| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/01/2007 | CN101009277A Integrated static release protection circuit of the RF signals in the CMOS technology |
| 08/01/2007 | CN101009276A RF signal integration static release protection circuit realized by the inductor |
| 08/01/2007 | CN101009275A Organic light-emitting display device and method for fabricating the same |
| 08/01/2007 | CN101009274A Oganic light-emitting display device and method for fabricating the same |
| 08/01/2007 | CN101009273A Integration encapsulation structure of cantilever stack system and its encapsulation method |
| 08/01/2007 | CN101009272A Cooling apparatus for memory module |
| 08/01/2007 | CN101009270A Semiconductor device, electronic apparatus comprising the same, and method for fabrication of substrate for semiconductor device used therein |
| 08/01/2007 | CN101009269A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 08/01/2007 | CN101009268A Base board and its electric test method |
| 08/01/2007 | CN101009267A Semiconductor device having self-aligned contact and method of fabricating the same |
| 08/01/2007 | CN101009266A Semiconductor structure and its forming method |
| 08/01/2007 | CN101009265A Semiconductor device and method for fabricating the same |
| 08/01/2007 | CN101009264A Wiring board and semiconductor apparatus |
| 08/01/2007 | CN101009263A Printed circuit board for semiconductor package and method of manufacturing the same |
| 08/01/2007 | CN101009262A Manufacturing method for magnetic sensor and lead frame therefor |
| 08/01/2007 | CN101009261A Method of the encapsulation vertical surface-mount module and base sheet, horse and vertical surface-mount module |
| 08/01/2007 | CN101009260A Semiconductor encapsulation structure and its making method |
| 08/01/2007 | CN101009259A Semiconductor encapsulation structure and its making method |
| 08/01/2007 | CN101009258A Semiconductor device |
| 08/01/2007 | CN101009257A 半导体装置 Semiconductor device |
| 08/01/2007 | CN101009256A 半导体装置 Semiconductor device |
| 08/01/2007 | CN101009255A 半导体装置 Semiconductor device |
| 08/01/2007 | CN101009254A Heat radiator for wafer encapsulation and its making method |
| 08/01/2007 | CN101009253A Radiating fin and cooling device |
| 08/01/2007 | CN101009251A Thin film transistor substrate and method for manufacturing the same and liquid crystal display having the same |
| 08/01/2007 | CN101009250A Thin film transistor array panel and method of manufacturing the same |
| 08/01/2007 | CN101009247A Multilevel semiconductor device and method of manufacturing the same |
| 08/01/2007 | CN101009241A Wiring manufacturing method and circuit board manufacturing method |
| 08/01/2007 | CN101009229A Semiconductor device and its making method |
| 08/01/2007 | CN101009205A Porous substrate with smooth surface and production method thereof |
| 08/01/2007 | CN101009203A A method of fabricating a composite substrate |
| 08/01/2007 | CN101008990A 半导体存储卡 The semiconductor memory card |
| 08/01/2007 | CN101008989A Flash memory packaging method and structure thereof |
| 08/01/2007 | CN101008656A Acceleration sensor and method of manufacturing acceleration sensor |
| 08/01/2007 | CN101008655A Acceleration sensor and method of manufacturing acceleration sensor |
| 08/01/2007 | CN101007935A Foamable underfill encapsulant |
| 08/01/2007 | CN101007365A Joining method, method of mounting semiconductor package, and substrate-joining structure |
| 07/31/2007 | US7251137 Electronic component cooling apparatus |
| 07/31/2007 | US7251010 Semiconductor chip and display device using the same |
| 07/31/2007 | US7250827 Circuitry module |
| 07/31/2007 | US7250774 Fingerprint sensor |
| 07/31/2007 | US7250760 Magnetic sensor |
| 07/31/2007 | US7250712 Polymer sustained microelectrodes |
| 07/31/2007 | US7250687 Systems for degating packaged semiconductor devices with tape substrates |
| 07/31/2007 | US7250686 Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded |
| 07/31/2007 | US7250685 Etched leadframe flipchip package system |
| 07/31/2007 | US7250684 Circular wire-bond pad, package made therewith, and method of assembling same |
| 07/31/2007 | US7250683 Method to solve via poisoning for porous low-k dielectric |
| 07/31/2007 | US7250682 Semiconductor integrated circuit device |
| 07/31/2007 | US7250681 Semiconductor device and a method of manufacturing the semiconductor device |
