| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/30/2007 | US20070200216 Chip stack package |
| 08/30/2007 | US20070200215 Smart card module and substrate for a smart card module |
| 08/30/2007 | US20070200214 Board strip and method of manufacturing semiconductor package using the same |
| 08/30/2007 | US20070200213 Integrated circuit chip and package |
| 08/30/2007 | US20070200212 Image sensor package |
| 08/30/2007 | US20070200211 Multilayer wiring substrate and method of connecting the same |
| 08/30/2007 | US20070200210 Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages |
| 08/30/2007 | US20070200209 Semiconductor device and heat radiation member |
| 08/30/2007 | US20070200208 Variable-tooth gear with sliding-sheet deforming teeth |
| 08/30/2007 | US20070200207 No lead package with heat spreader |
| 08/30/2007 | US20070200206 Multi-row lead frame |
| 08/30/2007 | US20070200205 Integrated circuit package system including die stacking |
| 08/30/2007 | US20070200203 Semiconductor device and method for fabricating the same |
| 08/30/2007 | US20070200195 Semiconductor device and method of manufacturing the same |
| 08/30/2007 | US20070199925 Method Of Manufacturing Sealed Electronic Component And Sealed Electronic Component |
| 08/30/2007 | US20070199689 Lightweight thermal heat transfer apparatus |
| 08/30/2007 | US20070199332 Heat Exchanger |
| 08/30/2007 | DE202007009288U1 Oberflächenmontierbares Leuchtdiodenbauelement mit einer Wärmesenke Surface mount light-emitting device with a heat sink |
| 08/30/2007 | DE19811078B4 Halbleiterbauelement Semiconductor device |
| 08/30/2007 | DE19709764B4 Halbleitervorrichtung mit Elektrode aus Aluminium und feinkörnigem Silizium und ihr Herstellungsverfahren A semiconductor device having electrode of aluminum and fine-grained silicon and their method of preparation |
| 08/30/2007 | DE112005002762T5 Beabstandete, mit Kontakthöckern versehene Komponenten-Struktur Spaced, bumped component structure |
| 08/30/2007 | DE112005002371T5 Unterfüllmaterial zur Verringerung eines BLM-Ablösungs- und Bruchpotentials in Halbleitereinrichtungen Underfill material for reducing a BLM-stripping and breakdown potential in semiconductor devices |
| 08/30/2007 | DE10339770B4 Verfahren zum Herstellen einer FBGA-Anordnung A method for producing a FBGA arrangement |
| 08/30/2007 | DE102007009315A1 Electrical component, e.g. lithium ion battery, cooling device for e.g. hybrid vehicle, has heat sink, and connection provided between guiding bodies and side surface of component and between guiding bodies and heat sink |
| 08/30/2007 | DE102007007178A1 Kapazitive mikrobearbeitete Ultraschalltransducer und Verfahren zur Herstellung derselben Capacitive micromachined ultrasonic transducers and method of producing same |
| 08/30/2007 | DE102007006447A1 Elektronisches Modul und Verfahren zur Herstellung des elektronischen Moduls An electronic module and method for manufacturing the electronic module |
| 08/30/2007 | DE102006009478A1 Flip chip bonding fabricating method for semiconductor component, involves hardening of bumps after applying two-stage adhesive, and applying die with bumps made of hardened adhesive on substrate by contact of bumps with substrate contact |
| 08/30/2007 | DE102006008632A1 Leistungshalbleiterbauteil und Verfahren zu dessen Herstellung Power semiconductor device and process for its preparation |
| 08/30/2007 | DE102006008292A1 Überlastschutz für steuerbare Stromverbraucher Overload protection for controllable current consumer |
| 08/30/2007 | DE102006007303A1 Printed circuit board, has grouting cover element, in which multiple chips connected electrically with printed circuit board, are embedded |
| 08/30/2007 | DE102006005033A1 Semiconductor device arrangement, has temperature measuring arrangement with temperature measuring resistor which is formed over part of semiconductor zone, where evaluation circuit is coupled to temperature measuring resistor |
| 08/30/2007 | DE102005060081B4 Elektronisches Bauteil mit zumindest einer Leiterplatte und mit einer Mehrzahl gleichartiger Halbleiterbausteine und Verfahren Electronic component with at least one circuit board and having a plurality of similar semiconductor devices and methods |
| 08/30/2007 | DE102005058782A1 Kühleinrichtung für Halbleiterbauelemente Cooling device for semiconductor devices |
| 08/30/2007 | DE102005051332B4 Halbleitersubstrat, Halbleiterchip, Halbleiterbauteil und Verfahren zur Herstellung eines Halbleiterbauteils Semiconductor substrate, the semiconductor chip, semiconductor device and method of manufacturing a semiconductor device |
| 08/30/2007 | DE10157443B4 Glas-Keramikzusammensetzung für ein elektronisches Keramikbauteil, Verwendung der Glas-Keramikzusammensetzung für ein elektronisches Keramikbauteil und Vefahren zur Herstellung eines elektronischen Vielschicht-Keramikbauteils Glass-ceramic composition for a ceramic electronic part, use of the glass-ceramic composition for a ceramic electronic component and Vefahren of manufacturing an electronic multilayer ceramic component |
