| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/05/2007 | US20070152319 Hidden plating traces |
| 07/05/2007 | US20070152318 Structure and process of chip package |
| 07/05/2007 | US20070152317 Stacked-type chip package structure |
| 07/05/2007 | US20070152316 Interposer pattern with pad chain |
| 07/05/2007 | US20070152315 Multi-die package and method for fabricating same |
| 07/05/2007 | US20070152314 Low stress stacked die packages |
| 07/05/2007 | US20070152313 Stacked die semiconductor package |
| 07/05/2007 | US20070152312 Dual die package with high-speed interconnect |
| 07/05/2007 | US20070152311 Chip-packaging compositions including bis-maleimides, packages made therewith, and methods of assembling same |
| 07/05/2007 | US20070152310 Electrical ground method for ball stack package |
| 07/05/2007 | US20070152309 Light emitting diode |
| 07/05/2007 | US20070152308 Multichip leadframe package |
| 07/05/2007 | US20070152307 Semiconductor intergrated circuit |
| 07/05/2007 | US20070152306 Semiconductor device and fabrication method thereof |
| 07/05/2007 | US20070152305 Method for forming a mask pattern for ion-implantation |
| 07/05/2007 | US20070152304 Method of fabricating passivation |
| 07/05/2007 | US20070152303 Wafer with optical control modules in exposure fields |
| 07/05/2007 | US20070152275 Devices without current crowding effect at the finger's ends |
| 07/05/2007 | US20070152274 Semiconductor device |
| 07/05/2007 | US20070152216 Interconnection in an insulating layer on a wafer |
| 07/05/2007 | US20070152215 Test pads on flash memory cards |
| 07/05/2007 | US20070152148 Package structure of image sensor device |
| 07/05/2007 | US20070152071 Package method for flash memory card and structure thereof |
| 07/05/2007 | US20070151752 Wiring board and a semiconductor device using the same |
| 07/05/2007 | US20070151707 Method and apparatus for cooling electrical equipment |
| 07/05/2007 | DE202007006264U1 Elektronisches Modul Electronic module |
| 07/05/2007 | DE19830476B4 Halbleitervorrichtung insbesondere Sensor Semiconductor device, in particular sensor |
| 07/05/2007 | DE10318558B4 Befestigungssystem zum lösbaren Befestigen von insbesondere elektronischen Bauteilen Fastening system for releasably attaching particular electronic components |
| 07/05/2007 | DE102006059501A1 Halbleitervorrichtung mit Halbleiterelement, Isolationssubstrat und Metallelektrode A semiconductor device having the semiconductor element, insulation substrate and metal electrode |
| 07/05/2007 | DE102006029961A1 Wicklungskörper mit einem Bearbeitungsband für einen Halbleiterwafer, Vorrichtung zum Ankleben eines Bearbeitungsbandes an einen Halbleiterwafer und Vorrichtung zum Bearbeiten eines Halbleiterwafers, welche den Wicklungskörper mit dem Bearbeitungsband für den Halbleiterwafer verwendet Winding body with a processing tape for a semiconductor wafer processing apparatus for adhering a tape to a semiconductor wafer and device for processing a semiconductor wafer that uses the coil body with the tape for processing the semiconductor wafer |
| 07/05/2007 | DE102006009016A1 Integrated semiconductor circuit comprises two supply pads with same direct-current voltage potential, where two supply pads are connected to supply and capacitor strip |
| 07/05/2007 | DE102006003474B3 Device for transmitting electromagnetic signals between two functional units, has fields which are completely accessible from outside for producing electrically-conducting connections |
| 07/05/2007 | DE102006000732A1 Power electronics cooling device for use in generator and electric motor combination, has separate cooling unit arranged in stator to cool semiconductor switching module, where coolant flows through unit to form module cooling circuit |
| 07/05/2007 | DE102005063283A1 Elektronisches Modul Electronic module |
| 07/05/2007 | DE102005063281A1 Integrated electronic component, has printed circuit board, and electronic power components that are arranged on board, where board has inner layer, which is made of heat conducting material e.g. solid copper |
| 07/05/2007 | DE102005062783A1 Electronic module for controlling electric motor, has upper substrate comprising smaller base surface than base body of lower substrate, and power component fastened to lower substrate at outer side of outer periphery of upper substrate |
| 07/05/2007 | DE102005062344A1 Halbleiterbauteil und Vorrichtung zur Herstellung eines Halbleiterbauteils Semiconductor device and apparatus for manufacturing a semiconductor device |
| 07/05/2007 | DE102005062181A1 Verbundmaterial Composite material |
| 07/05/2007 | DE102005062002A1 Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße Apparatus for determining and / or monitoring a process variable |
| 07/05/2007 | DE102005061772A1 Power semiconductor module, has plastics material body with thermal coefficient of expansion of plastics material matched to that of circuit board |
| 07/05/2007 | DE102005061553A1 Chip module, e.g. in chip cards like telephone cards and identification cards, has a substrate, a semiconductor chip and a device to protect against deterioration from electromagnetic radiation |
| 07/05/2007 | DE102005061358A1 In ein Halbleitermaterial integrierter Schaltkreis mit Temperaturregelung und Verfahren zur Regelung der Temperatur eines einen integrierten Schaltkreis aufweisenden Halbleitermaterials In a semiconductor material integrated circuit with temperature control and process for regulating the temperature of an integrated circuit comprising the semiconductor material |