| 07/31/2007 | US7250680 Semiconductor circuitry constructions |
| 07/31/2007 | US7250679 Semiconductor device and method for fabricating the same |
| 07/31/2007 | US7250678 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same |
| 07/31/2007 | US7250676 Multi-package module with heat spreader |
| 07/31/2007 | US7250675 Method and apparatus for forming stacked die and substrate structures for increased packing density |
| 07/31/2007 | US7250674 Coolant cooled type semiconductor device |
| 07/31/2007 | US7250673 Signal isolation in a package substrate |
| 07/31/2007 | US7250672 Dual semiconductor die package with reverse lead form |
| 07/31/2007 | US7250671 Lead frame and method for manufacturing semiconductor package with the same |
| 07/31/2007 | US7250670 Semiconductor structure and fabricating method thereof |
| 07/31/2007 | US7250664 Integrated circuit device packaging structure and packaging method |
| 07/31/2007 | US7250663 Frame scale package using contact lines through the elements |
| 07/31/2007 | US7250660 ESD protection that supports LVDS and OCT |
| 07/31/2007 | US7250659 Semiconductor component with ESD protection |
| 07/31/2007 | US7250626 Probe testing structure |
| 07/31/2007 | US7250372 Method for BARC over-etch time adjust with real-time process feedback |
| 07/31/2007 | US7250363 Aligned dummy metal fill and hole shapes |
| 07/31/2007 | US7250362 Solder bump structure and method for forming the same |
| 07/31/2007 | US7250361 Method for forming a bonding pad of a semiconductor device including a plasma treatment |
| 07/31/2007 | US7250355 Multilayered circuit substrate, semiconductor device and method of producing same |
| 07/31/2007 | US7250330 Method of making an electronic package |
| 07/31/2007 | US7250329 Method of fabricating a built-in chip type substrate |
| 07/31/2007 | US7250328 Microelectronic component assemblies with recessed wire bonds and methods of making same |
| 07/31/2007 | US7250311 Wirebond crack sensor for low-k die |
| 07/31/2007 | US7249627 Cooling device of hybrid-type |
| 07/31/2007 | CA2426562C Thermoelectric spot coolers for rf and microwave communication integrated circuits |
| 07/31/2007 | CA2304576C A laminate comprising a thin borosilicate glass substrate as a constituting layer |
| 07/26/2007 | WO2007084070A1 Miniaturized high conductivity thermal/electrical switch |
| 07/26/2007 | WO2007083976A1 Semiconductor package for photo-sensing and fabricating method therefore |
| 07/26/2007 | WO2007083801A1 Epoxy resin molding material for sealing and electronic component device |
| 07/26/2007 | WO2007083538A1 Epoxy bleedout-preventing agent |
| 07/26/2007 | WO2007083354A1 Semiconductor device and method for manufacturing same |
| 07/26/2007 | WO2007083351A1 Semiconductor device and method for manufacturing same |
| 07/26/2007 | WO2007082854A1 Semiconductor devices and methods of manufacture thereof |
| 07/26/2007 | WO2007082373A1 A tunable semiconductor component provided with a current barrier |
| 07/26/2007 | WO2007058909A3 Method of controlling nanowire growth and device with controlled-growth nanowire |
| 07/26/2007 | WO2007056013A3 High density three dimensional semiconductor die package |
| 07/26/2007 | WO2007054368A3 Semiconductor device comprising a housing containing a triggering unit |
| 07/26/2007 | WO2007053308A3 Diffusion barrier layer for mems devices |
| 07/26/2007 | WO2007041977A3 Electrical module |
| 07/26/2007 | WO2007016642A3 Dual function composite system and method of making same |
| 07/26/2007 | WO2006035955A8 Curable diamantane compound |
| 07/26/2007 | WO2005111764A3 Lock for notebook computer or other personal electronic device |
| 07/26/2007 | WO2005043584A3 Single mask via method and device |
| 07/26/2007 | US20070173135 Printed wiring board for mounting semiconductor |
| 07/26/2007 | US20070173071 SiCOH dielectric |
| 07/26/2007 | US20070173054 Insulating film forming method capable of enhancing adhesion of silicon carbide film, etc. and semiconductor device |
| 07/26/2007 | US20070172999 Method for manufacturing electronic device using thin film transistor with protective cap over flexible substrate |
| 07/26/2007 | US20070172992 Methods for fabricating stiffeners for flexible substrates |
| 07/26/2007 | US20070172977 Methods for forming alignment marks on semiconductor devices |