Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2007
08/29/2007CN101026165A 存储器元件及其形成方法 Memory device and method of forming the
08/29/2007CN101026164A 电容器结构 Capacitor structure
08/29/2007CN101026163A 半导体装置以及其制造方法 Semiconductor device and manufacturing method thereof
08/29/2007CN101026158A 半导体装置 Semiconductor device
08/29/2007CN101026156A 半导体器件 Semiconductor devices
08/29/2007CN101026153A Active matrix substrate, electro-optic device and electronic apparatus
08/29/2007CN101026151A Chip package body with built in capacitor structure
08/29/2007CN101026150A Method for packaging organic light emitting display with frit seal and reinforcing structure
08/29/2007CN101026149A Image sensor package structure
08/29/2007CN101026148A Multi-chip build up package structure for optronic chip and its manufacturing method
08/29/2007CN101026147A Semiconductor device with battery
08/29/2007CN101026146A Power semiconductor module and its manufacturing method
08/29/2007CN101026145A Semiconductor packages including transformer or antenna
08/29/2007CN101026144A Radiating type stereo package structure and its manufacturing method
08/29/2007CN101026143A Flexible circuit substrate for flip-chip-on-flex applications
08/29/2007CN101026142A 半导体器件 Semiconductor devices
08/29/2007CN101026141A Coated article package structure with anti-float means
08/29/2007CN101026140A Substrate for forming semiconductor element and manufacturing method of the semiconductor element
08/29/2007CN101026139A 半导体集成电路器件 The semiconductor integrated circuit device
08/29/2007CN101026138A Radiator and package structure
08/29/2007CN101026137A Semiconductor heat-dissipating substrate, and manufacturing method and assembly therefor
08/29/2007CN101026136A Chip package structure and its package process
08/29/2007CN101026135A Radiator with oblique plane fin
08/29/2007CN101026134A Semiconductor device and semiconductor module therewith
08/29/2007CN101026133A Semiconductor package structure with radiating fin and its manufacturing method
08/29/2007CN101026132A Multi-mode radiator comprising cooling chip and its radiating method
08/29/2007CN101026131A Semiconductor device and a manufacturing method thereof
08/29/2007CN101026122A Semiconductor device assembly and methods of manufacturing the same
08/29/2007CN101026120A 半导体器件 Semiconductor devices
08/29/2007CN101026112A Electronic component, semiconductor device, methods of manufacturing the same
08/29/2007CN101026109A Semiconductor device and manufacturing method for the same
08/29/2007CN101026103A Package on package with cavity and method for manufacturing thereof
08/29/2007CN101026102A Stacked chip package using warp-proof insulative material and method of manufacturing the same
08/29/2007CN101026100A Flip chip packaging structure and its forming method
08/29/2007CN101026099A Method for manufacturing a substrate with cavity
08/29/2007CN101024480A Method for forming microelectronic spring structures on a substrate
08/29/2007CN100334742C Isolated high-voltage LDMOS transistor having a split well structure
08/29/2007CN100334729C Semiconductor integrated device and apparatus for designing the same
08/29/2007CN100334728C Semiconductor integrated circuit capable of facilitating layout modification
08/29/2007CN100334727C Resin moulded devices and manufacturing installation therefor
08/29/2007CN100334726C Window opening type multi-chip semiconductor package
08/29/2007CN100334725C Semiconductor device and mfg. method thereof
08/29/2007CN100334724C 半导体集成电路器件 The semiconductor integrated circuit device
08/29/2007CN100334723C 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
08/29/2007CN100334722C Multiple chip integrated light-emitting diode frame
08/29/2007CN100334721C Flip chip type semiconductor package
08/29/2007CN100334720C 连接垫结构 Connection pad structure
08/29/2007CN100334719C Conducting blade
08/29/2007CN100334718C Packaging structure of organic electroluminescent cell and making process thereof
08/29/2007CN100334717C Power electronic power device module
08/29/2007CN100334711C Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices
08/29/2007CN100334709C Semiconductor device and method of manufacturing the same
08/29/2007CN100334705C Power semiconductor module with detector for detecting main circuit current through power semiconductor element
08/29/2007CN100334701C Apparatus and method for wafer attachment
08/29/2007CN100334700C Mold release layer transferring film and laminate film
08/29/2007CN100334253C Wiring repair apparatus
08/29/2007CN100334154C Chain extension for thermal materials
08/28/2007US7263294 Infrared data communication module and method of making the same
08/28/2007US7262975 Multilayer printed wiring board
08/28/2007US7262969 Heat sink clip assembly
08/28/2007US7262966 Heat sink modules for light and thin electronic equipment
08/28/2007US7262680 Compact inductor with stacked via magnetic cores for integrated circuits
08/28/2007US7262676 Electroacoustic component and method for the production thereof
08/28/2007US7262532 Arrangement with an electronically commutated external rotor motor
08/28/2007US7262514 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device
08/28/2007US7262513 Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
08/28/2007US7262512 Surface mount chip package
08/28/2007US7262511 Conductive adhesive agent with ultrafine particles
08/28/2007US7262510 Chip package structure
08/28/2007US7262509 Microelectronic assembly having a perimeter around a MEMS device
08/28/2007US7262508 Integrated circuit incorporating flip chip and wire bonding
08/28/2007US7262507 Semiconductor-mounted device and method for producing same
08/28/2007US7262506 Stacked mass storage flash memory package
08/28/2007US7262505 Selective electroless-plated copper metallization
08/28/2007US7262504 Multiple stage electroless deposition of a metal layer
08/28/2007US7262503 Semiconductor constructions
08/28/2007US7262502 Phase-change random access memory device and method for manufacturing the same
08/28/2007US7262501 Large-area nanoenabled macroelectronic substrates and uses therefor
08/28/2007US7262500 Interconnection structure
08/28/2007US7262499 Semiconductor packages
08/28/2007US7262498 Assembly with a ring and bonding pads formed of a same material on a substrate
08/28/2007US7262497 Bumpless assembly package
08/28/2007US7262496 Wiring base with wiring extending inside and outside of a mounting region
08/28/2007US7262495 3D interconnect with protruding contacts
08/28/2007US7262494 Three-dimensional package
08/28/2007US7262493 System and method for mounting electrical devices
08/28/2007US7262492 Semiconducting device that includes wirebonds
08/28/2007US7262491 Die pad for semiconductor packages and methods of making and using same
08/28/2007US7262490 Semiconductor chip with external connecting terminal
08/28/2007US7262488 Substrate with enhanced properties for planarization
08/28/2007US7262487 Semiconductor devices and other electronic components including porous insulators created from “void” creating materials
08/28/2007US7262480 Semiconductor device, and method and apparatus for manufacturing semiconductor device
08/28/2007US7262479 Layout structure of fuse bank of semiconductor memory device
08/28/2007US7262475 Image sensor device and method of manufacturing same
08/28/2007US7262470 Semiconductor device
08/28/2007US7262469 Semiconductor device and method for manufacturing the same
08/28/2007US7262468 Method and system for reducing charge damage in silicon-on-insulator technology
08/28/2007US7262467 Over charge protection device
08/28/2007US7262455 Nonvolatile semiconductor memory device and nonvolatile semiconductor memory system
08/28/2007US7262441 Laminates for encapsulating devices
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