| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/10/2007 | US7242031 Semiconductor light emitting apparatus and its manufacturing method |
| 07/10/2007 | US7242025 Radiation emitting semiconductor component having a nitride compound semiconductor body and a contact metallization layer on its surface |
| 07/10/2007 | US7242012 Lithography device for semiconductor circuit pattern generator |
| 07/10/2007 | US7241967 Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device |
| 07/10/2007 | US7241685 Semiconductor device and method of manufacturing the same |
| 07/10/2007 | US7241684 Method of forming metal wiring of semiconductor device |
| 07/10/2007 | US7241680 Electronic packaging using conductive interposer connector |
| 07/10/2007 | US7241676 Semiconductor device and method for manufacturing the same |
| 07/10/2007 | US7241675 Attachment of integrated circuit structures and other substrates to substrates with vias |
| 07/10/2007 | US7241668 Planar magnetic tunnel junction substrate having recessed alignment marks |
| 07/10/2007 | US7241664 Alignment mark forming method, substrate in which devices are formed, and liquid discharging head using substrate |
| 07/10/2007 | US7241645 Method for assembling a ball grid array package with multiple interposers |
| 07/10/2007 | US7241643 Wafer level chip scale package |
| 07/10/2007 | US7241641 Attachment of integrated circuit structures and other substrates to substrates with vias |
| 07/10/2007 | US7241394 Process of fabricating polymer sustained microelectrodes |
| 07/10/2007 | US7241369 Electrochemical sensor |
| 07/10/2007 | US7240711 Apparatus and method for alignment of a bonding tool |
| 07/10/2007 | US7240551 Sensor stem, sensor device having the same, and method of manufacturing sensor device |
| 07/10/2007 | US7240500 Dynamic fluid sprayjet delivery system |
| 07/10/2007 | US7240429 Manufacturing method for a printed circuit board |
| 07/10/2007 | CA2268797C Method to control cavity dimensions of fired multilayer circuit boards on a support |
| 07/05/2007 | WO2007076546A2 Multiple chip module and package stacking method for storage devices |
| 07/05/2007 | WO2007076250A2 Semiconductor device fabricated using sublimation |
| 07/05/2007 | WO2007076022A2 Method and system for providing an integral radio frequency shield in a molded array package |
| 07/05/2007 | WO2007076020A2 Method and system for increasing circuitry interconnection and component capacity in a multi-component package |
| 07/05/2007 | WO2007075789A1 Compliant terminal mountings with vented spaces and methods |
| 07/05/2007 | WO2007075727A2 Microelectronic packages and methods therefor |
| 07/05/2007 | WO2007075648A2 Component stacking for integrated circuit electronic package |
| 07/05/2007 | WO2007075599A2 Multi-fluid coolant system |
| 07/05/2007 | WO2007075560A2 Electronic device having low background luminescence, a black layer, or any combination thereof |
| 07/05/2007 | WO2007075223A1 Three-dimensional integrated capacitance structure |
| 07/05/2007 | WO2007075130A1 Device and method for cooling a power device |
| 07/05/2007 | WO2007074954A1 Three-dimensional package module, method of fabricating the same, and method of fabricating passive device applied to the three-dimensional package module |
| 07/05/2007 | WO2007074941A1 Multilayer printed wiring board |
| 07/05/2007 | WO2007074846A1 Microelectronic machine and method for manufacturing same |
| 07/05/2007 | WO2007074720A1 Semiconductor element mounting substrate, semiconductor device using the same, and process for producing semiconductor element mounting substrate |
| 07/05/2007 | WO2007074651A1 Solid state imaging element module fabrication method |
| 07/05/2007 | WO2007074556A1 Active matrix substrate, display device, television receiver, and method for repairing defects of active matrix substrate |
| 07/05/2007 | WO2007074530A1 Semiconductor device |
| 07/05/2007 | WO2007074529A1 Semiconductor device |
| 07/05/2007 | WO2007074352A1 Electronic component and a method of fabricating an electronic component |
| 07/05/2007 | WO2007074351A1 Substrate with contact studs of improved quality |
| 07/05/2007 | WO2007074112A1 Circuit arrangement comprising a heat exchanging device |
| 07/05/2007 | WO2007074111A1 Reliability improvement of metal-interconnect structure by capping spacers |
| 07/05/2007 | WO2007073965A1 Integrated semiconductor circuit |
| 07/05/2007 | WO2007073601A1 Pixel structure for a solid state light emitting device |
| 07/05/2007 | WO2007073599A1 Asic design using clock and power grid standard cell |
| 07/05/2007 | WO2007050712A3 Technique for forming a thermally conductive interface with patterned metal foil |
| 07/05/2007 | WO2007046062A3 Redistribution layer for wafer-level chip scale package and method therefor |
| 07/05/2007 | WO2007036911A3 Fine-pitch routing in a lead frame based system-in-package (sip) device |
