| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/27/2007 | CN1988377A 压电器件 Piezoelectric devices |
| 06/27/2007 | CN1988170A Electroluminescent display device and method for detecting failure of the same |
| 06/27/2007 | CN1988165A Package for solid image pickup element and solid image pickup device |
| 06/27/2007 | CN1988164A Thin film transistor device, method for manufacturing the same and display apparatus having the same |
| 06/27/2007 | CN1988160A Multi-bit non-volatile memory devices and methods of fabricating the same |
| 06/27/2007 | CN1988159A Semiconductor memory device and magnetic ram device |
| 06/27/2007 | CN1988157A 门阵列 Gate Arrays |
| 06/27/2007 | CN1988155A Seal ring structure with incomplete contact through hole stack |
| 06/27/2007 | CN1988154A Regulator circuit and semiconductor device therewith |
| 06/27/2007 | CN1988153A Integrated circuit and method for controlling the temperature of a semiconductor material having an integrated circuit |
| 06/27/2007 | CN1988152A Semiconductor device and electric apparatus |
| 06/27/2007 | CN1988150A Static discharging protective element structure for improving trigger effect |
| 06/27/2007 | CN1988149A 半导体器件 Semiconductor devices |
| 06/27/2007 | CN1988148A Differential input and output grade with static discharging protective circuit |
| 06/27/2007 | CN1988147A Semiconductor alignment detecting structure |
| 06/27/2007 | CN1988146A Method for producing dummy element pattern and mechanical reinforced low K dielectric material |
| 06/27/2007 | CN1988145A Semiconductor package structure for vertical mount and method |
| 06/27/2007 | CN1988144A 半导体器件 Semiconductor devices |
| 06/27/2007 | CN1988143A Semiconductor device and manufacturing method of the same |
| 06/27/2007 | CN1988142A Wafer structure and bumping manufacturing process |
| 06/27/2007 | CN1988141A Lead terminal leadout type electronic component, manufacturing method therefor and electronic equipment |
| 06/27/2007 | CN1988140A Welding pad and display panel |
| 06/27/2007 | CN1988139A Method and device for forming enchanced thermal interface |
| 06/27/2007 | CN1988138A High performance reworkable heatsink and packaging structure and method of making same |
| 06/27/2007 | CN1988137A 半导体装置 Semiconductor device |
| 06/27/2007 | CN1988133A Semiconductor device and manufacturing method thereof, and camera module |
| 06/27/2007 | CN1988123A A semiconductor device, a manufacturing method thereof, and an evaluation method of the semiconductor device |
| 06/27/2007 | CN1988119A Light emitting diode with static damage protective function and its producing method |
| 06/27/2007 | CN1988113A Process for selective masking of iii-n layers and for the preparation of free-standing iii-n layers or of devices, and products obtained thereby |
| 06/27/2007 | CN1988085A Thick film capacitors on ceramic interconnect substrates |
| 06/27/2007 | CN1988083A Thin-film capacitor and method for fabricating the same, electronic device and circuit board |
| 06/27/2007 | CN1987731A Heat sink for distributing a thermal load |
| 06/27/2007 | CN1986722A Heat conducting paste and electronic device with the heat conducting paste |
| 06/27/2007 | CN1986154A Silicon wafer grinding apparatus, retaining assembly, and silicon wafer flatness correcting method |
| 06/27/2007 | CN1323550C Solid-state imaging device, camera module, and camera-module manufacturing method |
| 06/27/2007 | CN1323487C Method for producing piezoelectric parts and piezoelectric parts |
| 06/27/2007 | CN1323472C Active heat sink structure of coarse semiconductor laser and preparing method |
| 06/27/2007 | CN1323471C Heat sink having inclined waveguide structure for semiconductor optical amplifier packaging |
| 06/27/2007 | CN1323436C Semiconductor device and manufacturing method thereof |
| 06/27/2007 | CN1323435C Modular component |
| 06/27/2007 | CN1323430C Printing mask and method for mfg. electronic element with mask |
| 06/27/2007 | CN1323289C Pressure sensor contained in casing |
| 06/27/2007 | CN1323054C Method for producing a ceramic-copper composite substrate |
| 06/26/2007 | US7236373 Electronic device capable of preventing electromagnetic wave from being radiated |
| 06/26/2007 | US7236372 Surface mounted power supply circuit apparatus and method for manufacturing it |
| 06/26/2007 | US7236367 Power electronics component |
| 06/26/2007 | US7236244 Alignment target to be measured with multiple polarization states |
| 06/26/2007 | US7236212 System and method for providing a low power receiver design |
| 06/26/2007 | US7236093 Method for the manufacture of a smart label inlet web, and a smart label inlet web |
| 06/26/2007 | US7236084 Crosspoint switch with switch matrix module |
| 06/26/2007 | US7236070 Electronic component module and manufacturing method thereof |
