| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/04/2007 | CN1992293A Thin film transistor array substrate and method for manufacturing the same |
| 07/04/2007 | CN1992292A Thin film transistor array panel and method of manufacture |
| 07/04/2007 | CN1992291A Thin film transistor substrate and fabricating method thereof |
| 07/04/2007 | CN1992286A Flash memory device and method of manufacturing the same |
| 07/04/2007 | CN1992284A Layouts for cmos sram cells and devices |
| 07/04/2007 | CN1992283A Stacked memory cell for use in high-density CMOS SRAM |
| 07/04/2007 | CN1992279A Semiconductor memory device and method of manufacturing the same |
| 07/04/2007 | CN1992266A 半导体集成电路装置 The semiconductor integrated circuit device |
| 07/04/2007 | CN1992264A Organic electro-luminescence display device and method of manfacturing the same |
| 07/04/2007 | CN1992263A Floating resistance of I/O circuit on integrated circuit chip |
| 07/04/2007 | CN1992262A Process for increasing success rate of fuse fusion |
| 07/04/2007 | CN1992259A Semiconductor device having semiconductor element, insulation substrate and metal electrode |
| 07/04/2007 | CN1992258A Multiple chip packaging arrangement |
| 07/04/2007 | CN1992257A Packaging structure for image sensor and identification mould |
| 07/04/2007 | CN1992256A Semiconductor device and manufacturing method therefor |
| 07/04/2007 | CN1992255A Semiconductor structure, electrical fuse and method of forming the same |
| 07/04/2007 | CN1992254A Improved semiconductor wafer structure and its producing method |
| 07/04/2007 | CN1992253A Lead frame for direct connected chip packaging |
| 07/04/2007 | CN1992252A Lead frame for integrated circuit or discrete components ultra-thin non-pin packing |
| 07/04/2007 | CN1992251A 半导体器件 Semiconductor devices |
| 07/04/2007 | CN1992250A Semiconductor package and manufacturing method therefor |
| 07/04/2007 | CN1992249A Packaging structure and method for fabricating the same |
| 07/04/2007 | CN1992248A Packaging structure of chip with slot type metallic film supporting wire bonding |
| 07/04/2007 | CN1992247A Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same |
| 07/04/2007 | CN1992246A Composite projection |
| 07/04/2007 | CN1992245A Negative pressure type heat radiating device |
| 07/04/2007 | CN1992244A Apparatus, system and method to secure a heat sink |
| 07/04/2007 | CN1992243A Substrate for direct-underground type surface source module and heat exchanger having the substrate |
| 07/04/2007 | CN1992242A 热沉及电子设备 The heat sink and electronic equipment |
| 07/04/2007 | CN1992241A 内存模块整合结构 Memory module integration structure |
| 07/04/2007 | CN1992240A Heat source transferred refrigeration system |
| 07/04/2007 | CN1992239A 球栅阵列封装结构 A ball grid array package |
| 07/04/2007 | CN1992238A 电路组件 Circuit Components |
| 07/04/2007 | CN1992236A Thin film transistor array substrate and fabricating method for thin film transistor array substrate |
| 07/04/2007 | CN1992200A Method of manufacturing semiconductor device |
| 07/04/2007 | CN1992188A Semiconductor device and method of making the same, circuit board, and electronic instrument |
| 07/04/2007 | CN1992173A Method and structure for implanting bonded substrates for electrical conductivity |
| 07/04/2007 | CN1992080A 半导体器件 Semiconductor devices |
| 07/04/2007 | CN1991676A Heat abstractor assembling |
| 07/04/2007 | CN1990521A Siloxane encapsulants |
| 07/04/2007 | CN1324932C Printed circuit board without rough cutting edge |
| 07/04/2007 | CN1324930C Protective circuit of electrostatic discharge suitable to integrated circuit in radio frequency |
| 07/04/2007 | CN1324705C Integrated circuit capable of avoiding bolt-lock effect |
| 07/04/2007 | CN1324704C Semiconductor device |
| 07/04/2007 | CN1324703C Static discharge protective circuit structure |
| 07/04/2007 | CN1324702C 电源装置 Power supply unit |
| 07/04/2007 | CN1324701C Semiconductor device having narrow space down-lead |
| 07/04/2007 | CN1324700C Heat-conducting composite sheet and preparing method thereof |
| 07/04/2007 | CN1324699C 功率半导体模块 Power Semiconductor Modules |
| 07/04/2007 | CN1324698C Ceramic multi-layer substrate and mfg method thereof |
| 07/04/2007 | CN1324697C Semiconductor baseplate and its fabrication process |
| 07/04/2007 | CN1324685C 半导体集成电路 The semiconductor integrated circuit |
