| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/11/2007 | CN1997261A Electronic carrier board and its packaging structure |
| 07/11/2007 | CN1996631A Heat radiation system |
| 07/11/2007 | CN1996624A Light-emitting diode-LED and its encapsulation method and application |
| 07/11/2007 | CN1996613A Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices |
| 07/11/2007 | CN1996610A Thin film transistor array panel and manufacturing thereof |
| 07/11/2007 | CN1996603A Pixel structure of a thin film transistor LCD and its making method |
| 07/11/2007 | CN1996602A Display substrate and method of manufacturing the same |
| 07/11/2007 | CN1996601A Mask-programmable logic macro |
| 07/11/2007 | CN1996597A Integrated circuit and method of fabricating same |
| 07/11/2007 | CN1996596A Integrated circuit structure, display part module and their detection method |
| 07/11/2007 | CN1996595A Capacitance structure for the integrated circuit |
| 07/11/2007 | CN1996594A Pixel structure of display device and pixel structure |
| 07/11/2007 | CN1996593A Static protection system using the floating and/or deflected multi-crystal silicon area and its method |
| 07/11/2007 | CN1996592A Encapsulation of the image sensor and detector |
| 07/11/2007 | CN1996591A The surface pasting parts with over-current and ESD protection and its making method |
| 07/11/2007 | CN1996590A Silicon-class electromigration testing heater structure |
| 07/11/2007 | CN1996589A Structure of the Damascus using the gas filling to reduce the dielectric constant and its making method |
| 07/11/2007 | CN1996588A A copper-gas media Damascus structure and its making method |
| 07/11/2007 | CN1996587A Circuit board, method for manufacturing the same, semiconductor device, and method for manufacturing the same |
| 07/11/2007 | CN1996586A Semiconductor-element mounting substrate, semiconductor device, and electronic equipment |
| 07/11/2007 | CN1996585A Semiconductor element with semiconductor component embedded into a plastic housing |
| 07/11/2007 | CN1996584A Semiconductor device and a method of manufacturing the same |
| 07/11/2007 | CN1996583A The encapsulation of integrated circuit chip without lead |
| 07/11/2007 | CN1996582A Carrier board including the multi-layer internal connection line and its making, recycling and application method |
| 07/11/2007 | CN1996581A Chip encapsulation structure and its crystal encapsulation forming method |
| 07/11/2007 | CN1996580A Structure and making method of the base plate integrating the embedded parts |
| 07/11/2007 | CN1996579A Semiconductor device |
| 07/11/2007 | CN1996578A Microdevice contact |
| 07/11/2007 | CN1996577A Encapsulation structure of the crystal particle and its making method |
| 07/11/2007 | CN1996576A Chip encapsulation structure and its making method |
| 07/11/2007 | CN1996575A Chip encapsulation structure and technology |
| 07/11/2007 | CN1996574A Method of manufacturing NAND flash memory device |
| 07/11/2007 | CN1996570A Nonvolatile memory device and method of forming the same |
| 07/11/2007 | CN1996565A Wafer level package having a stress relief spacer and manufacturing method thereof |
| 07/11/2007 | CN1996564A Encapsulation method and its structure |
| 07/11/2007 | CN1996563A The encapsulation structure of the optical component semiconductor and its encapsulation method |
| 07/11/2007 | CN1996493A Phase-change memory device |
| 07/11/2007 | CN1996111A TCP automatic-exchanging operation method |
| 07/11/2007 | CN1995897A Condenser and case integrated heat pipe |
| 07/11/2007 | CN1326437C Cooling apparatus and electronic equipment |
| 07/11/2007 | CN1326433C Ball grid array package |
| 07/11/2007 | CN1326291C Connecting device using spiral contact |
| 07/11/2007 | CN1326286C 传送线路和半导体集成电路装置 Transmission line and the semiconductor integrated circuit device |
| 07/11/2007 | CN1326255C Method of depositing an oxide layer on a substrate |
| 07/11/2007 | CN1326241C Electrostatic discharge preventing method for display and electrostatic discharge preventing device |
| 07/11/2007 | CN1326240C 半导体装置 Semiconductor device |
| 07/11/2007 | CN1326239C Cooling assembly |
| 07/11/2007 | CN1326238C Liquid-cooled power semiconductor device heatsink |
