| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/12/2007 | US20070158818 Integrated capacitors in package-level structures, processes of making same, and systems containing same |
| 07/12/2007 | US20070158817 Semiconductor device |
| 07/12/2007 | US20070158816 Contact spring application to semiconductor devices |
| 07/12/2007 | US20070158815 Multi-chip ball grid array package and method of manufacture |
| 07/12/2007 | US20070158814 Electronic circuit package |
| 07/12/2007 | US20070158813 Integrated circuit package-in-package system |
| 07/12/2007 | US20070158812 Method of testing wires and apparatus for doing the same |
| 07/12/2007 | US20070158811 Low profile managed memory component |
| 07/12/2007 | US20070158810 Stacked integrated circuit package-in-package system |
| 07/12/2007 | US20070158809 Multi-chip package system |
| 07/12/2007 | US20070158808 Multiple chip module and package stacking method for storage devices |
| 07/12/2007 | US20070158807 Edge interconnects for die stacking |
| 07/12/2007 | US20070158806 Integrated circuit package system including honeycomb molding |
| 07/12/2007 | US20070158805 BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same |
| 07/12/2007 | US20070158804 Semiconductor device, manufacturing method of semiconductor device, and RFID tag |
| 07/12/2007 | US20070158803 Memory packaging structure of mini SD card |
| 07/12/2007 | US20070158802 High density memory card system and method |
| 07/12/2007 | US20070158801 Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates |
| 07/12/2007 | US20070158800 Managed memory component |
| 07/12/2007 | US20070158799 Interconnected IC packages with vertical SMT pads |
| 07/12/2007 | US20070158798 Wafer with optical control modules in ic fields |
| 07/12/2007 | US20070158797 Circuit board and electronic assembly |
| 07/12/2007 | US20070158796 Semiconductor package |
| 07/12/2007 | US20070158795 High Density Memory Card System and Method (254-HD\C1) |
| 07/12/2007 | US20070158794 Package structure of thin lead-frame |
| 07/12/2007 | US20070158793 Carrier structure for semiconductor package |
| 07/12/2007 | US20070158792 Overhang integrated circuit package system |
| 07/12/2007 | US20070158791 Superconducting junction element and superconducting junction circuit |
| 07/12/2007 | US20070158789 Material comprising predetermined number of atomic layers and method for manufacturing predetermined number of atomic layers |
| 07/12/2007 | US20070158788 Die seal structure for reducing stress induced during die saw process |
| 07/12/2007 | US20070158778 Semiconductor device and module using the same |
| 07/12/2007 | US20070158777 High voltage field effect device and method |
| 07/12/2007 | US20070158775 Methods for implementation of a switching function in a microscale device and for fabrication of a microscale switch |
| 07/12/2007 | US20070158774 Solid image-pickup device and method for manufacturing the solid image pickup device |
| 07/12/2007 | US20070158766 for forming conductive interconnect layers useful in articles such as semiconductor chips, memory devices, semiconductor dies, circuit modules, and electronic systems |
| 07/12/2007 | US20070158757 Structure of a field effect transistor having metallic silicide and manufacturing method thereof |
| 07/12/2007 | US20070158748 Resistor structure for ESD protection circuits |
| 07/12/2007 | US20070158695 System with meshed power and signal buses on cell array |
| 07/12/2007 | US20070158682 Semiconductor device |
| 07/12/2007 | US20070158675 Semiconductor light-emitting device and method for manufacturing the device |
| 07/12/2007 | US20070158635 Semiconductor memory device and method for fabricating the same |
| 07/12/2007 | US20070158387 Heater, reflow apparatus, and solder bump forming method and apparatus |
| 07/12/2007 | DE60121768T2 Verfahren zur herstellung eines halbleiterbauelements mit nitridzusammensetzung der gruppe iii A method for manufacturing a semiconductor device with nitride composition of the group iii |
| 07/12/2007 | DE4442106B4 Verfahren zur Herstellung eines Transistors A method of manufacturing a transistor |
| 07/12/2007 | DE19955471B4 Schaltung mit einer analogen Schaltung und einer Starter-Stromquellenvorrichtung sowie eine Verwendung einer Vorrichtung als automatisch abschaltende Starter-Stromquellenvorrichtung für eine analoge Schaltung Circuit having an analog circuit and a starter power source device, and a use of a device as automatically deactivating the starter power source device for an analog circuit |
| 07/12/2007 | DE112005001928T5 Selbstreinigender unterer Kontakt Self-cleaning lower contact |
| 07/12/2007 | DE112005000975T5 Sicherheits-Sockelbetätigungsvorrichtung Safety pedestal actuator |
| 07/12/2007 | DE102006052505A1 Kameramodul umfassend eine gedruckte Schaltung mit Absatzbereich Camera module comprising a printed circuit board with the heel area |
| 07/12/2007 | DE102006019992A1 Semiconductor component, has polymer foam layer filling interspace between upper side of semiconductor chips and wiring structure of wiring substrate, where edge sides of chips and edge sides of layer are surrounded by housing in substrate |
| 07/12/2007 | DE102006001601A1 Semiconductor wafer, has upper side with set of semiconductor chip positions arranged in rows and columns, and information chip, which has information of rear side identification, arranged at exposed semiconductor chip position |