| 07/05/2007 | WO2007017786A3 Semiconductor device with supporting structure for isolation and passivation layers |
| 07/05/2007 | WO2007007233A3 Package, method of manufacturing the same and use thereof |
| 07/05/2007 | WO2007004137A3 Electronic device |
| 07/05/2007 | WO2006134216A3 Circuit board structure and method for manufacturing a circuit board structure |
| 07/05/2007 | WO2006116162A3 Semiconductor package |
| 07/05/2007 | WO2006114971A3 Electronic component module |
| 07/05/2007 | WO2005015970A3 Cooling device for an electronic component, especially for a microprocessor |
| 07/05/2007 | US20070157349 Method of Fabricating an Integrated Circuit to Improve Soft Error Performance |
| 07/05/2007 | US20070155304 Air Conditioner |
| 07/05/2007 | US20070155176 Interconnect circuitry, multichip module, and methods of manufacturing thereof |
| 07/05/2007 | US20070155174 Circuit substrate and method for fabricating the same |
| 07/05/2007 | US20070155164 Metal seed layer deposition |
| 07/05/2007 | US20070155155 Manufacturing method for semiconductor device and semiconductor device |
| 07/05/2007 | US20070155154 System and method for solder bumping using a disposable mask and a barrier layer |
| 07/05/2007 | US20070155147 Semiconductor device and method for fabricating the same |
| 07/05/2007 | US20070155060 Method for manufacturing high-frequency module device |
| 07/05/2007 | US20070155059 Package warpage control |
| 07/05/2007 | US20070155053 Semiconductor Multi-Package Module Having Package Stacked Over Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages |
| 07/05/2007 | US20070155050 Electronic device and method of manufacturing the same, circuit board, and electronic instrument |
| 07/05/2007 | US20070155048 Methods for packaging microelectronic devices and microelectronic devices formed using such methods |
| 07/05/2007 | US20070154725 cyclic silylvinylsiloxane mixed with a germanium alkoxylate or halide; dielectrics for integrated circuits; improved mechanical properties and low dielectric constant |
| 07/05/2007 | US20070152352 Micro-fabricated device with thermoelectric device and method of making |
| 07/05/2007 | US20070152351 Topographically indexed support substrates |
| 07/05/2007 | US20070152350 Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor package |
| 07/05/2007 | US20070152349 Wafer level package having a stress relief spacer and manufacturing method thereof |
| 07/05/2007 | US20070152348 Array circuit substrate and wire bonding process using the same |
| 07/05/2007 | US20070152347 Face down type semiconductor device and manufacturing process of face down type semiconductor device |
| 07/05/2007 | US20070152346 Silicon carrier having increased flexibility |
| 07/05/2007 | US20070152345 Stacked chip packaging structure |
| 07/05/2007 | US20070152344 Engine with cable direct to outboard memory |
| 07/05/2007 | US20070152343 Semiconductor device comprising a contact structure with increased etch selectivity |
| 07/05/2007 | US20070152342 Via structure and process for forming the same |
| 07/05/2007 | US20070152340 Semiconductor processing methods of forming integrated circuitry and semiconductor processing methods of forming dynamic random access memory (DRAM) circuitry |
| 07/05/2007 | US20070152338 Method of forming FPGA of multi-parallel structure and FPGA structure thereof |
| 07/05/2007 | US20070152337 Semiconductor device and manufacturing method therefor |
| 07/05/2007 | US20070152336 Semiconductor Device and Method of Manufacturing the Same |
| 07/05/2007 | US20070152335 Metal Interconnection of Semiconductor Device and Method for Forming the Same |
| 07/05/2007 | US20070152334 Semiconductor device and manufacturing method |
| 07/05/2007 | US20070152333 Metal Interconnection of Semiconductor Device and Method of Fabricating the Same |
| 07/05/2007 | US20070152331 alloy solder interposed between and connecting a gold bump of a semiconductor chip and metal wiring of a substrate |
| 07/05/2007 | US20070152330 Package structure and manufacturing method thereof |
| 07/05/2007 | US20070152329 Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same |
| 07/05/2007 | US20070152327 Super high density module with integrated wafer level packages |
| 07/05/2007 | US20070152326 Encapsulated external stiffener for flip chip package |
| 07/05/2007 | US20070152325 Chip package dielectric sheet for body-biasing |
| 07/05/2007 | US20070152324 Forced heat transfer apparatus for heating stacked dice |
| 07/05/2007 | US20070152323 Integrated heat spreader lid |
| 07/05/2007 | US20070152322 Semiconductor device and method of manufacturing the same |
| 07/05/2007 | US20070152321 Fluxless heat spreader bonding with cold form solder |
| 07/05/2007 | US20070152320 Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device |