| 06/26/2007 | US7235889 Integrated heatspreader for use in wire bonded ball grid array semiconductor packages |
| 06/26/2007 | US7235888 Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device |
| 06/26/2007 | US7235887 Semiconductor package with improved chip attachment and manufacturing method thereof |
| 06/26/2007 | US7235886 Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby |
| 06/26/2007 | US7235885 Semiconductor device and method of manufacturing the same, circuit board and electronic device |
| 06/26/2007 | US7235884 Local control of electrical and mechanical properties of copper interconnects to achieve stable and reliable via |
| 06/26/2007 | US7235883 Layered wiring line of silver alloy and method for forming the same and display panel substrate using the same |
| 06/26/2007 | US7235882 Semiconductor device having a wiring layer of damascene structure and method for manufacturing the same |
| 06/26/2007 | US7235881 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
| 06/26/2007 | US7235880 IC package with power and signal lines on opposing sides |
| 06/26/2007 | US7235879 Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument |
| 06/26/2007 | US7235878 Direct cooling of LEDs |
| 06/26/2007 | US7235877 Redistributed solder pads using etched lead frame |
| 06/26/2007 | US7235876 Semiconductor device having metallic plate with groove |
| 06/26/2007 | US7235875 Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module |
| 06/26/2007 | US7235874 Semiconductor device, its manufacturing method, circuit board, and electronic unit |
| 06/26/2007 | US7235873 Protective device for subassemblies and method for producing a protective device |
| 06/26/2007 | US7235872 Bow control in an electronic package |
| 06/26/2007 | US7235870 Microelectronic multi-chip module |
| 06/26/2007 | US7235869 Integrated circuit package having a resistant layer for stopping flowed glue |
| 06/26/2007 | US7235868 Lead frame and its manufacturing method |
| 06/26/2007 | US7235867 Semiconductor device with electrically biased die edge seal |
| 06/26/2007 | US7235866 Low dielectric constant film material, film and semiconductor device using such material |
| 06/26/2007 | US7235865 Methods for making nearly planar dielectric films in integrated circuits |
| 06/26/2007 | US7235864 Integrated circuit devices, edge seals therefor |
| 06/26/2007 | US7235859 Arrangement and process for protecting fuses/anti-fuses |
| 06/26/2007 | US7235858 Edge intensive antifuse and method for making the same |
| 06/26/2007 | US7235850 Thin film transistor, method of fabricating the same, and flat panel display using thin film transistor |
| 06/26/2007 | US7235849 Semiconductor device and method for fabricating the same |
| 06/26/2007 | US7235846 ESD protection structure with SiGe BJT devices |
| 06/26/2007 | US7235844 Power composite integrated semiconductor device and manufacturing method thereof |
| 06/26/2007 | US7235829 Electronic card with protection against aerial discharge |
| 06/26/2007 | US7235487 Metal seed layer deposition |
| 06/26/2007 | US7235481 Method of manufacturing a semiconductor device having a silicidation blocking layer |
| 06/26/2007 | US7235477 Multi-layer interconnection circuit module and manufacturing method thereof |
| 06/26/2007 | US7235465 Process for producing semiconductor chips having a protective film on the back surface |
| 06/26/2007 | US7235455 Method of aligning an electron beam apparatus and semiconductor substrate utilizing an alignment mark |
| 06/26/2007 | US7235454 MIM capacitor structure and method of fabrication |
| 06/26/2007 | US7235453 Method of fabricating MIM capacitor |
| 06/26/2007 | US7235431 Methods for packaging a plurality of semiconductor dice using a flowable dielectric material |
| 06/26/2007 | US7235430 Substrates having increased thermal conductivity for semiconductor structures |
| 06/26/2007 | US7235429 Conductive block mounting process for electrical connection |
| 06/26/2007 | US7235428 Semiconductor device production method |
| 06/26/2007 | US7235426 Method of backside grinding a bumped wafer |
| 06/26/2007 | US7235425 Semiconductor device and fabrication method for the same |
| 06/26/2007 | US7235350 Alumina insulation for coating implantable components and other microminiature devices |
| 06/26/2007 | US7235310 Hillock-free aluminum layer and method of forming the same |
| 06/26/2007 | US7235309 Electronic device having external terminals with lead-free metal thin film formed on the surface thereof |
| 06/26/2007 | US7235189 Based on a transparent epoxy casting resin with an admixed luminous pigment being a mixed oxide of aluminum or gallium, a group IIIB metal and a rare earth metal; electroluminescent devices emitting ultraviolet, blue or green light |