Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2007
07/03/2007US7238962 Semiconductor chip with test pads and tape carrier package using the same
07/03/2007US7238627 Organosilicate polymer and insulating film therefrom
07/03/2007US7238615 Formation method for metal element, production method for semiconductor device, production method for electronic device, semiconductor device, electronic device, and electronic equipment
07/03/2007US7238614 Methods for fabricating one or more metal damascene structures in a semiconductor wafer
07/03/2007US7238606 Semiconductor devices and method for fabricating the same
07/03/2007US7238605 Circuit structures and methods of forming circuit structures with minimal dielectric constant layers
07/03/2007US7238592 Method of manufacturing a semiconductor device having an alignment mark
07/03/2007US7238579 Semiconductor device for reducing photovolatic current
07/03/2007US7238550 Methods and apparatus for fabricating Chip-on-Board modules
07/03/2007US7238549 Surface-mounting semiconductor device and method of making the same
07/03/2007US7238548 Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device
07/03/2007US7238546 Hermetically sealed micro-device package with window
07/03/2007US7238543 Methods for marking a bare semiconductor die including applying a tape having energy-markable properties
07/03/2007US7238421 Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive film
07/03/2007US7238014 Manufacturing method of an electronic device package
07/03/2007US7237599 Cooler with blower comprising heat-exchanging elements
07/03/2007US7237337 Heat dissipating apparatus having micro-structure layer and method of fabricating the same
07/03/2007US7237331 Electronic part manufacturing method and electronic part
06/2007
06/28/2007WO2007072876A1 Method for manufacturing printed wiring board
06/28/2007WO2007072875A1 Method for manufacturing printed wiring board
06/28/2007WO2007072700A1 Semiconductor module
06/28/2007WO2007072668A1 Piezoelectric vibration piece and piezoelectric vibration device
06/28/2007WO2007072202A1 Microcomponent comprising two wafers interconnected by pins and the associated interconnection process
06/28/2007WO2007072130A1 Peltier cooling systems with high aspect ratio
06/28/2007WO2007071696A1 Process for the collective fabrication of 3d electronic modules
06/28/2007WO2007071674A2 On-chip interconnect-stack cooling using sacrificial interconnect segments
06/28/2007WO2007071492A1 Physically highly secure multi-chip assembly
06/28/2007WO2007071285A1 Improvements in or relating to lead frame based semiconductor package and a method of manufacturing the same
06/28/2007WO2007071218A1 Metal-ceramic substrate
06/28/2007WO2007051765A3 Electrically programmable fuse
06/28/2007WO2007051718A3 Structure and method for monitoring stress-induced degradation of conductive interconnects
06/28/2007WO2007043714A9 Multilayer printed wiring board and method for manufacturing same
06/28/2007WO2007043598A9 Electronic device and heat sink
06/28/2007WO2007030231A3 Registration mark within an overlap of dopant regions
06/28/2007WO2007005860A3 Cooling system valve
06/28/2007WO2007002429A3 Capillary tube bubble containment in liquid cooling systems
06/28/2007WO2006124295A3 Backside method and system for fabricating semiconductor components with conductive interconnects
06/28/2007WO2006113128A3 Semiconductor device with self-aligning contactless interface
06/28/2007WO2006076083A3 Integrated circuit having structural support for a flip-chip interconnect pad and method therefor
06/28/2007US20070149874 Analyte Monitoring Device and Methods of Use
06/28/2007US20070149873 Analyte Monitoring Device and Methods of Use
06/28/2007US20070148958 Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer
06/28/2007US20070148945 Method for forming a fine pattern of a semiconductor device
06/28/2007US20070148825 Semiconductor device and manufacturing method for the same
06/28/2007US20070148821 Thermally enhanced stacked die package and fabrication method
06/28/2007US20070148796 ZQ calibration circuit and semiconductor device
06/28/2007US20070148480 Laminate
06/28/2007US20070148360 Low temperature bumping process
06/28/2007US20070148341 Electronic Circuit Device and Manufacturing Method Thereof
06/28/2007US20070148261 Cancer treatment method