| 07/04/2007 | CN1324679C Utilization of electric silicon fuse assembly |
| 07/04/2007 | CN1324678C Internal dielectric layer of semiconductor, semiconductor assembly and mfg.method thereof |
| 07/04/2007 | CN1324677C Technqiue and structure for improveing adhesive capacity between layer of stopping etch and metl layer |
| 07/04/2007 | CN1324674C Method of bonding and transferring a material to form a semiconductor device |
| 07/04/2007 | CN1324669C Semiconductor device producing method, semiconductor device, circuit substrate, and electronic device |
| 07/04/2007 | CN1324668C Semiconductor device and method of fabricating the same, |
| 07/04/2007 | CN1324667C Fan out type wafer level package structure and method of the same |
| 07/04/2007 | CN1324660C Rectangular nitride semiconductor substrate capable of identifying outside and inside |
| 07/04/2007 | CN1324658C Cutting method, cutting device and method of manufacturing semiconductor device |
| 07/04/2007 | CN1324655C Novel process for improved hot carrier injection |
| 07/04/2007 | CN1324340C Module for optical devices, and manufacturing method of module for optical devices |
| 07/04/2007 | CN1324292C Counter-strecam mode oscillating-flow heat transport apparatus |
| 07/04/2007 | CN1323969C Glass ceramic composition, electronic component therewith and laminated LC composite component |
| 07/03/2007 | US7239851 High frequency module |
| 07/03/2007 | US7239524 Resistive element apparatus and method |
| 07/03/2007 | US7239515 Thermal assembly for cooling an electronics module |
| 07/03/2007 | US7239337 Combined semiconductor apparatus with thin semiconductor films |
| 07/03/2007 | US7239222 High frequency circuit module |
| 07/03/2007 | US7239164 Stack type semiconductor apparatus package and manufacturing method thereof |
| 07/03/2007 | US7239084 Organic EL device and liquid crystal display |
| 07/03/2007 | US7239030 Flexible wiring board for tape carrier package having improved flame resistance |
| 07/03/2007 | US7239029 Packages for semiconductor die |
| 07/03/2007 | US7239028 Semiconductor device with signal line having decreased characteristic impedance |
| 07/03/2007 | US7239027 Bonding structure of device packaging |
| 07/03/2007 | US7239026 Semiconductor device having die attachment and die pad for applying tensile or compressive stress to the IC chip |
| 07/03/2007 | US7239025 Selective deposition of solder ball contacts |
| 07/03/2007 | US7239024 Semiconductor package with recess for die |
| 07/03/2007 | US7239023 Package assembly for electronic device |
| 07/03/2007 | US7239022 Sensor device |
| 07/03/2007 | US7239021 Stacked chip semiconductor device and method for manufacturing the same |
| 07/03/2007 | US7239020 Multi-mode integrated circuit structure |
| 07/03/2007 | US7239019 Selectively converted inter-layer dielectric |
| 07/03/2007 | US7239018 Composition for forming a porous film prepared by hydrolysis and condensation of an alkoxysilane using a trialkylmethylammonium hydroxide catalyst |
| 07/03/2007 | US7239017 Low-k B-doped SiC copper diffusion barrier films |
| 07/03/2007 | US7239016 Semiconductor device having heat radiation plate and bonding member |
| 07/03/2007 | US7239015 Heat sinks including nonlinear passageways |
| 07/03/2007 | US7239014 Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor |
| 07/03/2007 | US7239013 Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device |
| 07/03/2007 | US7239012 Three-dimensional module comprised of layers containing IC chips with overlying interconnect layers |
| 07/03/2007 | US7239011 Memory card with a cap having indented portions |
| 07/03/2007 | US7239010 Semiconductor device |
| 07/03/2007 | US7239009 Lead frame and semiconductor device having the same as well as method of resin-molding the same |
| 07/03/2007 | US7239008 Semiconductor apparatus and method for fabricating the same |
| 07/03/2007 | US7239004 Semiconductor device having fuse and capacitor at the same level and method of fabricating the same |
| 07/03/2007 | US7239002 Integrated circuit device |
| 07/03/2007 | US7238991 Semiconductor device with improved protection from electrostatic discharge |
| 07/03/2007 | US7238969 Semiconductor layout structure for ESD protection circuits |
| 07/03/2007 | US7238967 Light emitting diode |