Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2007
08/15/2007CN1332444C Semiconductor device and producing method thereof
08/15/2007CN1332443C Leadframe for semiconductor device, method for manufacturing semiconductor device using the same and electronic equipment
08/15/2007CN1332442C Semiconductor device with a pair of radiating fan
08/15/2007CN1332441C Double-cooled semiconductor module
08/15/2007CN1332440C 半导体器件 Semiconductor devices
08/15/2007CN1332435C Solid through hole structure and method
08/15/2007CN1332431C Method for producing semiconductor device
08/15/2007CN1332250C Electro-optical device and projection apparatus
08/15/2007CN101019464A Audio processing device with encapsulated electronic component.
08/15/2007CN101019239A Function element mounting module and manufacturing method thereof
08/15/2007CN101019231A Lead pin for mounting semiconductor and printed wiring board
08/15/2007CN101019230A Heat pipe heat sink
08/15/2007CN101019229A 半导体装置 Semiconductor device
08/15/2007CN101019228A Semiconductor device and its manufacturing method
08/15/2007CN101019227A Electronic-component container and piezoelectric resonator device
08/15/2007CN101019226A Preparation of front contact for surface mounting
08/15/2007CN101019218A Semiconductor cooling system and process for manufacturing the same
08/15/2007CN101019217A Semiconductor device module with flip chip devices on a common lead frame
08/15/2007CN101018473A Mirroring shielding structure
08/15/2007CN101018471A No-noise liquid cooling method
08/15/2007CN101018469A Heat radiator
08/15/2007CN101018468A Making method of phase-varying radiator
08/15/2007CN101018467A Heat radiator
08/15/2007CN101018466A Heat radiator and its making method
08/15/2007CN101018465A 散热器 Heat sink
08/15/2007CN101018464A Heat radiator
08/15/2007CN101018463A Electronic device combination
08/15/2007CN101018462A 热交换模块 Heat exchange module
08/15/2007CN101018448A Combination of heat radiator buckle and heat radiation device
08/15/2007CN101017956A Encapsulation structure and method of the high-speed semiconductor light emission component
08/15/2007CN101017842A Organic el device array
08/15/2007CN101017840A 有机薄膜晶体管阵列板 The organic thin film transistor array panel
08/15/2007CN101017838A Solid imaging pickup device
08/15/2007CN101017835A 薄膜晶体管面板及其制造方法 The thin film transistor panel and manufacturing method
08/15/2007CN101017834A SOI integrated circuit structure and its making method
08/15/2007CN101017832A Thin film transistors substrate, manufacture method therefore and display panel having same
08/15/2007CN101017825A Semiconductor device having vertical channel and method of manufacturing the same
08/15/2007CN101017822A 半导体器件 Semiconductor devices
08/15/2007CN101017821A A static discharge protection circuit
08/15/2007CN101017819A A protection circuit for constructing ESD release channel with the polycrystalline silicon
08/15/2007CN101017818A ESD protection circuit for enlarging the valid circulation area of the static current
08/15/2007CN101017817A UV blocking and crack protecting passivation layer
08/15/2007CN101017816A Design method for on-chip spiral inductor with the wearing metal conductor line width and gap
08/15/2007CN101017810A Semiconductor device, and testing method and device for the same
08/15/2007CN101017809A Dual-pole integrated circuit interconnection structure and its making method
08/15/2007CN101017808A Semiconductor device and method for manufacturing same
08/15/2007CN101017807A Semiconductor device and manufacture method thereof
08/15/2007CN101017806A Package substrate
08/15/2007CN101017805A Semiconductor encapsulation base board
08/15/2007CN101017804A Semiconductor device and manufacturing method for the same
08/15/2007CN101017803A Semiconductor end-electrode structure and its making method
08/15/2007CN101017802A Electrode, electronic component and substrate
08/15/2007CN101017801A Semiconductor device and manufacturing method for the same
08/15/2007CN101017800A Semiconductor device
08/15/2007CN101017797A Light emitting device and manufacturing method thereof
08/15/2007CN101017791A Method of manufacturing semiconductor device
08/15/2007CN101017785A Semiconductor stack structure and its making method
08/15/2007CN101017185A Testing method of capacitance component mounted inside and testing system thereof
08/15/2007CN101016446A Organosilicon electronic encapsulation material
08/15/2007CN101016445A Underfill encapsulant for wafer packaging and method for its application
08/14/2007US7257796 Method of incorporating interconnect systems into an integrated circuit process flow
08/14/2007US7257511 Methods and circuits for measuring the thermal resistance of a packaged IC
08/14/2007US7257281 Method for fabricating thick film alumina structures used in high frequency, low loss applications and a structure resulting therefrom
08/14/2007US7257004 Power delivery system for integrated circuits
08/14/2007US7257002 Heat radiation device for memory module
08/14/2007US7257001 Device and method for fastener-free connection via a heat-shrinkable insert
08/14/2007US7256993 Adjustable heat sink shroud
08/14/2007US7256980 Thin film capacitors on ceramic
08/14/2007US7256976 Electrostatic discharge protective circuit and semiconductor integrated circuit using the same
08/14/2007US7256599 Protection circuit for semiconductor device and semiconductor device including the same
08/14/2007US7256504 Circuit support for a semiconductor chip and component
08/14/2007US7256503 Chip underfill in flip-chip technologies
08/14/2007US7256502 Metal interconnections for semiconductor devices including a buffer layer on a trench sidewall
08/14/2007US7256501 Semiconductor device and manufacturing method of the same
08/14/2007US7256500 Semiconductor device using metal nitride as insulating film
08/14/2007US7256499 Ultra low dielectric constant integrated circuit system
08/14/2007US7256497 Semiconductor device with a barrier layer and a metal layer
08/14/2007US7256496 Semiconductor device having adhesion increasing film to prevent peeling
08/14/2007US7256495 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
08/14/2007US7256494 Chip package
08/14/2007US7256493 Ball grid array housing having a cooling foil
08/14/2007US7256492 Heat sink and display panel including heat sink
08/14/2007US7256491 Thermal interconnect systems methods of production and uses thereof
08/14/2007US7256490 Test carrier for semiconductor components having conductors defined by grooves
08/14/2007US7256489 Semiconductor apparatus
08/14/2007US7256488 Semiconductor package with crossing conductor assembly and method of manufacture
08/14/2007US7256486 Packaging device for semiconductor die, semiconductor device incorporating same and method of making same
08/14/2007US7256485 Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip
08/14/2007US7256484 Memory expansion and chip scale stacking system and method
08/14/2007US7256483 Package-integrated thin film LED
08/14/2007US7256482 Integrated circuit chip packaging assembly
08/14/2007US7256481 Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices
08/14/2007US7256480 Lead frame package structure with high density of lead pins arrangement
08/14/2007US7256479 Method to manufacture a universal footprint for a package with exposed chip
08/14/2007US7256478 Notched compound semiconductor wafer
08/14/2007US7256477 Notched compound semiconductor wafer
08/14/2007US7256476 Notched compound semiconductor wafer
08/14/2007US7256475 On-chip test circuit for assessing chip integrity
08/14/2007US7256474 Semiconductor device having a guard ring
08/14/2007US7256466 Nanosensors
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