| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/25/2007 | EP1656636B1 Rfid device and method of making |
| 07/25/2007 | EP1388175B1 Optical semiconductor housing with incorporated lens and shielding |
| 07/25/2007 | EP1305824A4 Method of making electronic materials |
| 07/25/2007 | EP1092237B1 Method of severing electrically conductive links with ultraviolet laser output |
| 07/25/2007 | CN2927625Y Fixer of radiator |
| 07/25/2007 | CN2927624Y Finned structure of radiator |
| 07/25/2007 | CN2927620Y 散热器 Heat sink |
| 07/25/2007 | CN2927618Y Radiator and its fixer |
| 07/25/2007 | CN2927324Y Light-emitting diode packing structure |
| 07/25/2007 | CN2927321Y Large-power semiconductor luminescent device |
| 07/25/2007 | CN2927320Y Combined improved structure of transistor |
| 07/25/2007 | CN2927319Y Electric connector for installing LED chip |
| 07/25/2007 | CN1328938C Driving apparatus for high acceleration revolution axis and application method thereof |
| 07/25/2007 | CN1328811C Semiconductor device having fuel cell and its manufacturing method |
| 07/25/2007 | CN1328792C Multiple metal layer SRAM memory used as testing apparatus |
| 07/25/2007 | CN1328790C Mfg method of virtul welding lug structure avoiding generation of capacity |
| 07/25/2007 | CN1328789C Semiconductor device and method of formation |
| 07/25/2007 | CN1328788C Semiconductor device, semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module |
| 07/25/2007 | CN1328787C Bonding wire arrangement structure of semiconductor chip package |
| 07/25/2007 | CN1328786C Temperature controll type heat pipe radiating apparatus |
| 07/25/2007 | CN1328785C Method of manufacturing heat conductive substrate |
| 07/25/2007 | CN1328784C COF flexible printed circuit board and method for making said circuit board |
| 07/25/2007 | CN1328773C Electronic element, method for producing electronic element and electronic apparatus |
| 07/25/2007 | CN1328772C Semiconductor device and semiconductor chip |
| 07/25/2007 | CN1328770C Semiconductor package and method of preparing same |
| 07/25/2007 | CN1328769C COF film carrier tape and its manufacturing method |
| 07/25/2007 | CN1328614C Liquid crystal display device integrated circuit package and glass-base chip type liquid crystal display device |
| 07/25/2007 | CN1327974C Method for edge sealing barrier films |
| 07/25/2007 | CN101006582A Bond pad structure for copper metallization having increased reliability and method for fabricating same |
| 07/25/2007 | CN101006581A Liquid metal thermal interface for an integrated circuit device |
| 07/25/2007 | CN101006578A Wafer with improved conductive loops in the dicing lines |
| 07/25/2007 | CN101006576A Integrated low-K hard mask |
| 07/25/2007 | CN101006570A Land grid array packaged device and method of forming same |
| 07/25/2007 | CN101006199A Method of forming film, film forming apparatus and storage medium |
| 07/25/2007 | CN101006194A Film-forming apparatus and film-forming method |
| 07/25/2007 | CN101006135A Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material |
| 07/25/2007 | CN101005753A Microchannel heat sink |
| 07/25/2007 | CN101005751A Heat sink |
| 07/25/2007 | CN101005750A Heat sink |
| 07/25/2007 | CN101005749A Heat sink |
| 07/25/2007 | CN101005748A Heat sink |
| 07/25/2007 | CN101005747A Liquid cooling heat sink and heat exchanger for said liquid cooling heat sink |
| 07/25/2007 | CN101005746A Heat sink |
| 07/25/2007 | CN101005745A Micro jet flow cooling system for electronic device |
| 07/25/2007 | CN101005744A Heat radiation shell and its producing method |
| 07/25/2007 | CN101005735A Alignment plate |
| 07/25/2007 | CN101005734A Alignment plate |
| 07/25/2007 | CN101005729A Interconnect structure for transducer assembly |
| 07/25/2007 | CN101005224A Control device integrated dynamo-electric machine |
| 07/25/2007 | CN101005109A Low height lead frame for LED device and the manufacturing method thereof |
| 07/25/2007 | CN101005108A Power type light emitting diode heat sink and its method |
| 07/25/2007 | CN101005107A Flip-chip light emitting diode with metal convex spot array structure and its producing method |
| 07/25/2007 | CN101005093A Phase change memory device and method for manufacturing phase change memory device |
