Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2007
09/19/2007CN200950715Y Radiating assembly
09/19/2007CN200950713Y Combined radiating fin
09/19/2007CN200950712Y Combined radiating fin
09/19/2007CN200950694Y ESD protective circuit of integrated chip and television set having the same
09/19/2007CN200950444Y Luminous dipolar body package structure
09/19/2007CN200950438Y Wiring box for solar cell assembly
09/19/2007CN200950437Y Combination type two-sided fin heat-pipe radiator for frequency transformer
09/19/2007CN101040386A Semiconductor device and its manufacturing method
09/19/2007CN101040383A Light-receiving device
09/19/2007CN101040379A Feeding apparatus and feeding method for semiconductor lead frame
09/19/2007CN101040378A Magnetic attachment method for led light engines
09/19/2007CN101040376A Manufacturing method for semiconductor chips
09/19/2007CN101040375A Long-term heat-treated integrated circuit arrangements and methods for producing the same
09/19/2007CN101040162A Vapor chamber with boiling-enhanced multi-wick structure
09/19/2007CN101039984A 环氧树脂组合物及半导体装置 Epoxy resin composition and a semiconductor device
09/19/2007CN101039571A Heat radiator and base holder thereof
09/19/2007CN101039569A Heat radiation model set
09/19/2007CN101039568A Heat radiator
09/19/2007CN101039566A Heat abstractor and electronic device using the same
09/19/2007CN101039565A Heat abstractor
09/19/2007CN101039564A 散热器固定装置 Sink fixtures
09/19/2007CN101039552A Substrate with embedded element and manufacturing method thereof
09/19/2007CN101039551A Substrate with embedded element and manufacturing method thereof
09/19/2007CN101039027A Improved electrostatic discharge protecting circuit
09/19/2007CN101038945A Package structure for solid light-emitting element and method for manufacturing same
09/19/2007CN101038931A Organic electroluminescent device and electronic apparatus
09/19/2007CN101038930A Electroluminescence device, manufacturing method thereof, and electronic apparatus
09/19/2007CN101038928A Solid-state imaging device and method for manufacturing thereof
09/19/2007CN101038925A Thin film transistor plate and method for fabricating the same
09/19/2007CN101038924A Semiconductor storage device and method of manufacturing same
09/19/2007CN101038915A Pixel structure and forming method thereof
09/19/2007CN101038913A 半导体集成电路器件 The semiconductor integrated circuit device
09/19/2007CN101038912A Semiconductor device having function of improved electrostatic discharge protection
09/19/2007CN101038910A Organic light emitting display (oled)
09/19/2007CN101038909A Electronic subassembly, electronic assembly, and method for producing an electronic assembly
09/19/2007CN101038908A Stack package utilizing through vias and re-distribution lines
09/19/2007CN101038907A Method for forming interconnect structure and the formed interconnect structure
09/19/2007CN101038906A Interlayer connecting line structure of three-dimensional storage and method for making the same
09/19/2007CN101038905A Interconnect structure with a barrier-redundancy feature
09/19/2007CN101038904A Semiconductor device and method for manufacturing same
09/19/2007CN101038903A Package structure for electronic element
09/19/2007CN101038902A 半导体芯片组合件 Semiconductor chip assembly
09/19/2007CN101038901A Hot pipe structure having guiding groove section and heat radiation module
09/19/2007CN101038900A Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device
09/19/2007CN101038899A Heat sink mounting device and mounting method, and server blade using the same
09/19/2007CN101038898A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
09/19/2007CN101038897A Electronic device
09/19/2007CN101038896A A package for solid-state image sensing apparatus and a solid image sensing apparatus
09/19/2007CN101038895A Gallium nitride substrate and methods for testing and manufacturing it
09/19/2007CN101038893A Methods for making a nonvolatile memory device comprising a shunt silicon layer
09/19/2007CN101038887A Method for manufacturing substrate of embedded element
09/19/2007CN101038886A Method for manufacturing substrate of embedded element
09/19/2007CN101038885A Method for manufacturing substrate of embedded element
