| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/26/2007 | US20070171761 Methods and Tangible Objects Employing Machine Readable Data |
| 07/26/2007 | US20070171076 Low-frequency radio tag encapsulating system |
| 07/26/2007 | US20070170603 Hybrid mounted device and method of manufacturing the same |
| 07/26/2007 | US20070170602 Mold flash removal process for electronic devices |
| 07/26/2007 | US20070170601 Semiconductor device and manufacturing method of them |
| 07/26/2007 | US20070170599 Flip-attached and underfilled stacked semiconductor devices |
| 07/26/2007 | US20070170598 Flexible circuit board, method for making the same, flexible multi-layer wiring circuit board, and method for making the same |
| 07/26/2007 | US20070170597 Process for producing components |
| 07/26/2007 | US20070170596 Flip-chip light emitting diode with high light-emitting efficiency |
| 07/26/2007 | US20070170595 Semiconductor device components with conductive vias and systems including the components |
| 07/26/2007 | US20070170594 Insulating tube, semiconductor device employing the tube, and method of manufacturing the same |
| 07/26/2007 | US20070170593 Product including conductor made of zinc or zinc aluminum alloy |
| 07/26/2007 | US20070170592 Apparatus for solder crack deflection |
| 07/26/2007 | US20070170591 Semiconductor device and method for fabricating the same |
| 07/26/2007 | US20070170589 Semiconductor integrated circuit |
| 07/26/2007 | US20070170587 Ball grid array |
| 07/26/2007 | US20070170586 Printed circuit board for semiconductor package and method of manufacturing the same |
| 07/26/2007 | US20070170585 Composite integrated device and methods for forming thereof |
| 07/26/2007 | US20070170584 Semiconductor interconnect having adjacent reservoir for bonding and method for formation |
| 07/26/2007 | US20070170583 Multilayer integrated circuit for RF communication and method for assembly thereof |
| 07/26/2007 | US20070170582 Component-containing module and method for producing the same |
| 07/26/2007 | US20070170581 Silicon-diamond composite heat spreader and associated methods |
| 07/26/2007 | US20070170580 Cooling apparatus for memory module |
| 07/26/2007 | US20070170579 Method of manufacturing semiconductor substrate, method of manufacturing semiconductor device, and semiconductor device |
| 07/26/2007 | US20070170578 Semiconductor device, electronic apparatus comprising the same, and method for fabrication of substrate for semiconductor device used therein |
| 07/26/2007 | US20070170577 Semiconductor Device with Surface-Mountable External Contacts and Method for Manufacturing the Same |
| 07/26/2007 | US20070170576 Wafer level stack structure for system-in-package and method thereof |
| 07/26/2007 | US20070170575 Stack chip and stack chip package having the same |
| 07/26/2007 | US20070170574 Buried via technology for three dimensional integrated circuits |
| 07/26/2007 | US20070170573 Semiconductor device, interposer chip and manufacturing method of semiconductor device |
| 07/26/2007 | US20070170572 Multichip stack structure |
| 07/26/2007 | US20070170571 Low profile semiconductor system having a partial-cavity substrate |
| 07/26/2007 | US20070170570 Integrated circuit package system including wide flange leadframe |
| 07/26/2007 | US20070170569 In-line apparatus and method for manufacturing double-sided stacked multi-chip packages |
| 07/26/2007 | US20070170568 Packaging for an interferometric modulator |
| 07/26/2007 | US20070170567 Semiconductor memory card |
| 07/26/2007 | US20070170566 Semiconductor Device and Method of Manufacturing the Same, Circuit Board, and Electronic Instrument |
| 07/26/2007 | US20070170565 RF module, multi RF module including the RF module, and method of manufacturing the RF module |
| 07/26/2007 | US20070170564 Chip card module |
| 07/26/2007 | US20070170563 Light emitting module and process thereof |
| 07/26/2007 | US20070170562 Semiconductor photodetector |
| 07/26/2007 | US20070170561 Leaded package integrated circuit stacking |
| 07/26/2007 | US20070170560 Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires |
| 07/26/2007 | US20070170559 Integrated circuit package system |
| 07/26/2007 | US20070170558 Stacked integrated circuit package system |
| 07/26/2007 | US20070170557 Mold forming method and apparatus, and plastic lens manufacturing method and apparatus |
| 07/26/2007 | US20070170556 Semiconductor device having flange structure |
| 07/26/2007 | US20070170555 Padless die support integrated circuit package system |
| 07/26/2007 | US20070170554 Integrated circuit package system with multiple molding |
| 07/26/2007 | US20070170553 Methods and apparatuses for creating integrated circuit capacitance from gate array structures |
| 07/26/2007 | US20070170552 Ultra thin TCS (SiCl4) cell nitride for DRAM capacitor with DCS (SiH2cl2) interface seeding layer |
| 07/26/2007 | US20070170551 Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material and solutions for forming the coatings |
| 07/26/2007 | US20070170512 Electrostatic discharge protection device and method of fabricating same |
| 07/26/2007 | US20070170511 Method for fabricating a recessed-gate mos transistor device |
| 07/26/2007 | US20070170510 Electrostatic discharge protection circuit and diode thereof |
| 07/26/2007 | US20070170453 Package for mounting an optical element and a method of manufacturing the same |