| 08/30/2007 | CA2643110A1 Device for short-circuiting of power semiconductor modules |
| 08/29/2007 | EP1827067A2 Flexible circuit substrate for flip-chip-on-flex applications |
| 08/29/2007 | EP1826817A1 Circuit module |
| 08/29/2007 | EP1826816A1 Semiconductor device, electronic device and fabrication method of the same |
| 08/29/2007 | EP1826231A2 Organohydridosiloxane Resins With High Organic Content |
| 08/29/2007 | EP1826227A1 Thermosetting epoxy resin composition and use thereof |
| 08/29/2007 | EP1826187A1 Glass for semiconductor sealing, sheath tube for semiconductor sealing and semiconductor electronic part |
| 08/29/2007 | EP1825730A1 Heat sink with microchannel cooling for power devices |
| 08/29/2007 | EP1825524A1 Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method |
| 08/29/2007 | EP1825511A1 Semiconductor switching module |
| 08/29/2007 | EP1825510A1 Method for collectively producing a superimposed element microstructure |
| 08/29/2007 | EP1825201A2 Integrated liquid cooling device with immersed electronic components |
| 08/29/2007 | EP1824781A1 Hydrogen getter |
| 08/29/2007 | EP1824779A1 Device and method for hermetically sealing a cavity in an electronic component |
| 08/29/2007 | EP1751795A4 Method for construction of rigid photovoltaic modules |
| 08/29/2007 | EP1694769A4 Dual-stage wafer applied underfills |
| 08/29/2007 | EP1639639B1 Optical sensor array and method for producing the same |
| 08/29/2007 | EP1479274B1 Laminated socket contacts |
| 08/29/2007 | EP1410397A4 Nanotube films and articles |
| 08/29/2007 | EP1409156A4 Methods of nanotube films and articles |
| 08/29/2007 | EP1393357B1 A method for making a metal-insulator-metal capacitor using plate-through mask techniques |
| 08/29/2007 | CN200941730Y Shock-proof mechanism of radiator |
| 08/29/2007 | CN200941729Y Buffer structure of water cooling system |
| 08/29/2007 | CN200941728Y Radiator |
| 08/29/2007 | CN200941727Y Radiator of card-type electronic device |
| 08/29/2007 | CN200941725Y Radiator |
| 08/29/2007 | CN200941724Y Thin-type radiator |
| 08/29/2007 | CN200941723Y Radiator of displaying card |
| 08/29/2007 | CN200941394Y Led |
| 08/29/2007 | CN200941393Y Metal encapsulating structure of superlarge power LED |
| 08/29/2007 | CN200941392Y Encapsulating structure of small power LED |
| 08/29/2007 | CN200941391Y LED radiator |
| 08/29/2007 | CN200941385Y 静电放电装置 Electrostatic discharge device |
| 08/29/2007 | CN200941384Y Improved structure of light receiving diode |
| 08/29/2007 | CN200941383Y LED digital tube reflecting chamber |
| 08/29/2007 | CN200941382Y High heat transferring metal-base copper coated board |
| 08/29/2007 | CN200941381Y Transistor structure of built-in circuits |
| 08/29/2007 | CN101027948A Electronics module and method for manufacturing the same |
| 08/29/2007 | CN101027775A Manufacture of a layer including a component |
| 08/29/2007 | CN101027774A Chip with light protection layer |
| 08/29/2007 | CN101027773A Stacked die module |
| 08/29/2007 | CN101027765A Methods for forming co-planar wafer-scale chip packages |
| 08/29/2007 | CN101027764A Conductor frame for an electronic component and method for the production thereof |
| 08/29/2007 | CN101027597A Process control monitors for interferometric modulators |
| 08/29/2007 | CN101027337A 聚合性组合物 The polymerizable composition |
| 08/29/2007 | CN101027336A Epoxy resin composition, cured product thereof, semiconductor sealing material, new phenolic resin, new epoxy resin, method for producing the new phenolic resin, and method for producing the new epoxy |
| 08/29/2007 | CN101026948A Single-phase ultrahigh heat flow micro-column heat exchanger |
| 08/29/2007 | CN101026946A Loop heat-conducting device |
| 08/29/2007 | CN101026945A Radiating device |
| 08/29/2007 | CN101026944A Radiating device |
| 08/29/2007 | CN101026943A Guided radiating device |
| 08/29/2007 | CN101026926A Radiator fastening device |
| 08/29/2007 | CN101026925A Radiator fastening device |
| 08/29/2007 | CN101026924A Radiator fastening device |
| 08/29/2007 | CN101026216A Lighting device |
| 08/29/2007 | CN101026207A Light-emitting diode package structure and its package method |
| 08/29/2007 | CN101026187A Thin film semiconductor device, and its making process and liquid crystal display |
| 08/29/2007 | CN101026184A Organic electroluminescent display device |
| 08/29/2007 | CN101026183A 显示装置及其制造方法 Display device and manufacturing method |
| 08/29/2007 | CN101026182A Organic light emitting display and method of fabricating the same |
| 08/29/2007 | CN101026178A Heat efficiency reduced minimum phase change memory and its making method |
| 08/29/2007 | CN101026174A Semiconductor device and method for manufacturing same |
| 08/29/2007 | CN101026173A Semiconductor device and method for manufacturing same |
| 08/29/2007 | CN101026172A 半导体器件 Semiconductor devices |
| 08/29/2007 | CN101026168A Dual gate multi-bit semiconductor memory array |