| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/17/2007 | US7244326 Transfer assembly for manufacturing electronic devices |
| 07/17/2007 | US7244125 Connector for making electrical contact at semiconductor scales |
| 07/17/2007 | US7244034 Low CTE metal-ceramic composite articles, and methods for making same |
| 07/17/2007 | US7243709 Heat dissipating assembly |
| 07/17/2007 | US7243708 Radiator with streamline airflow guiding structure |
| 07/17/2007 | US7243706 Heatsink for power devices |
| 07/17/2007 | US7243441 Method and apparatus for measuring depth of holes formed on a specimen |
| 07/17/2007 | US7243423 Chip package with degassing holes |
| 07/17/2007 | US7243421 Electrical connection of components |
| 07/17/2007 | US7243420 Electronic component mounting method |
| 07/12/2007 | WO2007079456A2 Substrate and method for mounting silicon device |
| 07/12/2007 | WO2007078799A2 Low resistivity package substrate and its manufacturing method |
| 07/12/2007 | WO2007078767A2 Method and apparatus of using an atomizer in a two-phase liquid vapor enclosure |
| 07/12/2007 | WO2007078714A2 Integrated capacitors in package-level structures, processes of making same, and systems containing same |
| 07/12/2007 | WO2007078627A1 Nanostructure-based package interconnect |
| 07/12/2007 | WO2007078360A2 Lead interconnections and reinforcement |
| 07/12/2007 | WO2007078148A2 Flip chip mount type of bump, manufacturing method thereof, and bonding method for flip chip using non conductive adhesive |
| 07/12/2007 | WO2007078011A1 Production method of multilayer interconnection and multilayer interconnection structure |
| 07/12/2007 | WO2007078005A1 Aligned carbon nanotube bulk aggregates, process for production of the same and uses thereof |
| 07/12/2007 | WO2007077909A1 Semiconductor device manufacturing method |
| 07/12/2007 | WO2007077884A1 Wiring structure and electronic device designed according to electronic pulsation and particle durability |
| 07/12/2007 | WO2007077779A1 Inorganic sulfate ion scavenger, inorganic scavenging composition, and electronic component-sealing resin composition, electronic component-sealing material, electronic component, varnish, adhesive, paste and product using those |
| 07/12/2007 | WO2007077752A1 Semiconductor element mounting member, fabrication method thereof, and semiconductor device |
| 07/12/2007 | WO2007077735A1 Semiconductor mounting wiring board and method for manufacturing same, and semiconductor package |
| 07/12/2007 | WO2007077598A1 Semiconductor device and process for producing the same |
| 07/12/2007 | WO2007077277A1 Self-supporting, photovoltaic passive refrigerator module |
| 07/12/2007 | WO2007077233A1 Integrated electronic device and cooling device for an integrated electronic device |
| 07/12/2007 | WO2007077144A1 Hermetically sealed electronic housing and carrier plate |
| 07/12/2007 | WO2007077109A2 Silicon carrier having increased flexibility |
| 07/12/2007 | WO2007053383A3 Methods and apparatus for flip-chip-on-lead semiconductor package |
| 07/12/2007 | WO2007046771A8 Method of forming component package |
| 07/12/2007 | WO2007045568A3 Increasing electromigration lifetime and current density in ic |
| 07/12/2007 | WO2006118982A3 Semiconductor substrate with exposed upper and lower sides |
| 07/12/2007 | WO2006047235B1 Transient thermoelectric cooling of optoelectronic devices |
| 07/12/2007 | US20070162885 Semiconductor device layout method, a computer program, and a semiconductor device manufacture method |
| 07/12/2007 | US20070162884 Basic cell, edge cell, wiring shape, wiring method, and shield wiring structure |
| 07/12/2007 | US20070162801 Wireless radio frequency technique design and method for testing of integrated circuits and wafers |
| 07/12/2007 | US20070161880 Analyte Monitoring Device and Methods of Use |
| 07/12/2007 | US20070161879 Analyte Monitoring Device and Methods of Use |
| 07/12/2007 | US20070161494 Non-oxide ceramic having oxide layer on the surface thereof, method for production thereof and use thereof |
| 07/12/2007 | US20070161228 Wiring substrate and semiconductor device, and method of manufacturing wiring substrate |
| 07/12/2007 | US20070161227 Self-encapsulated silver alloys for interconnects |
| 07/12/2007 | US20070161214 High k gate stack on III-V compound semiconductors |
| 07/12/2007 | US20070161156 Semiconductor device and method of manufacturing the same |
| 07/12/2007 | US20070161154 Manufacturing method for electronic device |
| 07/12/2007 | US20070161129 Semiconductor device and manufacturing process thereof |
| 07/12/2007 | US20070160858 Ceramic circuit board, method for making the same, and power module |