06/28/2007US20070147943 Method of deck stain applicator
06/28/2007US20070147046 Led light with active cooling
06/28/2007US20070147017 Integrated electronic module structure for vehicles
06/28/2007US20070147009 Device for cooling an electrical component and production method thereof
06/28/2007US20070147005 Heat sink board and manufacturing method thereof
06/28/2007US20070146532 Package for solid image pickup element and solid image pickup device
06/28/2007US20070146141 Method for authenticating product
06/28/2007US20070146093 Integrated MMIC modules for millimeter and submillimeter wave system applications
06/28/2007US20070145863 Piezoelectric resonator element package, and piezoelectric resonator
06/28/2007US20070145609 Semiconductor package having improved thermal performance
06/28/2007US20070145608 CMOS Image Sensor and Method of Fabricating the Same
06/28/2007US20070145607 System to wirebond power signals to flip-chip core
06/28/2007US20070145606 Semiconductor Device with Semiconductor Device Components Embedded in a Plastic Housing Composition
06/28/2007US20070145605 Chip packaging structure without leadframe
06/28/2007US20070145604 Chip structure and chip manufacturing process
06/28/2007US20070145603 Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof
06/28/2007US20070145602 Structure Combining an IC Integrated Substrate and a Carrier, and Method of Manufacturing such Structure
06/28/2007US20070145601 Forming ultra dense 3-d interconnect structures
06/28/2007US20070145600 Semiconductor device and manufacturing method thereof
06/28/2007US20070145599 Metal-insulator-metal (MIM) capacitor and methods of manufacturing the same
06/28/2007US20070145598 Method of forming a metal interconnection in a semiconductor device
06/28/2007US20070145597 Semiconductor device and method for manufacturing the same
06/28/2007US20070145596 Interconnect structure and method of fabricating same
06/28/2007US20070145595 High speed interconnect
06/28/2007US20070145594 Semiconductor device and method for manufacturing the same
06/28/2007US20070145593 Semiconductor Device and Method for Manufacturing the Same
06/28/2007US20070145592 Semiconductor Device and Method of Manufacturing the Same
06/28/2007US20070145591 Semiconductor device and manufacturing method therof
06/28/2007US20070145590 Semiconductor device and manufacturing method of the same
06/28/2007US20070145589 Semiconductor device and method of forming intermetal dielectric layer
06/28/2007US20070145588 Method for fabricating a metal interconnection using a dual damascene process and resulting semiconductor device
06/28/2007US20070145587 Substrate with multi-layer interconnection structure and method of manufacturing the same
06/28/2007US20070145586 Metal thin film for interconnection of semiconductor device, interconnection for semiconductor device, and their fabrication method
06/28/2007US20070145585 Conductive particles for anisotropic conductive interconnection
06/28/2007US20070145584 Printed wiring board, method for manufacturing same, and circuit device
06/28/2007US20070145583 Semiconductor device and method of manufacturing the same
06/28/2007US20070145582 Vertical Power Semiconductor Component, Semiconductor Device And Methods For The Production Thereof
06/28/2007US20070145581 Control unit
06/28/2007US20070145580 Semiconductor device
06/28/2007US20070145579 Semiconductor device and method of manufacturing the same
06/28/2007US20070145578 Multi-chip package sharing temperature-compensated self-refresh signal and method thereof
06/28/2007US20070145577 Structure with semiconductor chips embeded therein and method of fabricating same
06/28/2007US20070145576 Power Semiconductor Circuit And Method Of Manufacturing A Power Semiconductor Circuit
06/28/2007US20070145575 Circuit board and method for mounting chip component
06/28/2007US20070145574 High performance reworkable heatsink and packaging structure with solder release layer and method of making
06/28/2007US20070145573 Semiconductor Device And Method For Producing The Same
06/28/2007US20070145572 Heat dissipation device
06/28/2007US20070145571 Semiconductor package structure with constraint stiffener for cleaning and underfilling efficiency
06/28/2007US20070145570 Semiconductor device
06/28/2007US20070145569 Image sensor module with passive component
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