| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/26/2007 | US7234513 Microchannel flat-plate heat pipe with parallel grooves for recycling coolant |
| 06/26/2007 | US7234232 Methods for designing and tuning one or more packaged integrated circuits |
| 06/26/2007 | US7234231 Method of manufacturing a lead frame |
| 06/26/2007 | CA2246574C Ultrafine nickel powder |
| 06/21/2007 | WO2007070533A2 Electrical microfilament to circuit interface |
| 06/21/2007 | WO2007070356A2 Package using array capacitor core |
| 06/21/2007 | WO2007070011A1 Semiconductor package and method of fabrication thereof |
| 06/21/2007 | WO2007069606A1 Substrate with built-in chip and method for manufacturing substrate with built-in chip |
| 06/21/2007 | WO2007069525A1 Epoxy resin composition for encapsulation and electronic component device |
| 06/21/2007 | WO2007069491A1 High-frequency substrate and process for producing the same |
| 06/21/2007 | WO2007069427A1 Module having built-in electronic component and method for manufacturing such module |
| 06/21/2007 | WO2007069419A1 Copper based composite base material for electronic part, electronic part and process for producing copper based composite base material for electronic part |
| 06/21/2007 | WO2007069399A1 Light emitting device, semiconductor device, and its manufacturing method |
| 06/21/2007 | WO2007045232A3 Photodiode chip having a high limit frequency |
| 06/21/2007 | WO2007044368A3 Minimized profile circuit module systems and methods |
| 06/21/2007 | WO2007027790B1 Reversible-multiple footprint package and method of manufacturing |
| 06/21/2007 | WO2007027663A3 Method and apparatus for evaporative cooling within microfluidic systems |
| 06/21/2007 | WO2007027417A3 Microfeature assemblies including interconnect structures and methods for forming such interconnect structures |
| 06/21/2007 | WO2007024355A3 Heat sink packaging assembly for electronic components |
| 06/21/2007 | WO2007016039A3 Improved microelectronic bond pad |
| 06/21/2007 | WO2006101577A3 Lead frame panel and a plurality of half-etched connection bars |
| 06/21/2007 | WO2006073818A3 System for and method of forming via holes by use of selective plasma etching in a continuous inline shadow mask deposition process |
| 06/21/2007 | WO2006053277A3 Wire bond interconnection |
| 06/21/2007 | WO2006034393A3 Redistributed solder pads using etched lead frame |
| 06/21/2007 | WO2005124850A8 Semiconductor device and production method for semiconductor device |
| 06/21/2007 | WO2005043591A3 HIGH PERFORMANCE STRESS-ENHANCED MOSFETs USING Si:C AND SiGe EPITAXIAL SOURCE/DRAIN AND METHOD OF MANUFACTURE |
| 06/21/2007 | US20070142528 (Meth)acrylate monomer, organic peroxide, decomposition accelerator, and inorganic filler; potting material, adhesives; thermoconductivity |
| 06/21/2007 | US20070141835 Methods of fabricating interconnects for semiconductor components |
| 06/21/2007 | US20070141832 Integrated circuit insulators and related methods |
| 06/21/2007 | US20070141831 Semiconductor device with a line and method of fabrication thereof |
| 06/21/2007 | US20070141829 Semiconductive device fabricated using subliming materials to form interlevel dielectrics |
| 06/21/2007 | US20070141800 Thin-film capacitor and method for fabricating the same, electronic device and circuit board |
| 06/21/2007 | US20070141774 Method and apparatus for a deposited fill layer |
| 06/21/2007 | US20070141761 Method for fabricating semiconductor packages, and structure and method for positioning semiconductor components |
| 06/21/2007 | US20070141756 Leadframe and method of manufacturing the same |
| 06/21/2007 | US20070141755 Ribbon bonding in an electronic package |
| 06/21/2007 | US20070141754 Wire bonding system and method of use |
| 06/21/2007 | US20070141746 Methods of nanotube films and articles |
| 06/21/2007 | US20070141315 Metal-based carbon fiber composite material and method for producing the same |
| 06/21/2007 | US20070141251 Method of forming thin metal films on substrates |
| 06/21/2007 | US20070139989 Tamper-resistant packaging and approach using magnetically-set data |
| 06/21/2007 | US20070139979 Pressure-contact type rectifier |
| 06/21/2007 | US20070139938 Led light with active cooling |
| 06/21/2007 | US20070139896 Modular heat-radiation structure and controller including the structure |
| 06/21/2007 | US20070139210 Wireless system with multi-device control |
| 06/21/2007 | US20070138659 Paste for solar cell electrode, solar cell electrode manufacturing method, and solar cell |
| 06/21/2007 | US20070138658 Electronic component having an encapsulating compound |
| 06/21/2007 | US20070138657 Physically highly secure multi-chip assembly |
| 06/21/2007 | US20070138656 Providing a metal layer in a semiconductor package |
