| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/18/2007 | US7271487 Semiconductor device and method of manufacturing the same |
| 09/18/2007 | US7271486 Retarding agglomeration of Ni monosilicide using Ni alloys |
| 09/18/2007 | US7271485 Systems and methods for distributing I/O in a semiconductor device |
| 09/18/2007 | US7271484 Substrate for producing a soldering connection |
| 09/18/2007 | US7271483 Bump structure of semiconductor package and method for fabricating the same |
| 09/18/2007 | US7271482 Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
| 09/18/2007 | US7271481 Microelectronic component and assembly having leads with offset portions |
| 09/18/2007 | US7271480 Constraint stiffener design |
| 09/18/2007 | US7271479 Flip chip package including a non-planar heat spreader and method of making the same |
| 09/18/2007 | US7271478 Printed circuit board and inkjet head |
| 09/18/2007 | US7271477 Power semiconductor device package |
| 09/18/2007 | US7271476 Wiring substrate for mounting semiconductor components |
| 09/18/2007 | US7271475 Memory card with connecting portions for connection to an adapter |
| 09/18/2007 | US7271474 Method and integrated circuits of module packing |
| 09/18/2007 | US7271473 Semiconductor power transmission device |
| 09/18/2007 | US7271472 Circuit board and method for producing a circuit board |
| 09/18/2007 | US7271471 Metal substrate apparatus, method of manufacturing an IC card module apparatus, and an IC card module apparatus |
| 09/18/2007 | US7271470 Electronic component having at least two semiconductor power devices |
| 09/18/2007 | US7271469 Methods of making integrated circuits |
| 09/18/2007 | US7271468 High-voltage compatible, full-depleted CCD |
| 09/18/2007 | US7271466 Semiconductor device with sidewall wiring |
| 09/18/2007 | US7271465 Integrated circuit with low-loss primary conductor strapped by lossy secondary conductor |
| 09/18/2007 | US7271463 Trench insulation structures including an oxide liner that is thinner along the walls of the trench than along the base |
| 09/18/2007 | US7271461 Stackable optoelectronics chip-to-chip interconnects and method of manufacturing |
| 09/18/2007 | US7271460 Solid-state image sensing device, manufacturing method and attachment method thereof, imaging apparatus and image read unit for imaging apparatus |
| 09/18/2007 | US7271440 Method and apparatus for forming an integrated circuit electrode having a reduced contact area |
| 09/18/2007 | US7271439 Semiconductor device having pad structure for preventing and buffering stress of silicon nitride film |
| 09/18/2007 | US7271426 Semiconductor light emitting device on insulating substrate and its manufacture method |
| 09/18/2007 | US7271421 Light-emitting diode array |
| 09/18/2007 | US7271408 Semiconductor device test patterns and related methods for precisely measuring leakage currents in semiconductor cell transistors |
| 09/18/2007 | US7271232 For forming cured products of high optical transmittance exhibiting little heat-induced yellowing over time and to a semiconductor device of high reliability, encapsulation |
| 09/18/2007 | US7271225 having high flame retardancy; having a structural unit derived from a secondary phosphine preferably at least one selected from 1,4-cyclooctylenephosphine oxide and 1,5-cyclooctylenephosphine oxide |
| 09/18/2007 | US7271219 Curable resin, curable resin material, curable film, and insulator |
| 09/18/2007 | US7271111 Shadow mask deposition of materials using reconfigurable shadow masks |
| 09/18/2007 | US7271097 Method for manufacturing a semiconductor protection element and a semiconductor device |
| 09/18/2007 | US7271093 Low-carbon-doped silicon oxide film and damascene structure using same |
| 09/18/2007 | US7271092 Boron incorporated diffusion barrier material |
| 09/18/2007 | US7271091 Method for forming metal pattern to reduce contact resistivity with interconnection contact |
| 09/18/2007 | US7271090 Guard ring of a combination wafer or singulated die |
| 09/18/2007 | US7271087 Dual damascene interconnection in semiconductor device and method for forming the same |
| 09/18/2007 | US7271084 Reinforced solder bump structure and method for forming a reinforced solder bump |
| 09/18/2007 | US7271076 Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device |
| 09/18/2007 | US7271054 Method of manufacturing a ferroelectric capacitor having RU1-XOX electrode |
| 09/18/2007 | US7271037 Leadframe alteration to direct compound flow into package |
| 09/18/2007 | US7271036 Leadframe alteration to direct compound flow into package |
| 09/18/2007 | US7271035 Manufacturing method for resin sealed semiconductor device |
| 09/18/2007 | US7271034 Semiconductor device with a high thermal dissipation efficiency |
| 09/18/2007 | US7271033 Method for fabricating chip package |
