit device using said element |
| 06/20/2007 | CN1322584C Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package |
| 06/20/2007 | CN1322583C Semiconductor device and manufacturing meethod thereof |
| 06/20/2007 | CN1322582C Electronic device using evaporative micro-cooling and associated methods |
| 06/20/2007 | CN1322581C Foundation plate for semiconductor package structure |
| 06/20/2007 | CN1322580C 胶粘带 Adhesive tape |
| 06/20/2007 | CN1322578C Self-aligned conductive line for cross-point magnetic memory integrated circuits |
| 06/20/2007 | CN1322576C Method for producing semiconductor integrated circuit |
| 06/20/2007 | CN1322573C Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby |
| 06/20/2007 | CN1322572C Interconnect structures and a method of electroless introduction of interconnect structures |
| 06/20/2007 | CN1322566C 半导体装置 Semiconductor device |
| 06/20/2007 | CN1322562C Monitoring low-temp quick thermal annealing process by ion implanted chip |
| 06/20/2007 | CN1322441C Multi-chip package type memory system |
| 06/20/2007 | CN1322394C Unpowered self-loop computer liquid cooling system |
| 06/20/2007 | CN1322060C Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module |
| 06/20/2007 | CA2568678A1 Cooling device with bypass channel |
| 06/19/2007 | US7234124 Method and apparatus for performing power routing on a voltage island within an integrated circuit chip |
| 06/19/2007 | US7233874 Method and apparatus for monitoring integrated circuit fabrication |
| 06/19/2007 | US7233534 Electronic circuit package |
| 06/19/2007 | US7233496 Heat dissipation device including wire clips |
| 06/19/2007 | US7233492 Cooling systems and methods for same |
| 06/19/2007 | US7233161 Integrated circuit and associated packaged integrated circuit having an integrated marking apparatus |
| 06/19/2007 | US7233152 Short detection circuit and short detection method |
| 06/19/2007 | US7233077 Semiconductor device |
| 06/19/2007 | US7233076 Semiconductor device with read out prevention and method of producing same |
| 06/19/2007 | US7233075 Bonding pad structure |
| 06/19/2007 | US7233074 Semiconductor device with improved contacts |
| 06/19/2007 | US7233073 Semiconductor device and method for fabricating the same |
| 06/19/2007 | US7233072 Electronic part and surface treatment method of the same |
| 06/19/2007 | US7233071 Low-k dielectric layer based upon carbon nanostructures |
| 06/19/2007 | US7233070 Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the same |
| 06/19/2007 | US7233069 Interconnection substrate and fabrication method thereof |
| 06/19/2007 | US7233068 Filling small dimension vias using supercritical carbon dioxide |
| 06/19/2007 | US7233067 Manufacturing a bump electrode with roughened face |
| 06/19/2007 | US7233066 Multilayer wiring substrate, and method of producing same |
| 06/19/2007 | US7233065 Semiconductor device having capacitors for reducing power source noise |
| 06/19/2007 | US7233064 Semiconductor BGA package having a segmented voltage plane and method of making |
| 06/19/2007 | US7233063 Borderless contact structures |
| 06/19/2007 | US7233062 Integrated circuit package with improved electro-static discharge protection |
| 06/19/2007 | US7233061 Interposer for impedance matching |
| 06/19/2007 | US7233060 Module card structure |
| 06/19/2007 | US7233059 Semiconductor arrangement |
| 06/19/2007 | US7233058 Memory card with an adaptor |
| 06/19/2007 | US7233057 Integrated circuit package with optimized mold shape |
| 06/19/2007 | US7233056 Chip scale package with heat spreader |
| 06/19/2007 | US7233055 Chip circuit comprising an inductor |
| 06/19/2007 | US7233052 Semiconductor device including fine dummy patterns |
| 06/19/2007 | US7233045 Semiconductor device and system |
| 06/19/2007 | US7233032 SRAM device having high aspect ratio cell boundary |
