Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2007
06/28/2007US20070145568 Multi-layer interconnection circuit module and manufacturing method thereof
06/28/2007US20070145567 Seal ring structures with unlanded via stacks
06/28/2007US20070145566 Method and system of tape automated bonding
06/28/2007US20070145565 Semiconductor chip and semiconductor device
06/28/2007US20070145564 Sequential fabrication of vertical conductive interconnects in capped chips
06/28/2007US20070145563 Stacked packages with interconnecting pins
06/28/2007US20070145562 Method and system for increasing circuitry interconnection and component capacity in a multi-component package
06/28/2007US20070145561 Electronic carrier board and package structure thereof
06/28/2007US20070145560 Packaged chip having features for improved signal transmission on the package
06/28/2007US20070145559 Semiconductor device
06/28/2007US20070145558 Super high density module with integrated wafer level packages
06/28/2007US20070145557 Method for fabricating a semiconductor device and semiconductor device
06/28/2007US20070145556 Techniques for packaging multiple device components
06/28/2007US20070145555 Semiconductor Structure with a Plastic Housing and Separable Carrier Plate
06/28/2007US20070145554 Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate
06/28/2007US20070145553 Flip-chip mounting substrate and flip-chip mounting method
06/28/2007US20070145552 Semiconductor component including semiconductor chip and method for producing the same
06/28/2007US20070145551 Semiconductor Package and Manufacturing Method Therefor
06/28/2007US20070145550 Microelectronic elements with compliant terminal mountings and methods for making the same
06/28/2007US20070145549 Hermetically sealed integrated circuits and method
06/28/2007US20070145548 Stack-type semiconductor package and manufacturing method thereof
06/28/2007US20070145547 Package having exposed integrated circuit device
06/28/2007US20070145546 Thermal interface material and solder preforms
06/28/2007US20070145544 Method for producing a grid cap with a locally increased dielectric constant
06/28/2007US20070145541 Stack type surface acoustic wave package, and method for manufacturing the same
06/28/2007US20070145540 Semiconductor device having semiconductor element, insulation substrate and metal electrode
06/28/2007US20070145539 Method and system for providing an integral radio frequency shield in a molded array package
06/28/2007US20070145538 Cmp apparatus for polishing dielectric layer and method of controlling dielectric layer thickness
06/28/2007US20070145537 Semiconductor device and method for manufacturing the same
06/28/2007US20070145536 Compliant terminal mountings with vented spaces and methods
06/28/2007US20070145524 FPGA structure provided with multi parallel structure and method for forming the same
06/28/2007US20070145514 Trench field plate termination for power devices
06/28/2007US20070145494 Semiconductor device and method for manufacturing the same
06/28/2007US20070145492 Semiconductor device and method of manufacture
06/28/2007US20070145485 Integrated circuit devices having pad contact plugs in the cell array and peripheral circuit regions of the integrated circuit substrate
06/28/2007US20070145484 Regulator circuit and semiconductor device therewith
06/28/2007US20070145452 Integrated Circuit Devices Including A Capacitor
06/28/2007US20070145414 Ultrafast recovery diode
06/28/2007US20070145366 Semiconductor structures
06/28/2007US20070145365 Image sensor
06/28/2007US20070145364 Test Pattern for Analyzing Delay Characteristic of Interconnection Line and Method for Analyzing Delay Characteristic of Interconnection Line Using the Same
06/28/2007US20070144841 Miniaturized Contact Spring
06/28/2007DE202007003726U1 Flüssigkeitsgekühlte Wärmesenke Liquid-cooled heat sink
06/28/2007DE202007001065U1 Wärmeableitvorrichtung Heat sink
06/28/2007DE112005001445T5 Laservorrichtung Laser device
06/28/2007DE10217935B4 Halbleiterbauteil Semiconductor device
06/28/2007DE102006047989A1 Halbleitervorrichtung Semiconductor device
06/28/2007DE102006015241A1 Quad flat non-leaded package semiconductor component, has expansion joint arranged in plastic housing and provided between border angle region and outer contact surfaces of outer contact and central region of housing
06/28/2007DE102005061263A1 Halbleiterwafersubstrat für Leistungshalbleiterbauelemente sowie Verfahren zur Herstellung desselben The same semiconductor wafer substrate for power semiconductor devices and methods for preparing
06/28/2007DE102005061248A1 Halbleiterbauteil mit in Kunststoffgehäusemasse eingebetteten Halbleiterbauteilkomponenten Semiconductor device having embedded in plastic housing compound semiconductor device components