| 09/18/2007 | US7271031 Universal interconnect die |
| 09/18/2007 | US7271030 Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion |
| 09/18/2007 | US7271028 High density electronic interconnection |
| 09/18/2007 | US7271027 Castellation wafer level packaging of integrated circuit chips |
| 09/18/2007 | US7271018 Method of forming a support frame for semiconductor packages |
| 09/18/2007 | US7271013 Semiconductor device having a bond pad and method therefor |
| 09/18/2007 | US7270845 dielectric compositions for forming dielectric layers that can be used as circuitized substrates and particularly those used in multilayered circuit boards, chip carriers, and the like; comprising: a cured epoxy resin material; and a particulate filler |
| 09/18/2007 | US7270760 Method and apparatus for simulating standard test wafers |
| 09/18/2007 | US7270759 Structure with through hole, production method thereof, and liquid discharge head |
| 09/18/2007 | US7270712 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like |
| 09/18/2007 | US7270258 Method of fabrication of semiconductor integrated circuit device |
| 09/18/2007 | US7269898 Method for making an edge intensive antifuse |
| 09/18/2007 | CA2272260C Thin, planar heat spreader |
| 09/13/2007 | WO2007103961A2 Gold-bumped interposer for vertically integrated semiconductor system |
| 09/13/2007 | WO2007103685A2 Rf power transistor device with metal electromigration design and method thereof |
| 09/13/2007 | WO2007103224A2 Structure and method of making lidded chips |
| 09/13/2007 | WO2007103091A2 Assemblies and methods for cooling semiconductor dies |
| 09/13/2007 | WO2007102886A2 Electronic assembly having graded wire bonding |
| 09/13/2007 | WO2007102795A1 Using thin film, thermal batteries to provide security protection for electronic systems |
| 09/13/2007 | WO2007102498A1 Method of ebullient cooling, ebullient cooling apparatus, flow channel structure and application product thereof |
| 09/13/2007 | WO2007102358A1 Electronic device package, module and electronic device |
| 09/13/2007 | WO2007102214A1 Semiconductor device and method for manufacturing the same |
| 09/13/2007 | WO2007102062A2 Method and process of manufacturing robust high temperature solder joints |
| 09/13/2007 | WO2007102042A1 A multi-chip electronic package with reduced stress |
| 09/13/2007 | WO2007101697A1 Clamping device for a cooling body arrangement |
| 09/13/2007 | WO2007101694A2 Device comprising a gas cooler and evaporator for cooling, in particular, electronic components |
| 09/13/2007 | WO2007101693A1 Device for cooling, in particular, electronic components |
| 09/13/2007 | WO2007101364A1 Chip-level integrated radio frequency passive devices, methods of making same, and systems containing same |
| 09/13/2007 | WO2007101320A1 Method and apparatus for cooling semiconductor chips |
| 09/13/2007 | WO2007101282A2 Composite material and method for production thereof |
| 09/13/2007 | WO2007054883A3 Leadframe-based ic-package with supply-reference comb |
| 09/13/2007 | US20070213610 Analyte Monitoring Device and Methods of Use |
| 09/13/2007 | US20070213488 Interlayer insulating film, method for forming the same and polymer compositon |
| 09/13/2007 | US20070213467 Resin Composition and Semiconductor Device Produced By Using the Same |
| 09/13/2007 | US20070212821 Method for manufacturing semiconductor device |
| 09/13/2007 | US20070212819 Silicone Adhesive |
| 09/13/2007 | US20070212815 Sealed three dimensional metal bonded integrated circuits |
| 09/13/2007 | US20070212809 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method |
| 09/13/2007 | US20070212652 Method and system for enhanced lithographic alignment |
| 09/13/2007 | US20070211477 Heat radiating apparatus and optical projection device having the same |
| 09/13/2007 | US20070211434 Heat sink |
| 09/13/2007 | US20070210883 Substrate with Strip Conductors and Production of Strip Conductors on Substrates for Semiconductor Components |
| 09/13/2007 | US20070210460 Substrate processing and alignment |
| 09/13/2007 | US20070210459 Method for edge sealing barrier films |
| 09/13/2007 | US20070210458 Semiconductor device and method for manufacturing semiconductor device |
| 09/13/2007 | US20070210457 Composite bump |
| 09/13/2007 | US20070210456 Multi-chip package |
| 09/13/2007 | US20070210455 Carbon nanotube-modified low-K materials |
| 09/13/2007 | US20070210454 Structure of Metal Interconnect and Fabrication Method Thereof |
| 09/13/2007 | US20070210453 Dummy-fill-structure placement for improved device feature location and access for integrated circuit failure analysis |
| 09/13/2007 | US20070210452 Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board |
| 09/13/2007 | US20070210450 Method of forming a bump and a connector structure having the bump |