| 07/26/2007 | US20070170437 Hierarchical Assembly of Interconnects for Molecular Electronics |
| 07/26/2007 | US20070170425 Semiconductor integrated circuit device and test method thereof |
| 07/26/2007 | US20070169962 LED base structure |
| 07/26/2007 | US20070169885 Thermally conductive pressure-sensitive adhesive composition, thermally conductive sheet-form molded foam, and process for producing the same |
| 07/26/2007 | US20070169345 Decreasing thermal contact resistance at a material interface |
| 07/26/2007 | US20070169343 Methods of fabricating substrates including one or more conductive vias |
| 07/26/2007 | DE202007006731U1 Wärmeableitende Vorrichtung zur Wärmeableitung einer elektronischen Komponente Heat-dissipating device to dissipate heat of an electronic component |
| 07/26/2007 | DE202007005837U1 Kühlkörper mit mehreren sequentiell durchflossenen Kühlzonen Heatsink with several sequentially through which cooling zones |
| 07/26/2007 | DE112005001736T5 A method of manufacturing a plurality of electronic assembles A method of manufacturing a Plurality of electronic assembles |
| 07/26/2007 | DE102007001455A1 Elektronisches Bauelement und Verfahren für dessen Montage Electronic device and method for its assembly |
| 07/26/2007 | DE102006060768A1 Gehäusegruppe für Geräte hoher Leistungsdichte Housing group for supplies, high power density |
| 07/26/2007 | DE102006058347A1 Aufbau eines Leistungsmoduls und dieses verwendendes Halbleiterrelais Construction of a power module and this-use solid-state relays |
| 07/26/2007 | DE102006023088A1 Power semiconductor component has power semiconductor chip arranged on region of flat conductor frame planned as chip pads, power semiconductor chip is connected with chip pad by plumb bob layer |
| 07/26/2007 | DE102006003376A1 Memory module has main face of printed board, which is arranged on semiconductor components, where printed board has line, which reaches up to input connections from conductive strip, at some of semiconductor components |
| 07/26/2007 | DE102006002090A1 Memory module radiator box for use in fully buffered dual inline memory module to remove heat produced in memory module, has even metal plate, at which memory module is provided, where metal plate at the outer edge has reinforcing element |
| 07/26/2007 | DE102006001885A1 Accurate fixing microcomponents such as ionizing radiation detectors onto carriers (e.g. in tomographic devices) involves use of a melt adhesive |
| 07/26/2007 | DE102006001792A1 Semiconductor module, has semiconductor chip stack arranged on wiring substrate, where heat conducting layer e.g. foil with anisotropic heat conducting particles is arranged between semiconductor chips |
| 07/26/2007 | DE102006001767A1 Halbleitermodul mit Halbleiterchips und Verfahren zur Herstellung desselben The same semiconductor module with a semiconductor chip and method for producing |
| 07/26/2007 | DE102005002707B4 Verfahren zur Herstellung elektrischer Verbindungen in einem Halbleiterbauteil mittels koaxialer Mikroverbindungselemente A method of making electrical connections in a semiconductor device by means of micro-coaxial connectors |
| 07/26/2007 | DE102004062392B4 Verfahren zum Bilden einer Metallverdrahtung einer Halbleitervorrichtung A method of forming a metal wiring of a semiconductor device |
| 07/26/2007 | DE102004055955B4 Anordnung zum Kontaktieren einer in einem Gehäuse integrierten Schaltung Arrangement for contacting an integrated circuit contained in a housing |
| 07/26/2007 | DE10142119B4 Elektronisches Bauteil und Verfahren zu seiner Herstellung Electronic component and method for its preparation |
| 07/26/2007 | CA2637414A1 Miniaturized high conductivity thermal/electrical switch |
| 07/25/2007 | EP1811824A1 Multilayer printed wiring board and process for producing the same |
| 07/25/2007 | EP1811572A2 Semiconductor device and power converter using the same |
| 07/25/2007 | EP1811566A2 Three-dimensional Multi-Chips and tri-axial sensors and methods of manufacuring the same |
| 07/25/2007 | EP1811565A2 Method for embedding dies |
| 07/25/2007 | EP1811564A1 Electrical fuse device based on a phase-change memory element and corresponding programming method |
| 07/25/2007 | EP1811563A2 Ball grid array |
| 07/25/2007 | EP1811557A2 Semiconductor apparatus manufacturing method |
| 07/25/2007 | EP1811555A1 Au ALLOY BONDING WIRE |
| 07/25/2007 | EP1811554A2 Foamable underfill encapsulant |
| 07/25/2007 | EP1811257A1 Electroosmotic pump apparatus |
| 07/25/2007 | EP1810557A2 Liquid cold plate heat exchanger |
| 07/25/2007 | EP1810347A1 Photovoltaic solar energy module |
| 07/25/2007 | EP1810338A2 Solderable top metal for sic device |
| 07/25/2007 | EP1810332A2 Nanotube-based circuit connection approach |
| 07/25/2007 | EP1810331A1 Nanotube-based fluid interface material and approach |
| 07/25/2007 | EP1810330A2 Refractory metal substrate with improved thermal conductivity |
| 07/25/2007 | EP1810329A2 Integrated circuit nanotube-based substrate |
| 07/25/2007 | EP1810328A1 Machinable metallic composites |
| 07/25/2007 | EP1810327A2 Electronic circuit device |
| 07/25/2007 | EP1810324A1 Carbon nanotube-based filler for integrated circuits |
| 07/25/2007 | EP1809780A2 Iron-nickel alloy strip for the manufacture of support grids for integrated circuits |