| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/19/2007 | US20070164434 Semiconductor device having wiring made by damascene method and capacitor and its manufacture method |
| 07/19/2007 | US20070164433 Ball grid array package |
| 07/19/2007 | US20070164432 Semiconductor device having alignment post electrode and method of manufacturing the same |
| 07/19/2007 | US20070164431 Wafer level chip scale package having rerouting layer and method of manufacturing the same |
| 07/19/2007 | US20070164430 Carbon nanotube circuit component structure |
| 07/19/2007 | US20070164429 Package board having internal terminal interconnection and semiconductor package employing the same |
| 07/19/2007 | US20070164427 Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls |
| 07/19/2007 | US20070164426 Apparatus and method for integrated circuit cooling during testing and image based analysis |
| 07/19/2007 | US20070164425 Thermally enhanced semiconductor package and method of producing the same |
| 07/19/2007 | US20070164424 Thermal interconnect and interface systems, methods of production and uses thereof |
| 07/19/2007 | US20070164423 Multi-chip semiconductor package |
| 07/19/2007 | US20070164422 Semiconductor wafer scale package system |
| 07/19/2007 | US20070164421 Structure to monitor arcing in the processing steps of metal layer build on silicon-on-insulator semiconductors |
| 07/19/2007 | US20070164420 Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips |
| 07/19/2007 | US20070164419 Device package and methods for the fabrication and testing thereof |
| 07/19/2007 | US20070164418 Semiconductor Module Comprising Semiconductor Chips and Method for Producing the Same |
| 07/19/2007 | US20070164417 Design and fabrication method for microsensor |
| 07/19/2007 | US20070164416 Managed memory component |
| 07/19/2007 | US20070164415 Semiconductor device including bus with signal lines |
| 07/19/2007 | US20070164414 Wireless ic device and component for wireless ic device |
| 07/19/2007 | US20070164413 Semiconductor device |
| 07/19/2007 | US20070164412 Method of wire bonding over active area of a semiconductor circuit |
| 07/19/2007 | US20070164411 Semiconductor package structure and fabrication method thereof |
| 07/19/2007 | US20070164410 Wafer level packaging cap and fabrication method thereof |
| 07/19/2007 | US20070164409 Semiconductor package with integrated heatsink and electromagnetic shield |
| 07/19/2007 | US20070164408 Light emitting diode packaging structure |
| 07/19/2007 | US20070164407 Double encapsulated semiconductor package and manufacturing method thereof |
| 07/19/2007 | US20070164406 Leadless lead-frame |
| 07/19/2007 | US20070164405 Low Cost Method to Produce High Volume Lead Frames |
| 07/19/2007 | US20070164404 Semiconductor package |
| 07/19/2007 | US20070164403 Semiconductor package structure and fabrication method thereof |
| 07/19/2007 | US20070164402 Semiconductor package and process for making the same |
| 07/19/2007 | US20070164400 Substrate structure and method for forming patterned layer on substrate structure |
| 07/19/2007 | US20070164399 Hard coating for glass molding and glass molding die having the hard coating |
| 07/19/2007 | US20070164394 Semiconductor device |
| 07/19/2007 | US20070164384 Solid-state imaging device and method for manufacturing the same |
| 07/19/2007 | US20070164376 Method for edge sealing barrier films |
| 07/19/2007 | US20070164363 Semiconductor device including capacitive circuit and short-circuit preventing circuit connected in series |
| 07/19/2007 | US20070164362 System and method for I/O ESD protection with floating and/or biased polysilicon regions |
| 07/19/2007 | US20070164279 Semiconductor chip |
| 07/19/2007 | US20070164270 producing a liquid crystalline polymer with high optical quality switchable holograms with good diffraction efficiency and low, stable switching voltage; inverse mode switchable grating system; haze-free |
| 07/19/2007 | US20070164199 Camera module for compact electronic equipments |
| 07/19/2007 | US20070163992 Method and device for contacting semiconductor chips |
| 07/19/2007 | US20070163769 Nanoengineered thermal materials based on carbon nanotube array composites |
| 07/19/2007 | US20070163765 Power-electronic-cooling device |
| 07/19/2007 | US20070163759 Fluid cooling device |
| 07/19/2007 | US20070163755 Flat plate heat transfer device and method for manufacturing the same |
| 07/19/2007 | US20070163274 Method & arrangement for cooling a substrate, particularly a semiconductor |
| 07/19/2007 | DE202007007215U1 Befestigung für Kühlmodul Attachment for cooling module |