06/28/2007DE102005061016A1 Leistungshalbleitermodul, Verfahren zu seiner Herstellung und Verwendung in einem Schaltnetzteil Power semiconductor module, process for its preparation and use in a switching power supply
06/28/2007DE102005060368A1 Micro-electronic circuit`s e.g. dynamic random access memory circuit, electrostatic discharge protecting method, involves discharging electrostatic discharge voltage pulse developed in switching point over another point using capacitor
06/28/2007DE102005060081A1 Electronic component e.g. dynamic random access memory module, for e.g. mobile phone, has circuit board with semiconductor components having contact connections groups, where one of connections comes for congruence with other connection
06/28/2007DE102005059795A1 Vorrichtung und Verfahren zur Inbetriebnahme von Baugruppen Apparatus and method for commissioning of assemblies
06/27/2007EP1801888A1 Function element mounting module and manufacturing method thereof
06/27/2007EP1801874A2 Electronic device and semiconductor device with a back side shielding layer
06/27/2007EP1801873A1 High withstand voltage semiconductor device covered with resin and process for producing the same
06/27/2007EP1801872A1 Semiconductor device
06/27/2007EP1801871A1 Semiconductor device
06/27/2007EP1801870A1 Partial adherent temporary substrate and method of using the same
06/27/2007EP1801867A2 Method of flip-chip mounting a semiconductor chip to a circuit board, circuit board for flip-chip connection and method of manufacturing the same
06/27/2007EP1801866A2 Semiconductor device and method of manufacturing the same
06/27/2007EP1801826A1 Thick film capacitors on ceramic interconnect substrates
06/27/2007EP1801739A1 Noncontact ic label and method and apparatus for manufacturing the same
06/27/2007EP1800338A1 Method for producing layers located on a hybrid circuit
06/27/2007EP1542862A4 Thermal interface materials
06/27/2007EP1488458B1 Automatically adjusting serial connections of thick and thin layers and method for the production thereof
06/27/2007EP1483110A4 Thermal interface materials
06/27/2007EP1470176B1 No flow underfill composition
06/27/2007EP1244821A4 Articles coated with aluminum nitride by chemical vapor deposition
06/27/2007CN2917206Y Fin guide type heat radiation device
06/27/2007CN2917205Y Radiator fan rack fastening/positioning structure
06/27/2007CN2917204Y PCB board heat radiation device
06/27/2007CN2917202Y Thin film anti-seepage filler structure formed by coating heat transfer medium against the heat source on radiator base
06/27/2007CN2916931Y Compact high-power LED encapsulation structure
06/27/2007CN2916930Y LED light source
06/27/2007CN2916929Y Surface adhered component structure
06/27/2007CN2916928Y Semiconductor encapsulation structure
06/27/2007CN2916927Y Semiconductor encapsulation structure
06/27/2007CN2916926Y Fixed plates of radiator
06/27/2007CN1989793A Surface-treated copper foil and flexible copper-clad laminate plate and film carrier tape manufactured by use of the surface-treated copper foil
06/27/2007CN1989702A 扩展频谱隔离器 Spread spectrum isolator
06/27/2007CN1989616A Semiconductor device
06/27/2007CN1989615A Electronic device comprising an integrated circuit and a capacitance element
06/27/2007CN1989614A Organic matrices containing nano materials to enhance bulk thermal conductivity
06/27/2007CN1989613A A method of manufacturing a plurality of electronic assemblies
06/27/2007CN1989612A Window manufacture method of semiconductor package type printed circuit board
06/27/2007CN1989611A Semiconductor device and semiconductor device producing substrate and production methods therefor
06/27/2007CN1989607A Uv-ray irradiator
06/27/2007CN1989604A Function element and manufacturing method thereof, and function element mounting structure
06/27/2007CN1989503A Method for optimizing high frequency performance of via structures
06/27/2007CN1989167A Thermosetting resin composition, sealing material for optical device and cured product
06/27/2007CN1989165A Epoxy resin, epoxy resin composition, and cured product thereof
06/27/2007CN1988789A Fan heat sink and method and system using same
06/27/2007CN1988785A Heat radiator
06/27/2007CN1988784A Heat radiator
06/27/2007CN1988783A Heat radiator
06/27/2007CN1988765A Method of manufacturing flexible wiring substrate and method of manufacturing electronic component mounting structure
06/27/2007CN1988764A Method of making an electronic device cooling system
06/27/2007CN1988763A Method of making an electronic device cooling system
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