09/19/2007CN101038882A Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device
09/19/2007CN101038871A Surface treatment method of compound semiconductor substrate and fabrication method of compound semiconductor
09/19/2007CN101038795A Conductive paste and heat diffusion material
09/19/2007CN101037186A MEMS automatic leading interlinking equipment based on zoom microscope location
09/19/2007CN100338984C Heat radiating apparatus
09/19/2007CN100338982C Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery
09/19/2007CN100338980C Printed circuit substrate integrated overload protector
09/19/2007CN100338817C Substrate having microstrip line structure, semiconductor device having microstrip line structure, and manufacturing method of substrate having microstrip line structure
09/19/2007CN100338772C Prossure fixing mechanism of series thyristor valve set
09/19/2007CN100338771C Semiconductor device
09/19/2007CN100338770C Electrostatic discharge protecting circuit
09/19/2007CN100338769C Electrostatic discharge protector adapted for overhigh or overlow input voltage threshold
09/19/2007CN100338768C Lead frame and method for producing semiconductor device using said lead frame
09/19/2007CN100338767C Heat pipe radiating unit and manufacturing method thereof
09/19/2007CN100338766C Method for producing radiating device
09/19/2007CN100338765C Heat sink and method for making same
09/19/2007CN100338764C Cooling device with fan equiped at side surface
09/19/2007CN100338763C Semiconductor module and mfg. method thereof
09/19/2007CN100338760C Semiconductor integrated circuit, method for designing semiconductor integrated circuit and system for designing semiconductor integrated circuit
09/19/2007CN100338756C Method for fabricating semiconductor device
09/19/2007CN100338755C Method of preventing bridge between polycrystalline micro-scale features
09/19/2007CN100338751C 半导体装置 Semiconductor device
09/19/2007CN100338749C Method of manufacturing an electronic device, and electronic device
09/19/2007CN100338743C Semiconductor device and mfg. method thereof
09/19/2007CN100338738C Installation structure and method of electronic device, photoelectric device and electronic apparatus
09/19/2007CN100338731C Processing method and method for making semiconductor device
09/19/2007CN100338691C Cu-Ni-Si-Mg series copper alloy strip
09/19/2007CN100338690C Interface materials and methods of production and use thereof
09/19/2007CN100338141C Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product
09/19/2007CN100338139C Thermally vanishing material, transfer sheet using the same, and method for forming pattern
09/19/2007CN100337782C Joining material and joining method
09/18/2007US7272810 Semiconductor integrated circuit having multi-level interconnection, CAD method and CAD tool for designing the semiconductor integrated circuit
09/18/2007US7272067 Electrically-programmable integrated circuit antifuses
09/18/2007US7271906 Image processing alignment method and method of manufacturing semiconductor device
09/18/2007US7271693 On-chip inductor with magnetic core
09/18/2007US7271499 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
09/18/2007US7271498 Bump electrodes having multiple under ball metallurgy (UBM) layers
09/18/2007US7271497 Dual metal stud bumping for flip chip applications
09/18/2007US7271496 Integrated circuit package-in-package system
09/18/2007US7271495 Chip bond layout for chip carrier for flip chip applications
09/18/2007US7271494 Adhesion by plasma conditioning of semiconductor chip surfaces
09/18/2007US7271493 Semiconductor package free of substrate and fabrication method thereof
09/18/2007US7271492 Photo mask set for forming multi-layered interconnection lines and semiconductor device fabricated using the same
09/18/2007US7271491 Carrier for wafer-scale package and wafer-scale package including the carrier
09/18/2007US7271490 Semiconductor device having dummy wiring layers and a method for manufacturing the same
09/18/2007US7271489 Post passivation interconnection schemes on top of the IC chips
09/18/2007US7271488 Semiconductor integrated circuit
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