| 06/21/2007 | US20070138655 Pad structure of semiconductor device and formation method |
| 06/21/2007 | US20070138654 Semiconductor chip, film substrate, and related semiconductor chip package |
| 06/21/2007 | US20070138653 Method and power control structure for managing plurality of voltage islands |
| 06/21/2007 | US20070138652 Peel strength simulating apparatus, peel strength simulating program storage medium, and peel strength simulating method |
| 06/21/2007 | US20070138651 Package for high power density devices |
| 06/21/2007 | US20070138650 Semiconductor device and die bonding method therefor |
| 06/21/2007 | US20070138649 Contact structure formed by jet printing |
| 06/21/2007 | US20070138648 Schottky Diode Device with Aluminum Pickup of Backside Cathode |
| 06/21/2007 | US20070138647 Integrated circuit package to provide high-bandwidth communication among multiple dice |
| 06/21/2007 | US20070138646 Integrated Circuit Resistor |
| 06/21/2007 | US20070138645 Semiconductor integrated circuit and semiconductor device having multilayer interconnection |
| 06/21/2007 | US20070138644 Structure and method of making capped chip having discrete article assembled into vertical interconnect |
| 06/21/2007 | US20070138643 Semiconductor device having metal interconnection structure and method for forming the same |
| 06/21/2007 | US20070138642 Interconnections having double capping layer and method for forming the same |
| 06/21/2007 | US20070138641 Semiconductor device and method for fabricating the same |
| 06/21/2007 | US20070138640 Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectrics |
| 06/21/2007 | US20070138639 Pad structure in a semiconductor device and a method of forming a pad structure |
| 06/21/2007 | US20070138638 Semiconductor device |
| 06/21/2007 | US20070138637 Electronic device having low background luminescence, a black layer, or any combination thereof |
| 06/21/2007 | US20070138636 Method of forming a semiconductor structure having metal migration semiconductor barrier layers |
| 06/21/2007 | US20070138635 Semiconductor device and manufacturing method of the same |
| 06/21/2007 | US20070138634 Semiconductor Device Comprising A Vertical Semiconductor Component And Method For Producing The Same |
| 06/21/2007 | US20070138633 Thick film capacitors on ceramic interconnect substrates |
| 06/21/2007 | US20070138632 Electronic carrier board and package structure thereof |
| 06/21/2007 | US20070138631 Multi-stacked package and method of manufacturing the same |
| 06/21/2007 | US20070138630 Structure of circuit board and method for fabricating same |
| 06/21/2007 | US20070138629 Component stacking for integrated circuit electronic package |
| 06/21/2007 | US20070138628 Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package |
| 06/21/2007 | US20070138627 Heat spreader and package structure utilizing the same |
| 06/21/2007 | US20070138626 Crossing conductive traces in a pcb |
| 06/21/2007 | US20070138625 Semiconductor package with heat dissipating structure and method of manufacturing the same |
| 06/21/2007 | US20070138624 Semiconductor device |
| 06/21/2007 | US20070138623 Carbon nanotube micro-chimney and thermo siphon die-level cooling |
| 06/21/2007 | US20070138622 Electronic device and semiconductor device |
| 06/21/2007 | US20070138621 Low temperature phase change thermal interface material dam |
| 06/21/2007 | US20070138620 Composite flow board for fuel cell |
| 06/21/2007 | US20070138619 Semiconductor device, and inspection method thereof |
| 06/21/2007 | US20070138618 Stack package of ball grid array type |
| 06/21/2007 | US20070138617 Using a thru-hole via to improve circuit density in a pcb |
| 06/21/2007 | US20070138616 Semiconductor device and manufacturing method of the same |
| 06/21/2007 | US20070138615 Packaging method of a plurality of chips stacked on each other and package structure thereof |
| 06/21/2007 | US20070138614 Methods for integrated circuit module packaging and integrated circuit module packages |
| 06/21/2007 | US20070138613 Electro-optical device and electronic apparatus |
| 06/21/2007 | US20070138612 Stackable electronic device assembly and high G-force test fixture |
| 06/21/2007 | US20070138611 Device package |
| 06/21/2007 | US20070138610 Semiconductor package structure and method of manufacture |
| 06/21/2007 | US20070138609 Semiconductor die structure featuring a triple pad organization |
| 06/21/2007 | US20070138608 Device with beam structure, and semiconductor device |
| 06/21/2007 | US20070138607 Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions |
| 06/21/2007 | US20070138606 Semiconductor package |
| 06/21/2007 | US20070138605 Adhesive sheet, semiconductor device having the same, multi-stacked package having the same, and methods of manufacturing a semiconductor device and a multi-stacked package |