| 07/05/2007 | DE102005045060B4 Integrierte Schaltungsanordnung mit mehreren Leitstrukturlagen und Verfahren zu ihrer Herstellung An integrated circuit device having a plurality of conductive structure and process for their preparation |
| 07/05/2007 | DE102005035387B4 Kühlkörper für ein in einen Einsteckplatz in einer Rechenanlage einsteckbares Modul sowie Modul, System und Rechenanlage mit demselben und Verfahren zur Kühlung eines Moduls Heatsinks for a plug-in into a slot in a computer system module and module, system and computer system using the same and method for cooling a module |
| 07/05/2007 | CA2635307A1 Pixel structure for a solid state light emitting device |
| 07/04/2007 | EP1804563A1 Structure and method for packaging flash memory cards |
| 07/04/2007 | EP1804562A1 Composite multilayer substrate and its manufacturing method |
| 07/04/2007 | EP1804558A1 Capacitor layer-forming material and printed circuit board having internal capacitor circuit obtained by using capacitor layer-forming material |
| 07/04/2007 | EP1804296A1 Light-receiving device |
| 07/04/2007 | EP1804291A1 Semiconductor wafer and semiconductor device |
| 07/04/2007 | EP1804287A2 Method of manufacturing semiconductor device |
| 07/04/2007 | EP1804202A1 Tape carrier and module for contact type IC card and method for manufacturing the tape carrier |
| 07/04/2007 | EP1804014A2 Flow distributing unit and cooling unit |
| 07/04/2007 | EP1803829A1 Copper alloy plate for electric and electronic parts having bending workability |
| 07/04/2007 | EP1803798A2 Heat conductive silicone grease composition |
| 07/04/2007 | EP1803154A1 Wireless chip |
| 07/04/2007 | EP1803129A2 Fuse memory cell comprising a diode, the diode serving as the fuse element |
| 07/04/2007 | EP1803049A1 Heat exchange system |
| 07/04/2007 | EP1656698A4 Semiconductor device having electrical contact from opposite sides and method therefor |
| 07/04/2007 | EP1621566B1 Fluxing no-flow underfill composition containing benzoxazines |
| 07/04/2007 | EP1597762A4 Thin multiple semiconductor die package |
| 07/04/2007 | EP1570524A4 Package having exposed integrated circuit device |
| 07/04/2007 | EP1463770B1 Organic composition |
| 07/04/2007 | EP1326079B1 Probe card |
| 07/04/2007 | EP1281303B1 Electronic power module |
| 07/04/2007 | EP1273608B1 Flame-retardant epoxy resin composition, molded object thereof, and electronic part |
| 07/04/2007 | CN2919806Y Adapter card cooling structure |
| 07/04/2007 | CN2919805Y Adapter card cooling structure |
| 07/04/2007 | CN2919804Y Fan disassembly and assembly structure |
| 07/04/2007 | CN2919801Y Micro-spraying jet cooling device for electronic device |
| 07/04/2007 | CN2919800Y Aluminium laminated riveting type high-power electronic cooling plate |
| 07/04/2007 | CN2919539Y Heat radiating encapsulation structure of large power lighting diode |
| 07/04/2007 | CN2919538Y Mechanical loading and clamping large-power LED bracket |
| 07/04/2007 | CN2919531Y Improved semiconductor chip packeted lead frame structure |
| 07/04/2007 | CN2919530Y Cooling plate with improved structure |
| 07/04/2007 | CN2919529Y Base for heat radiation module for central processing unit |
| 07/04/2007 | CN2919528Y Screw fixing element of heat radiating module of central processing unit |
| 07/04/2007 | CN2919527Y Annular heat pipe radiating semiconductor power assembly |
| 07/04/2007 | CN2919359Y Water-cooled computer heat radiating device |
| 07/04/2007 | CN2919175Y Stainless steel and aluminium composite heating radiator |
| 07/04/2007 | CN1993825A 半导体装置 Semiconductor device |
| 07/04/2007 | CN1993823A Semiconductor device, power supply apparatus using the same, and electronic device |
| 07/04/2007 | CN1993820A Systems and methods for forming integrated circuit components having precise characteristics |
| 07/04/2007 | CN1993802A Semiconductor-on-diamond devices and methods of forming |
| 07/04/2007 | CN1993427A Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoter |
| 07/04/2007 | CN1993031A Heat dissipating device |
| 07/04/2007 | CN1993030A Compact spray cooling heat exchanger |
| 07/04/2007 | CN1993021A Method for manufacturing wiring board |
| 07/04/2007 | CN1993013A 电路板 Board |
| 07/04/2007 | CN1993011A Electronic carrier plate and packaging structure thereof |
| 07/04/2007 | CN1992371A Organic light emiting device and method of manufacturing the same |
| 07/04/2007 | CN1992358A Semiconductor device integrated with radiating fin and manufacturing method thereof |
| 07/04/2007 | CN1992331A Organic light emitting diode device and method for fabricating the same |
| 07/04/2007 | CN1992330A Organic electroluminescence display device and method for fabricating the same |
| 07/04/2007 | CN1992328A 显示单元 The display unit |
| 07/04/2007 | CN1992327A Light-emitting device, electronic equipment, and method of manufacturing thereof |
| 07/04/2007 | CN1992298A Semiconductor imaging device |
| 07/04/2007 | CN1992297A Method of executing an electrical function on integrated circuit and structure of integrated circuit |
| 07/04/2007 | CN1992295A 薄膜晶体管阵列板及其制造方法 The thin film transistor array panel and a manufacturing method |
| 07/04/2007 | CN1992294A Semiconductor device and method for manufacturing the same |