| 07/11/2007 | CN1326237C Circular pipe type radiator structure |
| 07/11/2007 | CN1326236C Radiator fin and manufacturing method thereof |
| 07/11/2007 | CN1326235C Substrates of package integrated circuits and manufacture thereof |
| 07/11/2007 | CN1326234C Stacked-type semiconductor device |
| 07/11/2007 | CN1326231C Copper damascene technique and structure thereof |
| 07/11/2007 | CN1326222C Selective connection in ic packaging |
| 07/11/2007 | CN1326221C Semiconductor power device and method of formation |
| 07/11/2007 | CN1326206C Method of manufacturing an electronic device |
| 07/11/2007 | CN1325583C Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating |
| 07/11/2007 | CN1325559C Epoxy resin composition, ultraviolet rays-curable can-coating composition and its uses |
| 07/11/2007 | CN1325558C Paste composition, and protective film and semiconductor device both obtained with the same |
| 07/11/2007 | CN1325209C Mo-Cu composite powder |
| 07/10/2007 | US7243181 Signal bus arrangement |
| 07/10/2007 | US7242602 Semiconductor memory devices having conductive line in twisted areas of twisted bit line pairs |
| 07/10/2007 | US7242585 Electronic device |
| 07/10/2007 | US7242584 Housing for power semiconductor modules |
| 07/10/2007 | US7242583 System for loading a heat sink mechanism independently of clamping load on electrical device |
| 07/10/2007 | US7242582 Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module |
| 07/10/2007 | US7242558 ESD protection module triggered by BJT punch-through |
| 07/10/2007 | US7242538 Optical device |
| 07/10/2007 | US7242102 Bond pad structure for copper metallization having increased reliability and method for fabricating same |
| 07/10/2007 | US7242101 Integrated circuit die with pedestal |
| 07/10/2007 | US7242100 Method for manufacturing semiconductor device with plural semiconductor chips |
| 07/10/2007 | US7242099 Chip package with multiple chips connected by bumps |
| 07/10/2007 | US7242098 Barrier film integrity on porous low k dielectrics by application of a hydrocarbon plasma treatment |
| 07/10/2007 | US7242097 Electromigration barrier layers for solder joints |
| 07/10/2007 | US7242096 Semiconductor device and method for manufacturing the same |
| 07/10/2007 | US7242095 Semiconductor device having a dummy pattern |
| 07/10/2007 | US7242094 Semiconductor device having capacitor formed in multilayer wiring structure |
| 07/10/2007 | US7242093 Semiconductor device |
| 07/10/2007 | US7242092 Substrate assembly with direct electrical connection as a semiconductor package |
| 07/10/2007 | US7242091 Stacked semiconductor packages and method therefor |
| 07/10/2007 | US7242090 Device package |
| 07/10/2007 | US7242089 Miniature silicon condenser microphone |
| 07/10/2007 | US7242088 IC package pressure release apparatus and method |
| 07/10/2007 | US7242087 Flexible printed circuit board |
| 07/10/2007 | US7242086 Optical semiconductor bare chip, printed wiring board, lighting unit and lighting device |
| 07/10/2007 | US7242085 Semiconductor device including a semiconductor chip mounted on a metal base |
| 07/10/2007 | US7242084 Apparatuses and associated methods for improved solder joint reliability |
| 07/10/2007 | US7242083 Substrate for IC package |
| 07/10/2007 | US7242082 Stackable layer containing ball grid array package |
| 07/10/2007 | US7242081 Stacked package structure |
| 07/10/2007 | US7242080 Semiconductor wafer with information protection function |
| 07/10/2007 | US7242079 Method of manufacturing a data carrier |
| 07/10/2007 | US7242078 Surface mount multichip devices |
| 07/10/2007 | US7242077 Leadframe with die pad |
| 07/10/2007 | US7242076 Packaged integrated circuit with MLP leadframe and method of making same |
| 07/10/2007 | US7242073 Capacitor having an anodic metal oxide substrate |
| 07/10/2007 | US7242068 Photosensitive semiconductor package, method for fabricating the same, and lead frame thereof |
| 07/10/2007 | US7242062 Semiconductor apparatus with improved ESD withstanding voltage |
| 07/10/2007 | US7242061 Semiconductor device |
| 07/10/2007 | US7242033 Semiconductor device using LED chip |