| 06/19/2007 | US7233030 Device transfer method and panel |
| 06/19/2007 | US7233027 Arrangement comprising at least two different electronic semiconductor circuits |
| 06/19/2007 | US7232957 Hybrid integrated circuit device and method of manufacturing the same |
| 06/19/2007 | US7232874 Interlayer insulating film, method for forming the same and polymer composition |
| 06/19/2007 | US7232766 System and method for surface reduction, passivation, corrosion prevention and activation of copper surface |
| 06/19/2007 | US7232758 Method of correcting lithographic process and method of forming overlay mark |
| 06/19/2007 | US7232757 Semiconductor integrated circuit device and fabrication method for semiconductor integrated circuit device |
| 06/19/2007 | US7232754 Microelectronic devices and methods for forming interconnects in microelectronic devices |
| 06/19/2007 | US7232749 Integrated circuit inductane and the fabrication method thereof |
| 06/19/2007 | US7232747 Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation |
| 06/19/2007 | US7232746 Method for forming dual damascene interconnection in semiconductor device |
| 06/19/2007 | US7232736 Semiconductor devices with capacitors of metal/insulator/metal structure and methods for forming the same |
| 06/19/2007 | US7232713 Methods of forming interconnect lines |
| 06/19/2007 | US7232710 Method of making cascaded die mountings with springs-loaded contact-bond options |
| 06/19/2007 | US7232708 Multi-mode integrated circuit structure |
| 06/19/2007 | US7232705 Integrated circuit bond pad structures and methods of making |
| 06/19/2007 | US7232704 Semiconductor device assembly method and semiconductor device assembly apparatus |
| 06/19/2007 | US7232698 Method for fabricating CMOS image sensor protecting low temperature oxide delamination |
| 06/19/2007 | US7232332 Support and grounding structure |
| 06/19/2007 | US7231961 Low-profile thermosyphon-based cooling system for computers and other electronic devices |
| 06/19/2007 | US7231960 Cooler for cooling both sides of semiconductor device |
| 06/19/2007 | US7231772 Compact, high-efficiency thermoelectric systems |
| 06/19/2007 | US7231712 Method of manufacturing a module |
| 06/19/2007 | US7231711 Packaging structure of a driving circuit for a liquid crystal display device and packaging method of driving circuit for a liquid crystal display device |
| 06/14/2007 | WO2007067998A2 Device and method for assembling a top and bottom exposed packaged semiconductor |
| 06/14/2007 | WO2007067982A2 Flip chip mlp with conductive ink |
| 06/14/2007 | WO2007067954A2 Thermal enhanced upper and dual heat sink exposed molded leadless package |
| 06/14/2007 | WO2007067591A2 Solder deposition and thermal processing of thin-die thermal interface material |
| 06/14/2007 | WO2007067589A2 Insulated gate devices and method of making same |
| 06/14/2007 | WO2007067422A1 Chip on lead frame for small package speed sensor |
| 06/14/2007 | WO2007067330A2 Leadless semiconductor package and method of manufacture |
| 06/14/2007 | WO2007066763A1 Liquid resin composition for electronic element and electronic element device |
| 06/14/2007 | WO2007066658A1 Method for forming dielectric film |
| 06/14/2007 | WO2007066409A1 Semiconductor device and its manufacturing method |
| 06/14/2007 | WO2007066401A1 Process for producing electronic part, process for producing heat conducting member, and method of mounting heat conducting member for electronic part |
| 06/14/2007 | WO2007066400A1 Semiconductor device |
| 06/14/2007 | WO2007066396A1 Semiconductor device and method of analyzing failures |
| 06/14/2007 | WO2007065705A1 Micro-heat exchanger and the use thereof as a fluid cooler for electronic components |
| 06/14/2007 | WO2007050754A3 Stackable wafer or die packaging with enhanced thermal and device performance |
| 06/14/2007 | WO2007035608A3 Termination structure |