| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/21/2007 | US20070138604 Heat fixture for wire bonding |
| 06/21/2007 | US20070138603 Apparatus and method incorporating discrete passive components in an electronic package |
| 06/21/2007 | US20070138602 Field device incorporating circuit card assembly as environmental and EMI/RFI shield |
| 06/21/2007 | US20070138601 Etch resistant wafer processing apparatus and method for producing the same |
| 06/21/2007 | US20070138596 Semiconductor device module structure |
| 06/21/2007 | US20070138572 An electronics package with an integrated circuit device having post wafer fabrication integrated passive components |
| 06/21/2007 | US20070138560 Semiconductor device and method of manufacturing the same |
| 06/21/2007 | US20070138557 Semiconductor device |
| 06/21/2007 | US20070138532 Semiconductor device with a line and method of fabrication thereof |
| 06/21/2007 | US20070138498 Methods and apparatus for packaging integrated circuit devices |
| 06/21/2007 | US20070138466 Apparatus for testing a semiconductor module |
| 06/21/2007 | US20070138465 Fabrication and test methods and systems |
| 06/21/2007 | US20070138438 Fine particle sizes; narrow particle size distribution; display devices and lighting elements; printed on explosives or ammunitions; currency; printed on confidential documentation |
| 06/21/2007 | US20070137889 Multi-strand substrate for ball-grid array assemblies and method |
| 06/21/2007 | US20070137887 Adhesive for bonding circuit members, circuit board and process for its production |
| 06/21/2007 | US20070137849 Heatsink with offset fins |
| 06/21/2007 | US20070137029 Method for fabricating semiconductor component with adjustment circuit for adjusting physical or electrical characteristics of substrate conductors |
| 06/21/2007 | DE202007005627U1 Befestigung für Kühlkörper Attachment for heat sink |
| 06/21/2007 | DE202007005096U1 Vorrichtung zur Wärmeabstrahlung Device for heat dissipation |
| 06/21/2007 | DE202007003909U1 Prozessor auf Basis der Spiegelresonanztechnologie zur Stabilisierung und Harmonisierung von Energieflüssen Processor based on the resonant mirror technology for stabilizing and harmonizing energy flows |
| 06/21/2007 | DE202007001266U1 Flüssigkeitsgekühlte Wärmesenke Liquid-cooled heat sink |
| 06/21/2007 | DE112004002722T5 Halbleitergehäuse mit perforiertem Substrat Semiconductor package with perforated substrate |
| 06/21/2007 | DE10338291B4 Verfahren zum Herstellen einer Halbleitervorrichtung mit Durchdringungselektroden mittels anodischer Oxidation A method of manufacturing a semiconductor device with penetrating electrodes by anodic oxidation |
| 06/21/2007 | DE10219353B4 Halbleiterbauelement mit zwei Halbleiterchips Semiconductor component having two semiconductor chips |
| 06/21/2007 | DE10201056B4 Halbleitereinrichtung mit einem bipolaren Schutztransistor A semiconductor device with a bipolar transistor protection |
| 06/21/2007 | DE102005061015A1 Halbleiterbauteil mit einem vertikalen Halbleiterbauelement und Verfahren zu dessen Herstellung A semiconductor device comprising a vertical semiconductor device and process for its preparation |
| 06/21/2007 | DE102005045056B4 Integrierte Schaltungsanordnung mit mehreren Leitstrukturlagen und Kondensator An integrated circuit device having a plurality of conductive structure and capacitor |
| 06/21/2007 | DE102005015109B4 Verfahren zum Montieren von Halbleiterchips auf einem Substrat und entsprechende Anordnung A method of mounting semiconductor chips on a substrate and corresponding arrangement |
| 06/21/2007 | CA2633906A1 Arrangement having at least one electronic component |
| 06/20/2007 | EP1798767A2 Circuit board and production method therefor |
| 06/20/2007 | EP1798766A2 Method for forming leadframe assemblies |
| 06/20/2007 | EP1798763A1 Semiconductor device and die bonding method therefor |
| 06/20/2007 | EP1797617A2 Ceramic antenna module and methods of manufacture thereof |
| 06/20/2007 | EP1797591A1 3d interconnect with protruding contacts |
| 06/20/2007 | EP1797155A2 Thermally conductive composition and method for preparing the same |
| 06/20/2007 | EP1797016A2 Method of forming a coating on a substrate, and a coating thus formed |
| 06/20/2007 | EP1642485B1 Electronic device provided with a magnetic screening |
| 06/20/2007 | EP1374266B1 Support for an electrical circuit in particular an electrical breaker |
| 06/20/2007 | EP1133793B1 Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin |
| 06/20/2007 | CN2914609Y Automatization device combining electronic element terminal with connection blade |
| 06/20/2007 | CN2914608Y Heat dissipation blade fixing device, compression screw and screw bolt |
| 06/20/2007 | CN2914605Y Heat dissipation fan fixing structure, fan bracket and fan installing cover |