| 07/12/2007 | DE102006000936A1 Halbleiterbauelement mit einer Schutzschaltung, Schutzschaltung für Halbleiterbauelemente und Betriebsverfahren für eine Schutzschaltung A semiconductor device with a protection circuit, the protection circuit for semiconductor devices and method of operation for a protection circuit |
| 07/12/2007 | DE102006000724A1 Electronic semiconductor unit, has semiconductor chip, cooling body, and passage contacts that are partly embedded into filling layer, where passage contacts are separated from cooling body through recesses |
| 07/12/2007 | DE102006000622A1 Miniaturized multi-chip module for wireless transmission device, comprises interposer having thickness more than largest height of integrated circuit chip, that includes substrate confronting surface and board confronting surface |
| 07/12/2007 | DE102005062976A1 Verfahren zur Herstellung von Halbleiter-Elementen und verfahrengemäß hergestelltes Halbleiter-Element A process for the production of semiconductor elements and semiconductor element produced in accordance with method |
| 07/12/2007 | DE102005062932A1 Chip-Träger mit reduzierter Störsignalempfindlichkeit Chip carriers with reduced Störsignalempfindlichkeit |
| 07/12/2007 | DE102005025543B4 Halbleiterbaumodul und Verfahren zur Herstellung desselben Halbleiterbaumodul and method of manufacturing the same |
| 07/12/2007 | DE10142118B4 Elektronisches Bauteil mit wenigstens zwei gestapelten Halbleiterchips sowie Verfahren zu seiner Herstellung Electronic component with at least two stacked semiconductor chips and to methods for its preparation |
| 07/12/2007 | DE10056871B4 Feldeffekttransistor mit verbessertem Gatekontakt und Verfahren zur Herstellung desselben Of the same field effect transistor with an improved gate contact and methods for preparing |
| 07/11/2007 | EP1806783A2 Improved interdigitated capacitive structure for an integrated circuit |
| 07/11/2007 | EP1806782A2 Method for manufacturing semiconductor device |
| 07/11/2007 | EP1806781A1 Conductive interconnect with a localized overhanging dielectric barrier |
| 07/11/2007 | EP1806037A1 Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method |
| 07/11/2007 | EP1806036A1 Packaging and manufacturing of an integrated circuit |
| 07/11/2007 | EP1805800A2 Method for micropackaging of electrical or electromechanical devices and micropackage |
| 07/11/2007 | EP1805799A1 Substrate with electric contacts and method of manufacturing the same |
| 07/11/2007 | EP1805798A2 Gate stacks |
| 07/11/2007 | EP1805797A2 Magnetic attachment method for led light engines |
| 07/11/2007 | EP1805022A2 Integrated circuit and method for manufacturing |
| 07/11/2007 | EP1719397B1 Housing arrangement |
| 07/11/2007 | EP1506701B1 Improved structure of stacked vias in multiple layer electronic device carriers |
| 07/11/2007 | EP1467856A4 Improved thermal interface material |
| 07/11/2007 | EP1048483B1 Card-like semiconductor device |
| 07/11/2007 | CN2922405Y Radiating device |
| 07/11/2007 | CN2922404Y Radiator lock tool assembly |
| 07/11/2007 | CN2922403Y Radiating device wind induction board structure |
| 07/11/2007 | CN2922402Y Radiating core and radiator |
| 07/11/2007 | CN2922395Y Radiating fin guiding structure |
| 07/11/2007 | CN2922382Y Surface installation printed-circuit board circuit module |
| 07/11/2007 | CN2922135Y High brightness, high reliability sapphire backing base luminous diode |
| 07/11/2007 | CN2922134Y Luminous diode pressed structure |
| 07/11/2007 | CN2922126Y Thin-film flipchip package structure and COF thin-film winding used for flip chip package |
| 07/11/2007 | CN2922125Y Transistor capable of promoting transmission rate |
| 07/11/2007 | CN2922124Y Cooling structure used for cooling LED liquid |
| 07/11/2007 | CN2922123Y Radiator capable of adjusting fixed power |
| 07/11/2007 | CN2922122Y Internal memory radiating clip and assembly clamp tool |
| 07/11/2007 | CN2922121Y Double-action cooling chip module radiating device |
| 07/11/2007 | CN1998082A Polymer dielectrics for memory element array interconnect |
| 07/11/2007 | CN1998081A Carrier for multilayer semiconductor device and method for manufacturing multilayer semiconductor device |
| 07/11/2007 | CN1998080A Tamper respondent covering |
| 07/11/2007 | CN1998079A Module integration integrated circuits |
| 07/11/2007 | CN1998078A Single row bond pad arrangement of an integrated circuit chip |
| 07/11/2007 | CN1998077A Semiconductor device manufacturing method and semiconductor device |
| 07/11/2007 | CN1998076A Semiconductor device and semiconductor device producing substrate and production method for semiconductor device producing substrate |
| 07/11/2007 | CN1997906A System and method for measuring time dependent dielectric breakdown |
| 07/11/2007 | CN1997905A System and method for measuring negative bias thermal instability |
| 07/11/2007 | CN1997682A Resin composition for semiconductor sealing and semiconductor device |
| 07/11/2007 | CN1997514A Thermal interface material |
| 07/11/2007 | CN1997272A Connection structure of looped heat pipe and its connecting method |
| 07/11/2007 | CN1997271A Heat radiator and its making method |
| 07/11/2007 | CN1997269A Housing for electronic components |