| 07/25/2007 | CN101005090A Backside illuminated image -sensor, its forming method and package |
| 07/25/2007 | CN101005083A TFT array structure and its producing method |
| 07/25/2007 | CN101005081A Non-volatile memory device, and manufacturing method and programming method thereof |
| 07/25/2007 | CN101005079A 半导体存储器件 A semiconductor memory device |
| 07/25/2007 | CN101005064A Multichip packaging structure and its production method |
| 07/25/2007 | CN101005063A Semiconductor chip package attached electronic device and integrated circuit module having the same |
| 07/25/2007 | CN101005062A Vertically packaged MOSFET and ic power devices as integrated module using 3D interconnected laminates |
| 07/25/2007 | CN101005061A Overlay key, method of forming the overlay key and method of measuring overlay accuracy using the overlay key |
| 07/25/2007 | CN101005060A Interlinking line structure and its forming method |
| 07/25/2007 | CN101005059A Copper metallized barrier layer structure of integrated circuit or semiconductor device and its preparing method |
| 07/25/2007 | CN101005058A Package board having internal terminal interconnection and semiconductor package employing the same |
| 07/25/2007 | CN101005057A Chip packaging structure and its line connection process |
| 07/25/2007 | CN101005056A Electrode structure for use in an integrated circuit |
| 07/25/2007 | CN101005055A Film type semiconductor package, test device and semiconductor device and method thereof |
| 07/25/2007 | CN101005054A Memory module refrigerating body |
| 07/25/2007 | CN101005053A Heat radiation module |
| 07/25/2007 | CN101005052A Semiconductor structure and its forming method |
| 07/25/2007 | CN101005033A Method of adjusting the pressure of a substrate in a semi-conductor material |
| 07/25/2007 | CN101005024A Method of treatment of porous dielectric films to reduce damage during cleaning |
| 07/25/2007 | CN101005018A Article and its ball planting method |
| 07/25/2007 | CN101005017A Method of forming a semiconductor thin film |
| 07/25/2007 | CN101004949A Nand type multi-bit charge storage memory array and methods for operating and fabricating the same |
| 07/25/2007 | CN101004944A 存储卡 Memory Card |
| 07/25/2007 | CN101003690A Heat radiation insulation resin composition and printing circuit board using same |
| 07/25/2007 | CN101003436A Boron nitride spherical powder, and methods of using same |
| 07/25/2007 | CN101002732A Germ-free medicinal compsns. |
| 07/24/2007 | US7249337 Method for optimizing high frequency performance of via structures |
| 07/24/2007 | US7249336 Automatic wiring method for semiconductor integrated circuit, program for the same, and semiconductor integrated circuit |
| 07/24/2007 | US7248529 Semiconductor device having fuse and its manufacture method |
| 07/24/2007 | US7248480 Semiconductor element, manufacturing method thereof, and high frequency integrated circuit using the semiconductor element |
| 07/24/2007 | US7248478 Coolant cooled type semiconductor device |
| 07/24/2007 | US7248477 Fan-shaped heat-dissipating device |
| 07/24/2007 | US7248474 Fool-proof device on heatsink thermal module for the notebook computer |
| 07/24/2007 | US7248461 Conducting polymer composite and solid electrolytic capacitor using the same |
| 07/24/2007 | US7247952 Optical targets |
| 07/24/2007 | US7247951 Chip carrier with oxidation protection layer |
| 07/24/2007 | US7247950 Semiconductor device and method of manufacturing the same |
| 07/24/2007 | US7247949 Semiconductor device with stacked chips |
| 07/24/2007 | US7247948 Semiconductor device and method for fabricating the semiconductor device |
| 07/24/2007 | US7247947 Semiconductor device comprising a plurality of semiconductor constructs |
| 07/24/2007 | US7247946 On-chip Cu interconnection using 1 to 5 nm thick metal cap |
| 07/24/2007 | US7247945 Semiconductor apparatus |
| 07/24/2007 | US7247944 Connector assembly |
| 07/24/2007 | US7247943 Integrated circuit with at least one bump |
| 07/24/2007 | US7247942 Techniques for joining an opto-electronic module to a semiconductor package |
| 07/24/2007 | US7247941 Printed circuit board assembly with strain-alleviating structures |
| 07/24/2007 | US7247939 Metal filled semiconductor features with improved structural stability |