| 06/20/2007 | CN2914602Y Fixing structure of heat dissipation module |
| 06/20/2007 | CN2914600Y Water-cooled heat dissipation device |
| 06/20/2007 | CN2914335Y Light leakage preventing type surface-tack lighting diode supporting frame |
| 06/20/2007 | CN2914334Y Leakage preventing type surface-tack diode supporting frame |
| 06/20/2007 | CN2914332Y LED capsulation structure |
| 06/20/2007 | CN2914329Y Integrated circuit stack conformation |
| 06/20/2007 | CN2914328Y Structure of commutation diode |
| 06/20/2007 | CN2914327Y North and south bridge chip water-cooling heat-dissipation structure |
| 06/20/2007 | CN2914164Y Programmable analog integrated circuit chip able to reduce power consumption |
| 06/20/2007 | CN1985554A Ic插座 Ic Socket |
| 06/20/2007 | CN1985379A Covers for microelectronic imagers and methods for wafer-level packaging of microelectronic imagers |
| 06/20/2007 | CN1985370A Electronic device comprising an ESD device |
| 06/20/2007 | CN1985366A Method of manufacture of electronic or functional devices |
| 06/20/2007 | CN1985352A Interfacial layer for use with high k dielectric materials |
| 06/20/2007 | CN1985014A Material for conductor tracks made of copper alloy |
| 06/20/2007 | CN1984961A 环氧树脂组合物及半导体装置 Epoxy resin composition and semiconductor device |
| 06/20/2007 | CN1984747A Method for welding two welding parts by means of a fillet weld and welding part with an inclined tapered edge area therefor |
| 06/20/2007 | CN1984553A Electronic apparatus including removable dust catcher |
| 06/20/2007 | CN1984552A Fixed base of improved radiating mould set |
| 06/20/2007 | CN1984551A Radiating structure |
| 06/20/2007 | CN1984543A Radiator of cycling LED |
| 06/20/2007 | CN1983661A Transparent polymeric electrode for electro-optical structures |
| 06/20/2007 | CN1983648A LED and negative-light mould set therewith |
| 06/20/2007 | CN1983625A 显示装置 The display device |
| 06/20/2007 | CN1983618A Unipolar resistance random access memory device and vertically stacked architecture |
| 06/20/2007 | CN1983617A Electrically rewritable non-volatile memory element and method of manufacturing the same |
| 06/20/2007 | CN1983616A Phase-change memory device and method of manufacturing same |
| 06/20/2007 | CN1983615A Phase-change memory device and method of manufacturing same |
| 06/20/2007 | CN1983612A 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 06/20/2007 | CN1983608A Pixel sensor unit and method of protecting device region from electromagnetic radiation |
| 06/20/2007 | CN1983607A Display device and making method of the same |
| 06/20/2007 | CN1983605A 半导体集成电路装置 The semiconductor integrated circuit device |
| 06/20/2007 | CN1983604A Thin film transistor array panel of liquid crystal display and method for manufacturing the same |
| 06/20/2007 | CN1983603A Semiconductor device and fabrication method thereof |
| 06/20/2007 | CN1983602A Semiconductor memory device and method for manufacturing the same |
| 06/20/2007 | CN1983601A Dual-gate dynamic random access memory device and method of fabricating the same |
| 06/20/2007 | CN1983594A LED luminescent device combined with rectifying circuit on secondary carrier and its production |
| 06/20/2007 | CN1983593A High--power active thin light-emitting diode |
| 06/20/2007 | CN1983592A Image sensing devices, image sensor modules, and manufacturing methods |
| 06/20/2007 | CN1983590A High luminance light emitting diode and liquid crystal display using the same |
| 06/20/2007 | CN1983589A Internal connecting wire with multi-chip packing structure |
| 06/20/2007 | CN1983588A Anti-electrostatic protecting structure by NMOS |
| 06/20/2007 | CN1983587A 半导体结构及其形成方法 And a method for forming a semiconductor structure |
| 06/20/2007 | CN1983586A 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 06/20/2007 | CN1983585A Semiconductor laminating structure, its production and semiconductor device |
| 06/20/2007 | CN1983584A Semiconductor device and inspection method thereof |
| 06/20/2007 | CN1983583A Active-device base and lead frame therewith |
| 06/20/2007 | CN1983582A Semiconductor device |
| 06/20/2007 | CN1983581A Semiconductor device |
| 06/20/2007 | CN1983580A Molded package element |
| 06/20/2007 | CN1983579A Semiconductor device and method for designing the same |
| 06/20/2007 | CN1983578A Connecting structure of integrated circuit and its production |
| 06/20/2007 | CN1983577A Fastener of radiator |
| 06/20/2007 | CN1983576A Fastener of radiator |
| 06/20/2007 | CN1983575A Flexible chip radiator and method and system for cooling using the same |
| 06/20/2007 | CN1983574A Semiconductor device and mold for resin-molding semiconductor device |
| 06/20/2007 | CN1983573A Semiconductor device and method for fabricating the same |
| 06/20/2007 | CN1983572A Semiconductor device and manufacturing method thereof |