| 07/12/2007 | US20070160097 Heat sink for a pulsed laser diode bar with optimized thermal time constant |
| 07/12/2007 | US20070159864 Semiconductor Module and Power Conversion Device |
| 07/12/2007 | US20070159803 MEMS device seal using liquid crystal polymer |
| 07/12/2007 | US20070159792 Heat-dissipating structure inside the computer mainframe |
| 07/12/2007 | US20070159745 Circuit Element and Method for Protecting a Load Circuit |
| 07/12/2007 | US20070159545 Managed memory component |
| 07/12/2007 | US20070159335 Semiconductor device |
| 07/12/2007 | US20070159285 High frequency thin film electrical circuit element |
| 07/12/2007 | US20070159266 Arrangement and method impedance matching |
| 07/12/2007 | US20070159072 Organic light emitting diode, manufacturing method thereof, and organic light emitting diode display provided with the same |
| 07/12/2007 | US20070158861 Method for fabricating semiconductor package with build-up layers formed on chip |
| 07/12/2007 | US20070158860 Semiconductor component and apparatus for production of a semiconductor component |
| 07/12/2007 | US20070158859 Power semiconductor module |
| 07/12/2007 | US20070158858 Inter-stacking module system |
| 07/12/2007 | US20070158857 Semiconductor device having a plurality of semiconductor constructs |
| 07/12/2007 | US20070158856 Gap control between interposer and substrate in electronic assemblies |
| 07/12/2007 | US20070158855 Semiconductor-element mounting substrate, semiconductor device, and electronic equipment |
| 07/12/2007 | US20070158854 Laser ablation and imprinting hybrid processing for fabrication of high density interconnect flip chip substrates |
| 07/12/2007 | US20070158853 Device with novel conductive via structure |
| 07/12/2007 | US20070158852 Circuit Board with Conductive Structure and Method for Fabricating the same |
| 07/12/2007 | US20070158851 Method to Improve Time Dependent Dielectric Breakdown |
| 07/12/2007 | US20070158850 Method for manufacturing mold type semiconductor device |
| 07/12/2007 | US20070158849 Semiconductor device, method of fabricating the same, and pattern generating method |
| 07/12/2007 | US20070158848 Electronic component |
| 07/12/2007 | US20070158847 Circuit board device with fine conductive structure |
| 07/12/2007 | US20070158846 Method and system for innovative substrate/package design for a high performance integrated circuit chipset |
| 07/12/2007 | US20070158845 Metal wiring of semiconductor device and method of fabricating the same |
| 07/12/2007 | US20070158844 Copper metalized ohmic contact electrode of compound device |
| 07/12/2007 | US20070158843 Semiconductor package having improved solder joint reliability and method of fabricating the same |
| 07/12/2007 | US20070158842 Integrated circuit package having metallic members intruding into solder balls |
| 07/12/2007 | US20070158841 Structure of Ball Grid Array package |
| 07/12/2007 | US20070158840 Electronic device and method for bonding an electronic device |
| 07/12/2007 | US20070158839 Thermally balanced via |
| 07/12/2007 | US20070158838 Circuit board, method for manufacturing the same, semiconductor device, and method for manufacturing the same |
| 07/12/2007 | US20070158837 Semiconductor device |
| 07/12/2007 | US20070158836 Pad layout |
| 07/12/2007 | US20070158835 Method for designing interconnect for a new processing technology |
| 07/12/2007 | US20070158834 Electrical connections made with dissimilar metals |
| 07/12/2007 | US20070158833 Integrated circuit package system including stacked die |
| 07/12/2007 | US20070158832 Electronic device and method of manufacturing the same |
| 07/12/2007 | US20070158831 Methods of manufacturing a three-dimensional semiconductor device and semiconductor devices fabricated thereby |
| 07/12/2007 | US20070158830 Circuit module |
| 07/12/2007 | US20070158829 Connecting module having passive components |
| 07/12/2007 | US20070158828 Package structure and fabricating method thereof |
| 07/12/2007 | US20070158827 Electronic device comprising at least one printed circuit board and comprising a plurality of semiconductor components of identical type, and method |
| 07/12/2007 | US20070158826 Semiconductor device |
| 07/12/2007 | US20070158825 Recyclying faulty multi-die packages |
| 07/12/2007 | US20070158824 Hybrid composite material substrate |
| 07/12/2007 | US20070158823 Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same |
| 07/12/2007 | US20070158822 Dynamic quantity sensor |
| 07/12/2007 | US20070158821 Managed memory component |
| 07/12/2007 | US20070158820 Integrated circuit package system with pedestal structure |
| 07/12/2007 | US20070158819 Semiconductor device and a method of manufacturing the same |