| 07/19/2007 | DE10228517B4 Schutzschaltung und -verfahren gegen elektrostatische Entladung in einem TFT-LCD Protection circuit and method against electrostatic discharge in a TFT-LCD |
| 07/19/2007 | DE10220587B4 Temperatursensor für MOS-Schaltungsanordnung Temperature sensor for MOS circuit |
| 07/19/2007 | DE102006002381B3 Power semiconductor component for e.g. alternating current-direct current converter, has chips arranged adjacent to each other and attached on flat conductor by diffusion solder connection, where another chip is attached on chips |
| 07/19/2007 | DE102006001874A1 Verfahren und Vorrichtung zur Strom- und Temperaturmessung in einer leistungselektronischen Schaltung Method and apparatus for current and temperature measurement in a power electronic circuit |
| 07/19/2007 | DE102004022884B4 Halbleiterbauteil mit einem Umverdrahtungssubstrat und Verfahren zur Herstellung desselben Of the same semiconductor device with a rewiring substrate and methods for preparing |
| 07/19/2007 | CA2533225A1 A tunable semiconductor component provided with a current barrier |
| 07/18/2007 | EP1809083A2 Multilayer printed circuit board |
| 07/18/2007 | EP1808954A2 IGBT-module |
| 07/18/2007 | EP1808892A2 Microchannel heat sink |
| 07/18/2007 | EP1808891A1 Wafer Level Packaging Cap and Fabrication Method Thereof |
| 07/18/2007 | EP1808701A1 Test contact system |
| 07/18/2007 | EP1808405A2 Integrated package for MEMS die and IC chip |
| 07/18/2007 | EP1808297A2 Semiconductor device, ink tank provided with such semiconductor device, ink jet cartridge, ink jet recording apparatus, method for manufacturing such semiconductor device, and communication system, method for controlling pressure, memory for controlling pressure, memory element, security system of ink jet recording apparatus |
| 07/18/2007 | EP1808296A2 Semiconductor device and ink tank provided with such device |
| 07/18/2007 | EP1808060A1 Immersion cooling apparatus |
| 07/18/2007 | EP1807869A2 Generating an integrated circuit identifier |
| 07/18/2007 | EP1807868A2 Stacked die module |
| 07/18/2007 | EP1766287A4 High power led electro-optic assembly |
| 07/18/2007 | EP1553623B1 Anisotropic conductivity probe |
| 07/18/2007 | CN2925024Y Radiating fins |
| 07/18/2007 | CN2924793Y Dual-source double-grating common-drain power device |
| 07/18/2007 | CN2924792Y Led微型液冷系统 Led miniature liquid cooling system |
| 07/18/2007 | CN2924791Y Radiating device |
| 07/18/2007 | CN2924790Y Threaded element of radiating module for central processor |
| 07/18/2007 | CN2924789Y Threaded element of radiating module for central processor |
| 07/18/2007 | CN1327747C Circuit board assembly and disc coil |
| 07/18/2007 | CN1327523C Power amplifier with base stripe and collector stripe |
| 07/18/2007 | CN1327522C Semiconductor device with unloading circuit for removing defect part |
| 07/18/2007 | CN1327521C Planar hybrid diode rectifier bridge |
| 07/18/2007 | CN1327520C Package substrate with electrostatic discharge protection |
| 07/18/2007 | CN1327519C Device package, a printed wiring board, and an electronic apparatus |
| 07/18/2007 | CN1327518C Sheet for sealing electrical wiring |
| 07/18/2007 | CN1327517C Semiconductor device and method of manufacturing the same |
| 07/18/2007 | CN1327516C Semiconductor device |
| 07/18/2007 | CN1327515C Circuit board and method of manufacturing the same |
| 07/18/2007 | CN1327514C Wiring substrate and method of manufacturing the same |
| 07/18/2007 | CN1327513C Packaging baseplate having electrostatic discharge protection |
| 07/18/2007 | CN1327509C Low dielectric semiconductor device and process for fabricating the same |
| 07/18/2007 | CN1327508C Manufacture method for semiconductor device |
| 07/18/2007 | CN1327502C Inspection device and method for manufacturing the same |
| 07/18/2007 | CN1327499C Method for mfg. semiconductor assembly |
| 07/18/2007 | CN1327496C Method for manufacturing semiconductor device with duoble space walls |
| 07/18/2007 | CN1327484C Method of fabricating polycrystalline silicon and switching device using polycrystalline silicon |
| 07/18/2007 | CN1327476C Semiconductor device and its manufacturing method |
| 07/18/2007 | CN1327461C Capacitor with extended surface lands and method of fabrication therefor |
| 07/18/2007 | CN1327460C Coil on a semiconductor substrate and method for its production |
| 07/18/2007 | CN1327284C Display |
| 07/18/2007 | CN1327271C Placode and producing method thereof, placode for electro-optical device, electro-optic device and electronic apparatus |
| 07/18/2007 | CN1327184C Disperseing heat device |
| 07/18/2007 | CN1327183C Pump-free water-cooling system |
| 07/18/2007 | CN1326921C Electroconductive resin composition |